JPS56118395A - Method of forming multilayer wire - Google Patents
Method of forming multilayer wireInfo
- Publication number
- JPS56118395A JPS56118395A JP2182380A JP2182380A JPS56118395A JP S56118395 A JPS56118395 A JP S56118395A JP 2182380 A JP2182380 A JP 2182380A JP 2182380 A JP2182380 A JP 2182380A JP S56118395 A JPS56118395 A JP S56118395A
- Authority
- JP
- Japan
- Prior art keywords
- forming multilayer
- multilayer wire
- wire
- forming
- multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electronic Switches (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2182380A JPS56118395A (en) | 1980-02-23 | 1980-02-23 | Method of forming multilayer wire |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2182380A JPS56118395A (en) | 1980-02-23 | 1980-02-23 | Method of forming multilayer wire |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56118395A true JPS56118395A (en) | 1981-09-17 |
JPS646030B2 JPS646030B2 (en) | 1989-02-01 |
Family
ID=12065776
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2182380A Granted JPS56118395A (en) | 1980-02-23 | 1980-02-23 | Method of forming multilayer wire |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56118395A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58194397A (en) * | 1982-05-10 | 1983-11-12 | 日本電気株式会社 | Method of producing multilayer circuit board by copper thick film paste |
JPS6010697A (en) * | 1983-06-29 | 1985-01-19 | 三洋電機株式会社 | Method of producing multilayer circuit board |
JPS60167497A (en) * | 1984-02-10 | 1985-08-30 | 松下電器産業株式会社 | Method of producing multilayer circuit board |
JPS617697A (en) * | 1984-06-22 | 1986-01-14 | 富士通株式会社 | Multilayer circuit board and method of producing same |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4963962A (en) * | 1972-10-27 | 1974-06-20 | ||
JPS54135360A (en) * | 1978-04-13 | 1979-10-20 | Oki Electric Ind Co Ltd | Multiilayer ceramic board |
JPS5598897A (en) * | 1979-01-23 | 1980-07-28 | Nippon Electric Co | Multilayer circuit board |
-
1980
- 1980-02-23 JP JP2182380A patent/JPS56118395A/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4963962A (en) * | 1972-10-27 | 1974-06-20 | ||
JPS54135360A (en) * | 1978-04-13 | 1979-10-20 | Oki Electric Ind Co Ltd | Multiilayer ceramic board |
JPS5598897A (en) * | 1979-01-23 | 1980-07-28 | Nippon Electric Co | Multilayer circuit board |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58194397A (en) * | 1982-05-10 | 1983-11-12 | 日本電気株式会社 | Method of producing multilayer circuit board by copper thick film paste |
JPS6010697A (en) * | 1983-06-29 | 1985-01-19 | 三洋電機株式会社 | Method of producing multilayer circuit board |
JPH0118594B2 (en) * | 1983-06-29 | 1989-04-06 | Sanyo Electric Co | |
JPS60167497A (en) * | 1984-02-10 | 1985-08-30 | 松下電器産業株式会社 | Method of producing multilayer circuit board |
JPH0151075B2 (en) * | 1984-02-10 | 1989-11-01 | Matsushita Electric Ind Co Ltd | |
JPS617697A (en) * | 1984-06-22 | 1986-01-14 | 富士通株式会社 | Multilayer circuit board and method of producing same |
JPH0363237B2 (en) * | 1984-06-22 | 1991-09-30 | Fujitsu Ltd |
Also Published As
Publication number | Publication date |
---|---|
JPS646030B2 (en) | 1989-02-01 |
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