MY8500623A - Method of forming a wire bond - Google Patents

Method of forming a wire bond

Info

Publication number
MY8500623A
MY8500623A MY623/85A MY8500623A MY8500623A MY 8500623 A MY8500623 A MY 8500623A MY 623/85 A MY623/85 A MY 623/85A MY 8500623 A MY8500623 A MY 8500623A MY 8500623 A MY8500623 A MY 8500623A
Authority
MY
Malaysia
Prior art keywords
forming
wire bond
bond
wire
Prior art date
Application number
MY623/85A
Other languages
English (en)
Inventor
Hermanus Antonius Van De Pas
Johannes Bernardus Petrus
Janssen
Wilhelmus Jan Jacob Lorenz
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of MY8500623A publication Critical patent/MY8500623A/xx

Links

Classifications

    • H—ELECTRICITY
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L24/78—Apparatus for connecting with wire connectors
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
MY623/85A 1980-10-29 1985-12-30 Method of forming a wire bond MY8500623A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL8005922A NL8005922A (nl) 1980-10-29 1980-10-29 Werkwijze voor het vormen van een draadverbinding.

Publications (1)

Publication Number Publication Date
MY8500623A true MY8500623A (en) 1985-12-31

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ID=19836074

Family Applications (1)

Application Number Title Priority Date Filing Date
MY623/85A MY8500623A (en) 1980-10-29 1985-12-30 Method of forming a wire bond

Country Status (18)

Country Link
JP (1) JPS5916409B2 (de)
KR (1) KR890000585B1 (de)
AU (1) AU546818B2 (de)
BE (1) BE890887A (de)
BR (1) BR8106902A (de)
CA (1) CA1178664A (de)
CH (1) CH654142A5 (de)
DD (1) DD205294A5 (de)
DE (1) DE3141842A1 (de)
ES (1) ES506580A0 (de)
FR (1) FR2493044B1 (de)
GB (1) GB2086297B (de)
HK (1) HK40885A (de)
IT (1) IT1139570B (de)
MY (1) MY8500623A (de)
NL (1) NL8005922A (de)
PL (1) PL133893B1 (de)
SG (1) SG21984G (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4476365A (en) * 1982-10-08 1984-10-09 Fairchild Camera & Instrument Corp. Cover gas control of bonding ball formation
US4549059A (en) * 1982-11-24 1985-10-22 Nec Corporation Wire bonder with controlled atmosphere
US4476366A (en) * 1983-02-01 1984-10-09 Fairchild Camera & Instrument Corp. Controlled bonding wire ball formation
US4594493A (en) * 1983-07-25 1986-06-10 Fairchild Camera & Instrument Corp. Method and apparatus for forming ball bonds
FR2555813B1 (fr) * 1983-09-28 1986-06-20 Hitachi Ltd Dispositif a semi-conducteurs et procede de fabrication d'un tel dispositif
US4705204A (en) * 1985-03-01 1987-11-10 Mitsubishi Denki Kabushiki Kaisha Method of ball forming for wire bonding
US5031821A (en) * 1988-08-19 1991-07-16 Hitachi, Ltd. Semiconductor integrated circuit device, method for producing or assembling same, and producing or assembling apparatus for use in the method
US5628922A (en) * 1995-07-14 1997-05-13 Motorola, Inc. Electrical flame-off wand
DE29608277U1 (de) * 1996-04-30 1996-09-19 F&K Delvotec Bondtechnik Gmbh Vorrichtung zum Ball-Bonden
JP2003163235A (ja) * 2001-11-29 2003-06-06 Shinkawa Ltd ワイヤボンディング装置
TWI229022B (en) * 2002-06-20 2005-03-11 Esec Trading Sa Device with electrodes for the formation of a ball at the end of a wire
WO2014054305A1 (ja) * 2012-10-05 2014-04-10 株式会社新川 酸化防止ガス吹き出しユニット

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH568656A5 (en) * 1974-03-20 1975-10-31 Transistor Ag Welding of contact blobs to semiconductor lead wires - uses electric DC light arc of preset current strength for melting lead wire end
NL7406783A (nl) * 1974-05-21 1975-11-25 Philips Nv Werkwijze voor het aanbrengen van een draad- verbinding aan een halfgeleiderinrichting.
GB1536872A (en) * 1975-05-15 1978-12-20 Welding Inst Electrical inter-connection method and apparatus
GB1468974A (en) * 1975-05-23 1977-03-30 Ferranti Ltd Manufacture of semiconductor devices
GB1600021A (en) * 1977-07-26 1981-10-14 Welding Inst Electrical inter-connection method and apparatus

Also Published As

Publication number Publication date
IT8124731A0 (it) 1981-10-27
PL133893B1 (en) 1985-07-31
JPS5916409B2 (ja) 1984-04-16
GB2086297B (en) 1983-12-21
BR8106902A (pt) 1982-07-13
ES8301390A1 (es) 1982-11-16
CH654142A5 (de) 1986-01-31
HK40885A (en) 1985-05-31
AU546818B2 (en) 1985-09-19
NL8005922A (nl) 1982-05-17
DE3141842C2 (de) 1990-09-20
KR890000585B1 (ko) 1989-03-21
BE890887A (fr) 1982-04-27
AU7689381A (en) 1982-05-06
DE3141842A1 (de) 1982-10-21
GB2086297A (en) 1982-05-12
CA1178664A (en) 1984-11-27
FR2493044A1 (fr) 1982-04-30
PL233586A1 (de) 1982-05-10
DD205294A5 (de) 1983-12-21
ES506580A0 (es) 1982-11-16
IT1139570B (it) 1986-09-24
SG21984G (en) 1985-01-04
KR830008394A (ko) 1983-11-18
FR2493044B1 (fr) 1986-03-28
JPS57102036A (en) 1982-06-24

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