JPS56106385A - Method of bonding coated wire using ultrasonci wave - Google Patents

Method of bonding coated wire using ultrasonci wave

Info

Publication number
JPS56106385A
JPS56106385A JP809680A JP809680A JPS56106385A JP S56106385 A JPS56106385 A JP S56106385A JP 809680 A JP809680 A JP 809680A JP 809680 A JP809680 A JP 809680A JP S56106385 A JPS56106385 A JP S56106385A
Authority
JP
Japan
Prior art keywords
ultrasonci
wave
coated wire
bonding coated
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP809680A
Other languages
Japanese (ja)
Other versions
JPS5726871B2 (en
Inventor
Riyouji Fujii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Avionics Co Ltd
Original Assignee
Nippon Avionics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Avionics Co Ltd filed Critical Nippon Avionics Co Ltd
Priority to JP809680A priority Critical patent/JPS56106385A/en
Publication of JPS56106385A publication Critical patent/JPS56106385A/en
Publication of JPS5726871B2 publication Critical patent/JPS5726871B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45599—Material
    • H01L2224/4569—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85238—Applying energy for connecting using electric resistance welding, i.e. ohmic heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP809680A 1980-01-26 1980-01-26 Method of bonding coated wire using ultrasonci wave Granted JPS56106385A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP809680A JPS56106385A (en) 1980-01-26 1980-01-26 Method of bonding coated wire using ultrasonci wave

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP809680A JPS56106385A (en) 1980-01-26 1980-01-26 Method of bonding coated wire using ultrasonci wave

Publications (2)

Publication Number Publication Date
JPS56106385A true JPS56106385A (en) 1981-08-24
JPS5726871B2 JPS5726871B2 (en) 1982-06-07

Family

ID=11683773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP809680A Granted JPS56106385A (en) 1980-01-26 1980-01-26 Method of bonding coated wire using ultrasonci wave

Country Status (1)

Country Link
JP (1) JPS56106385A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63174288A (en) * 1987-01-13 1988-07-18 富士ゼロックス株式会社 Wire bonding of hybrid integrated circuit
JPH04154067A (en) * 1990-10-15 1992-05-27 Matsushita Electric Works Ltd Method of connecting terminal of printed wiring board
JPH10199583A (en) * 1997-01-09 1998-07-31 Yazaki Corp Ultrasonic connecting terminal and ultrasonic connecting structure
JPH11176552A (en) * 1997-12-11 1999-07-02 Hitachi Cable Ltd Terminal and conductor connecting method
JP2016185009A (en) * 2015-03-26 2016-10-20 古河電気工業株式会社 Connection method of wire, connection device, and wire with terminal

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63174288A (en) * 1987-01-13 1988-07-18 富士ゼロックス株式会社 Wire bonding of hybrid integrated circuit
JPH04154067A (en) * 1990-10-15 1992-05-27 Matsushita Electric Works Ltd Method of connecting terminal of printed wiring board
JPH10199583A (en) * 1997-01-09 1998-07-31 Yazaki Corp Ultrasonic connecting terminal and ultrasonic connecting structure
JPH11176552A (en) * 1997-12-11 1999-07-02 Hitachi Cable Ltd Terminal and conductor connecting method
JP2016185009A (en) * 2015-03-26 2016-10-20 古河電気工業株式会社 Connection method of wire, connection device, and wire with terminal

Also Published As

Publication number Publication date
JPS5726871B2 (en) 1982-06-07

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