NL186352C - Werkwijze ter vervaardiging van een halfgeleiderinrichting. - Google Patents
Werkwijze ter vervaardiging van een halfgeleiderinrichting.Info
- Publication number
- NL186352C NL186352C NLAANVRAGE8004835,A NL8004835A NL186352C NL 186352 C NL186352 C NL 186352C NL 8004835 A NL8004835 A NL 8004835A NL 186352 C NL186352 C NL 186352C
- Authority
- NL
- Netherlands
- Prior art keywords
- manufacturing
- semiconductor device
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/661—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon having vertical doping variation
- H10D64/662—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon having vertical doping variation the conductor further comprising additional layers, e.g. multiple silicon layers having different crystal structures
- H10D64/663—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon having vertical doping variation the conductor further comprising additional layers, e.g. multiple silicon layers having different crystal structures the additional layers comprising a silicide layer contacting the layer of silicon, e.g. polycide gates
-
- H10D64/0131—
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NLAANVRAGE8004835,A NL186352C (nl) | 1980-08-27 | 1980-08-27 | Werkwijze ter vervaardiging van een halfgeleiderinrichting. |
| US06/294,268 US4373251A (en) | 1980-08-27 | 1981-08-19 | Method of manufacturing a semiconductor device |
| DE19813132905 DE3132905A1 (de) | 1980-08-27 | 1981-08-20 | "verfahren zur herstellung einer halbleiteranordnung" |
| CA000384311A CA1176142A (en) | 1980-08-27 | 1981-08-20 | Method of manufacturing a semiconductor device |
| JP56131666A JPS5772383A (en) | 1980-08-27 | 1981-08-24 | Method of fabricating semiconductor device |
| FR8116152A FR2489591A1 (fr) | 1980-08-27 | 1981-08-24 | Procede de fabrication d'un dispositif semiconducteur |
| GB8125773A GB2083284B (en) | 1980-08-27 | 1981-08-24 | Metal silicide on polycrystalline silicon layers |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NLAANVRAGE8004835,A NL186352C (nl) | 1980-08-27 | 1980-08-27 | Werkwijze ter vervaardiging van een halfgeleiderinrichting. |
| NL8004835 | 1980-08-27 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| NL8004835A NL8004835A (nl) | 1982-04-01 |
| NL186352B NL186352B (nl) | 1990-06-01 |
| NL186352C true NL186352C (nl) | 1990-11-01 |
Family
ID=19835784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NLAANVRAGE8004835,A NL186352C (nl) | 1980-08-27 | 1980-08-27 | Werkwijze ter vervaardiging van een halfgeleiderinrichting. |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4373251A (cg-RX-API-DMAC10.html) |
| JP (1) | JPS5772383A (cg-RX-API-DMAC10.html) |
| CA (1) | CA1176142A (cg-RX-API-DMAC10.html) |
| DE (1) | DE3132905A1 (cg-RX-API-DMAC10.html) |
| FR (1) | FR2489591A1 (cg-RX-API-DMAC10.html) |
| GB (1) | GB2083284B (cg-RX-API-DMAC10.html) |
| NL (1) | NL186352C (cg-RX-API-DMAC10.html) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5536967A (en) * | 1980-12-30 | 1996-07-16 | Fujitsu Limited | Semiconductor device including Schottky gate of silicide and method for the manufacture of the same |
| US5200349A (en) * | 1980-12-30 | 1993-04-06 | Fujitsu Limited | Semiconductor device including schotky gate of silicide and method for the manufacture of the same |
| US4399605A (en) * | 1982-02-26 | 1983-08-23 | International Business Machines Corporation | Method of making dense complementary transistors |
| US4400867A (en) * | 1982-04-26 | 1983-08-30 | Bell Telephone Laboratories, Incorporated | High conductivity metallization for semiconductor integrated circuits |
| DE3304642A1 (de) * | 1983-02-10 | 1984-08-16 | Siemens AG, 1000 Berlin und 8000 München | Integrierte halbleiterschaltung mit bipolartransistor-strukturen und verfahren zu ihrer herstellung |
| US4450620A (en) * | 1983-02-18 | 1984-05-29 | Bell Telephone Laboratories, Incorporated | Fabrication of MOS integrated circuit devices |
| GB2139418A (en) * | 1983-05-05 | 1984-11-07 | Standard Telephones Cables Ltd | Semiconductor devices and conductors therefor |
| JPH0612819B2 (ja) * | 1983-06-16 | 1994-02-16 | 松下電器産業株式会社 | 半導体装置の製造方法 |
| JPH0638496B2 (ja) * | 1983-06-27 | 1994-05-18 | 日本電気株式会社 | 半導体装置 |
| JPS60134466A (ja) * | 1983-12-23 | 1985-07-17 | Hitachi Ltd | 半導体装置およびその製造方法 |
| GB2156579B (en) * | 1984-03-15 | 1987-05-07 | Standard Telephones Cables Ltd | Field effect transistors |
| US4597163A (en) * | 1984-12-21 | 1986-07-01 | Zilog, Inc. | Method of improving film adhesion between metallic silicide and polysilicon in thin film integrated circuit structures |
