GB2104817B - Method of solder bonding - Google Patents
Method of solder bondingInfo
- Publication number
- GB2104817B GB2104817B GB08200848A GB8200848A GB2104817B GB 2104817 B GB2104817 B GB 2104817B GB 08200848 A GB08200848 A GB 08200848A GB 8200848 A GB8200848 A GB 8200848A GB 2104817 B GB2104817 B GB 2104817B
- Authority
- GB
- United Kingdom
- Prior art keywords
- solder bonding
- solder
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB08200848A GB2104817B (en) | 1981-09-03 | 1982-01-12 | Method of solder bonding |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8126696 | 1981-09-03 | ||
GB08200848A GB2104817B (en) | 1981-09-03 | 1982-01-12 | Method of solder bonding |
Publications (2)
Publication Number | Publication Date |
---|---|
GB2104817A GB2104817A (en) | 1983-03-16 |
GB2104817B true GB2104817B (en) | 1986-05-21 |
Family
ID=26280625
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08200848A Expired GB2104817B (en) | 1981-09-03 | 1982-01-12 | Method of solder bonding |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2104817B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4241439A1 (en) * | 1992-12-10 | 1994-06-16 | Daimler Benz Ag | Keyed bonding between connectors and contacts on a semiconductor surface - uses an intermediate layer with structured melting point to fuse connector to solar cell contact under heat and pressure |
USD788584S1 (en) * | 2015-03-13 | 2017-06-06 | Tiff's Treats Holdings, Inc. | Stand |
USD850859S1 (en) | 2017-06-06 | 2019-06-11 | Tiff's Treats Holding, Inc. | Stand |
-
1982
- 1982-01-12 GB GB08200848A patent/GB2104817B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB2104817A (en) | 1983-03-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |