NL190321C - Werkwijze voor de inbouw van ic-bouwsteen in identificatiekaarten en onder toepassing van deze werkwijze verkregen identificatiekaarten. - Google Patents
Werkwijze voor de inbouw van ic-bouwsteen in identificatiekaarten en onder toepassing van deze werkwijze verkregen identificatiekaarten.Info
- Publication number
- NL190321C NL190321C NLAANVRAGE8202056,A NL8202056A NL190321C NL 190321 C NL190321 C NL 190321C NL 8202056 A NL8202056 A NL 8202056A NL 190321 C NL190321 C NL 190321C
- Authority
- NL
- Netherlands
- Prior art keywords
- cards
- building
- block
- application
- identification
- Prior art date
Links
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/20—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof characterised by a particular use or purpose
- B42D25/22—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof characterised by a particular use or purpose for use in combination with accessories specially adapted for information-bearing cards
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/45—Associating two or more layers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/45—Associating two or more layers
- B42D25/46—Associating two or more layers using pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/45—Associating two or more layers
- B42D25/465—Associating two or more layers using chemicals or adhesives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- B42D2033/30—
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- B42D2033/46—
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/45—Associating two or more layers
- B42D25/465—Associating two or more layers using chemicals or adhesives
- B42D25/47—Associating two or more layers using chemicals or adhesives using adhesives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01052—Tellurium [Te]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S283/00—Printed matter
- Y10S283/904—Credit card
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1082—Partial cutting bonded sandwich [e.g., grooving or incising]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1961—Severing delaminating means [e.g., chisel, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Credit Cards Or The Like (AREA)
- Financial Or Insurance-Related Operations Such As Payment And Settlement (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19813122981 DE3122981A1 (de) | 1981-06-10 | 1981-06-10 | Verfahren zum einbau von ic-bausteinen in ausweiskarten |
DE3122981 | 1981-06-10 |
Publications (3)
Publication Number | Publication Date |
---|---|
NL8202056A NL8202056A (nl) | 1983-01-03 |
NL190321B NL190321B (nl) | 1993-08-16 |
NL190321C true NL190321C (nl) | 1994-01-17 |
Family
ID=6134347
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NLAANVRAGE8202056,A NL190321C (nl) | 1981-06-10 | 1982-05-19 | Werkwijze voor de inbouw van ic-bouwsteen in identificatiekaarten en onder toepassing van deze werkwijze verkregen identificatiekaarten. |
Country Status (10)
Country | Link |
---|---|
US (1) | US4457798A (de) |
JP (1) | JPS57210494A (de) |
BE (1) | BE893454A (de) |
CH (1) | CH655907A5 (de) |
DE (1) | DE3122981A1 (de) |
FR (1) | FR2507800B1 (de) |
GB (1) | GB2100669B (de) |
IT (1) | IT1151612B (de) |
NL (1) | NL190321C (de) |
SE (1) | SE456544B (de) |
Families Citing this family (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3313414A1 (de) * | 1983-04-13 | 1984-10-18 | Hubert 8958 Füssen Schweiger | Verwendung eines programmierbaren, in einen ausweis integrierten festwertspeicherbausteines zur speicherung von informationen fuer mikroprozessor gesteuertes lesegeraet |
FR2548409B1 (fr) * | 1983-06-29 | 1985-11-15 | Sligos | Procede pour la fabrication de cartes a memoire, installation et cartes a memoire obtenues |
DE3420051A1 (de) * | 1984-05-29 | 1985-12-05 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Datentraeger mit ic-baustein und verfahren zur herstellung eines derartigen datentraegers |
US5203078A (en) * | 1985-07-17 | 1993-04-20 | Ibiden Co., Ltd. | Printed wiring board for IC cards |
JPS62201296A (ja) * | 1986-02-28 | 1987-09-04 | 松下電器産業株式会社 | Icカ−ドおよびその製造方法 |
JPS62201295A (ja) * | 1986-02-28 | 1987-09-04 | 松下電器産業株式会社 | Icカ−ドおよびその製造方法 |
JPS62214998A (ja) * | 1986-03-17 | 1987-09-21 | 三菱電機株式会社 | 薄型半導体カ−ド |
JPS62218196A (ja) * | 1986-03-20 | 1987-09-25 | 日立マクセル株式会社 | Icカ−ド |
JPS63120690A (ja) * | 1986-11-10 | 1988-05-25 | 共同印刷株式会社 | Icカ−ド |
JPH0696357B2 (ja) * | 1986-12-11 | 1994-11-30 | 三菱電機株式会社 | Icカードの製造方法 |
JP2562476B2 (ja) * | 1987-06-11 | 1996-12-11 | 大日本印刷株式会社 | 1cカードの製造方法 |
US4957579A (en) * | 1987-07-27 | 1990-09-18 | Knowlton Glenn C | Method and apparatus for applying liquid acid to a surface |
JPH0755591B2 (ja) * | 1987-11-25 | 1995-06-14 | 大日本印刷株式会社 | Icカード |
JPH01173397A (ja) * | 1987-12-28 | 1989-07-10 | Ricoh Co Ltd | 強誘電性高分子光記録媒体の製造方法 |
EP0370114B1 (de) * | 1988-04-20 | 1995-08-02 | Matsushita Electric Industrial Co., Ltd. | Halbleiterkarte und verfahren zur herstellung |
US5208450A (en) * | 1988-04-20 | 1993-05-04 | Matsushita Electric Industrial Co., Ltd. | IC card and a method for the manufacture of the same |
EP0417887B1 (de) * | 1989-09-09 | 1995-06-14 | Mitsubishi Denki Kabushiki Kaisha | Integrierte Schaltungskarte |
DE3941070A1 (de) * | 1989-12-08 | 1991-06-13 | Dirk Lehnartz | Informations- und werbetraeger, insbesondere praesentations- und / oder geschaeftskarte |
FR2662000A1 (fr) * | 1990-05-11 | 1991-11-15 | Philips Composants | Carte a microcircuit. |
DE4038126C2 (de) * | 1990-11-27 | 1993-12-16 | Mannesmann Ag | Verfahren und Vorrichtung zur Herstellung einer dekorierten Chip-Karte |
DE4122049A1 (de) * | 1991-07-03 | 1993-01-07 | Gao Ges Automation Org | Verfahren zum einbau eines traegerelements |
DE4132720A1 (de) * | 1991-10-01 | 1993-04-08 | Gao Ges Automation Org | Chipkarte und verfahren zur herstellung derselben |
JPH0613707U (ja) * | 1992-07-29 | 1994-02-22 | 紀伊産業株式会社 | レフィル容器 |
DE69317180T2 (de) * | 1992-08-28 | 1998-10-08 | Citizen Watch Co Ltd | Verfahren zur Herstellung von IC-Karten |
DE4241482A1 (de) * | 1992-12-09 | 1994-06-16 | Siemens Ag | Verfahren und Einrichtung zur Herstellung von IC-Karten |
ZA941671B (en) * | 1993-03-11 | 1994-10-12 | Csir | Attaching an electronic circuit to a substrate. |
US5581065A (en) | 1993-08-02 | 1996-12-03 | Dai Nippon Printing Co., Ltd. | Sheet-framed IC carrier, method for producing the same, and IC carrier case |
JPH07101188A (ja) * | 1993-10-05 | 1995-04-18 | Canon Inc | 複合カード |
DE4344297A1 (de) * | 1993-12-23 | 1995-06-29 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung von Ausweiskarten |
DE19518901A1 (de) * | 1995-05-26 | 1996-11-28 | Leitz Louis Kg | Vorrichtung zum Entwerten von Chipkarten |
US5817207A (en) | 1995-10-17 | 1998-10-06 | Leighton; Keith R. | Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards |
DE19634473C2 (de) * | 1996-07-11 | 2003-06-26 | David Finn | Verfahren zur Herstellung einer Chipkarte |
EP0858050A3 (de) * | 1997-02-07 | 2001-03-28 | Keylink Gestao e Investimentos Lda | Verfahren zum kontinuierlichen Herstellen von Microchipträgerkarten und sowie mit diesem Verfahren hergestellte Karten |
DE19719271A1 (de) * | 1997-05-07 | 1998-11-12 | Melzer Maschinenbau Gmbh | Verfahren zum Herstellen von Kunststoffkarten |
DE19854986A1 (de) * | 1998-11-27 | 2000-05-31 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung ein- oder mehrschichtiger Karten mit in geschäumtem Kunststoff eingebetteten elektronischen Bauelementen |
DE19921230B4 (de) * | 1999-05-07 | 2009-04-02 | Giesecke & Devrient Gmbh | Verfahren zum Handhaben von gedünnten Chips zum Einbringen in Chipkarten |
EP1211634B1 (de) * | 2000-12-04 | 2015-03-18 | Yupo Corporation | Transponder und Etikett mit einem solchen Transponder |
KR20020059163A (ko) * | 2001-01-03 | 2002-07-12 | 배정두 | 알루미늄을 이용한 무선 주파수 식별카드 제조방법 |
DE10111683C1 (de) * | 2001-03-09 | 2002-11-21 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung eines Datenträgerkörpers |