| US5280188A (en) * | 1985-03-07 | 1994-01-18 | Kabushiki Kaisha Toshiba | Method of manufacturing a semiconductor integrated circuit device having at least one bipolar transistor and a plurality of MOS transistors |
| JPS61222174A (ja) * | 1985-03-27 | 1986-10-02 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
| JPH061775B2 (ja) * | 1985-07-17 | 1994-01-05 | 日本電気株式会社 | 半導体装置の製造方法 |
| JPH0665213B2 (ja) * | 1985-10-31 | 1994-08-22 | 日本テキサス・インスツルメンツ株式会社 | 半導体装置及びその製造方法 |
| US4782033A (en) * | 1985-11-27 | 1988-11-01 | Siemens Aktiengesellschaft | Process for producing CMOS having doped polysilicon gate by outdiffusion of boron from implanted silicide gate |
| US4877749A (en) * | 1986-02-28 | 1989-10-31 | Polyfet Re Devices, Inc. | Method of forming a low loss FET |
| JPS6337635A (ja) * | 1986-07-31 | 1988-02-18 | Fujitsu Ltd | 半導体装置の製造方法 |
| US5017509A (en) * | 1988-07-19 | 1991-05-21 | Regents Of The University Of California | Stand-off transmission lines and method for making same |
| US4992391A (en) * | 1989-11-29 | 1991-02-12 | Advanced Micro Devices, Inc. | Process for fabricating a control gate for a floating gate FET |
| TW230266B (cg-RX-API-DMAC10.html) * | 1993-01-26 | 1994-09-11 | American Telephone & Telegraph | |
| US6004869A (en) * | 1997-04-25 | 1999-12-21 | Micron Technology, Inc. | Method for making a low resistivity electrode having a near noble metal |
| JP4851875B2 (ja) * | 2006-07-14 | 2012-01-11 | 川崎重工業株式会社 | 自動二輪車のリヤステップ取付構造及び該リヤステップ取付構造を備えた自動二輪車 |
| JP6997692B2 (ja) | 2018-09-28 | 2022-01-18 | 本田技研工業株式会社 | 鞍乗り型車両 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3617824A (en) * | 1965-07-12 | 1971-11-02 | Nippon Electric Co | Mos device with a metal-silicide gate |
| US3590471A (en) * | 1969-02-04 | 1971-07-06 | Bell Telephone Labor Inc | Fabrication of insulated gate field-effect transistors involving ion implantation |
| US3967981A (en) * | 1971-01-14 | 1976-07-06 | Shumpei Yamazaki | Method for manufacturing a semiconductor field effort transistor |
| JPS4960875A (cg-RX-API-DMAC10.html) * | 1972-10-17 | 1974-06-13 | ||
| GB1399163A (en) * | 1972-11-08 | 1975-06-25 | Ferranti Ltd | Methods of manufacturing semiconductor devices |
| NL7510903A (nl) * | 1975-09-17 | 1977-03-21 | Philips Nv | Werkwijze voor het vervaardigen van een halfgelei- derinrichting, en inrichting vervaardigd volgens de werkwijze. |
| JPS52119186A (en) * | 1976-03-31 | 1977-10-06 | Nec Corp | Manufacture of semiconductor |
| JPS6057227B2 (ja) * | 1976-11-11 | 1985-12-13 | 日本電気株式会社 | 半導体装置の製造方法 |
| JPS53114672A (en) * | 1977-03-17 | 1978-10-06 | Toshiba Corp | Manufacture for semiconductor device |
| US4180596A (en) * | 1977-06-30 | 1979-12-25 | International Business Machines Corporation | Method for providing a metal silicide layer on a substrate |
| JPS5488783A (en) * | 1977-12-26 | 1979-07-14 | Cho Lsi Gijutsu Kenkyu Kumiai | Semiconductor |
| US4304042A (en) * | 1978-11-13 | 1981-12-08 | Xerox Corporation | Self-aligned MESFETs having reduced series resistance |
| US4319395A (en) * | 1979-06-28 | 1982-03-16 | Motorola, Inc. | Method of making self-aligned device |
| US4276688A (en) * | 1980-01-21 | 1981-07-07 | Rca Corporation | Method for forming buried contact complementary MOS devices |
| US4285761A (en) * | 1980-06-30 | 1981-08-25 | International Business Machines Corporation | Process for selectively forming refractory metal silicide layers on semiconductor devices |
-
1980
- 1980-08-27 NL NLAANVRAGE8004835,A patent/NL186352C/xx not_active IP Right Cessation
-
1981
- 1981-08-19 US US06/294,268 patent/US4373251A/en not_active Expired - Fee Related
- 1981-08-20 CA CA000384311A patent/CA1176142A/en not_active Expired
- 1981-08-20 DE DE19813132905 patent/DE3132905A1/de active Granted
- 1981-08-24 JP JP56131666A patent/JPS5772383A/ja active Pending
- 1981-08-24 FR FR8116152A patent/FR2489591A1/fr active Granted
- 1981-08-24 GB GB8125773A patent/GB2083284B/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2489591B1 (cg-RX-API-DMAC10.html) | 1985-03-08 |
| DE3132905A1 (de) | 1982-04-22 |
| NL8004835A (nl) | 1982-04-01 |
| US4373251A (en) | 1983-02-15 |
| NL186352B (nl) | 1990-06-01 |
| GB2083284B (en) | 1984-07-25 |
| GB2083284A (en) | 1982-03-17 |
| DE3132905C2 (cg-RX-API-DMAC10.html) | 1990-03-22 |
| FR2489591A1 (fr) | 1982-03-05 |
| CA1176142A (en) | 1984-10-16 |
| JPS5772383A (en) | 1982-05-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A1B | A search report has been drawn up | ||
| A85 | Still pending on 85-01-01 | ||
| BC | A request for examination has been filed | ||
| V1 | Lapsed because of non-payment of the annual fee |