US7317310B2 (en) * | 2001-09-11 | 2008-01-08 | Intel Corporation | Embedded PCB identification |
DE10232570A1 (de) * | 2002-07-18 | 2004-03-04 | Agfa-Gevaert Ag | Identitätskarte |
DE10232568A1 (de) * | 2002-07-18 | 2004-01-29 | Agfa-Gevaert Ag | Identitätskarte |
DE10232569A1 (de) * | 2002-07-18 | 2004-02-05 | Agfa-Gevaert Ag | Identitätskarte |
MY148205A (en) * | 2003-05-13 | 2013-03-15 | Nagraid Sa | Process for assembling an electronic component on a substrate |
JP2005014302A (ja) * | 2003-06-24 | 2005-01-20 | Sony Corp | 合成樹脂カード及びその製造方法 |
EP1911599A1 (de) * | 2006-10-11 | 2008-04-16 | Setec Oy | Verfahren zur Herstellung eines Datenträgers und damit hergestellter Datenträger |
DE102007016779B4 (de) * | 2007-04-04 | 2015-03-19 | Bundesdruckerei Gmbh | Verfahren zur Herstellung von Kavitäten in Sicherheitsdokumenten, insbesondere Chipkarten |
IT1393584B1 (it) | 2009-03-23 | 2012-04-27 | Fabriano Securities Srl | Documento a prova di falsificazione, quale una banconota, un passaporto, una carta di identità o simili e procedimento per la sua fabbricazione |
EP2323076A1 (de) * | 2009-11-12 | 2011-05-18 | Gemalto SA | Bearbeitungsverfahren eines Kartenkörpers und entsprechende Bearbeitungsstation |
DE102010011517A1 (de) * | 2010-03-15 | 2011-09-15 | Smartrac Ip B.V. | Laminataufbau für eine Chipkarte und Verfahren zu dessen Herstellung |
DE102014000133B4 (de) * | 2014-01-13 | 2015-10-15 | Melzer Maschinenbau Gmbh | Verfahren und Einrichtung zur Bearbeitung eines Substrats |
Family Cites Families (8)
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US3508754A (en) * | 1967-09-28 | 1970-04-28 | Chromographic Press Inc | Stacked sheet article with release coated removable areas |
US3850786A (en) * | 1971-09-05 | 1974-11-26 | Nat Starch Chem Corp | Adhesive products |
GB1389046A (en) * | 1972-06-19 | 1975-04-03 | Dachinger H | Transfer of an adhesive patch from an adhesive storing article to another item |
JPS522640A (en) * | 1975-06-24 | 1977-01-10 | Reiko Sakuma | Fat abdominal suit and method of producing same |
JPS54157047A (en) * | 1978-05-31 | 1979-12-11 | Fujitsu Ltd | Magnetic bubble unit |
JPS5562591A (en) * | 1978-10-30 | 1980-05-12 | Fujitsu Ltd | Memory card |
DE2920012C2 (de) * | 1979-05-17 | 1988-09-29 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit IC-Baustein und Verfahren zur Herstellung einer derartigen Ausweiskarte |
DE3029939A1 (de) * | 1980-08-07 | 1982-03-25 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung |
-
1981
- 1981-06-10 DE DE19813122981 patent/DE3122981A1/de active Granted
-
1982
- 1982-05-19 NL NLAANVRAGE8202056,A patent/NL190321C/xx not_active IP Right Cessation
- 1982-05-19 US US06/379,955 patent/US4457798A/en not_active Expired - Lifetime
- 1982-06-01 GB GB08215974A patent/GB2100669B/en not_active Expired
- 1982-06-08 BE BE6/47665A patent/BE893454A/fr not_active IP Right Cessation
- 1982-06-09 CH CH3546/82A patent/CH655907A5/de not_active IP Right Cessation
- 1982-06-09 IT IT8221782A patent/IT1151612B/it active
- 1982-06-09 FR FR8210050A patent/FR2507800B1/fr not_active Expired
- 1982-06-09 SE SE8203562A patent/SE456544B/sv not_active IP Right Cessation
- 1982-06-10 JP JP9994982A patent/JPS57210494A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS57210494A (en) | 1982-12-24 |
CH655907A5 (de) | 1986-05-30 |
SE456544B (sv) | 1988-10-10 |
DE3122981A1 (de) | 1983-01-05 |
US4457798A (en) | 1984-07-03 |
NL8202056A (nl) | 1983-01-03 |
IT1151612B (it) | 1986-12-24 |
FR2507800A1 (fr) | 1982-12-17 |
IT8221782A0 (it) | 1982-06-09 |
NL190321B (nl) | 1993-08-16 |
SE8203562L (sv) | 1982-12-11 |
DE3122981C2 (de) | 1989-08-31 |
GB2100669A (en) | 1983-01-06 |
JPS6342314B2 (de) | 1988-08-23 |
FR2507800B1 (fr) | 1986-01-03 |
GB2100669B (en) | 1984-11-14 |
BE893454A (fr) | 1982-10-01 |
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BA | A request for search or an international-type search has been filed | ||
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