MY196462A - Semiconductor Encapsulant - Google Patents
Semiconductor EncapsulantInfo
- Publication number
- MY196462A MY196462A MYPI2018000991A MYPI2018000991A MY196462A MY 196462 A MY196462 A MY 196462A MY PI2018000991 A MYPI2018000991 A MY PI2018000991A MY PI2018000991 A MYPI2018000991 A MY PI2018000991A MY 196462 A MY196462 A MY 196462A
- Authority
- MY
- Malaysia
- Prior art keywords
- semiconductor
- semiconductor encapsulant
- encapsulant
- oxidizing
- gap
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015254480A JP5978380B1 (ja) | 2015-12-25 | 2015-12-25 | 半導体用封止材 |
| PCT/JP2016/088444 WO2017111057A1 (ja) | 2015-12-25 | 2016-12-22 | 半導体用封止材 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY196462A true MY196462A (en) | 2023-04-12 |
Family
ID=56760075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2018000991A MY196462A (en) | 2015-12-25 | 2016-12-22 | Semiconductor Encapsulant |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JP5978380B1 (ja) |
| KR (1) | KR102384582B1 (ja) |
| CN (1) | CN108369928B (ja) |
| MY (1) | MY196462A (ja) |
| PH (1) | PH12018501308A1 (ja) |
| TW (1) | TWI750145B (ja) |
| WO (1) | WO2017111057A1 (ja) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7025879B2 (ja) * | 2017-09-29 | 2022-02-25 | リンテック株式会社 | 樹脂シート |
| JP6976443B2 (ja) | 2017-12-18 | 2021-12-08 | エルジー・ケム・リミテッド | 封止用組成物 |
| JP2019196475A (ja) * | 2018-05-11 | 2019-11-14 | サムスン エレクトロニクス カンパニー リミテッド | 低損失絶縁樹脂組成物、及びこれを用いた絶縁フィルム |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2558293B2 (ja) * | 1987-09-14 | 1996-11-27 | 日東電工株式会社 | 半導体装置 |
| JP3128291B2 (ja) * | 1990-10-31 | 2001-01-29 | 株式会社東芝 | マレイミド樹脂組成物およびこれを用いた樹脂封止型半導体装置 |
| JP2000036552A (ja) * | 1998-07-17 | 2000-02-02 | Fujitsu Ltd | 半導体装置、及び半導体装置で用いる封止材中の金属分の分取方法 |
| JP2000109543A (ja) * | 1998-10-07 | 2000-04-18 | Hitachi Chem Co Ltd | 半導体封止用エポキシ樹脂組成物及びそれを用いた半導体装置 |
| EP2546275B1 (en) * | 2002-09-05 | 2023-09-20 | Daicel Corporation | Curable epoxy resin compositions, epoxy resin compositions for the encapsulation of electronic parts, stabilizers for electrical insulating oils, and casting epoxy resin compositions for electrical insulation. |
| JP3998564B2 (ja) * | 2002-11-13 | 2007-10-31 | 株式会社巴川製紙所 | 半導体封止用硬化性接着剤組成物および接着シート |
| JP6019550B2 (ja) | 2011-08-09 | 2016-11-02 | 富士通株式会社 | 電子装置の製造方法 |
| KR101393700B1 (ko) * | 2012-11-29 | 2014-05-13 | 서울과학기술대학교 산학협력단 | 웨이퍼의 휨 발생 방지 기능을 강화시킨 팬 아웃 웨이퍼 레벨 패키징 공정 |
| JP2015041663A (ja) * | 2013-08-21 | 2015-03-02 | 日東電工株式会社 | 封止用シート、及び、半導体装置の製造方法 |
| JP2015056458A (ja) * | 2013-09-10 | 2015-03-23 | 株式会社東芝 | 半導体装置 |
| JP2015056511A (ja) * | 2013-09-12 | 2015-03-23 | 日東電工株式会社 | 半導体装置の製造方法 |
| JP6546378B2 (ja) * | 2013-11-19 | 2019-07-17 | 日東電工株式会社 | 樹脂シート |
| KR20160102214A (ko) * | 2013-12-26 | 2016-08-29 | 닛토덴코 가부시키가이샤 | 반도체 장치의 제조 방법 |
| JP2015126124A (ja) * | 2013-12-26 | 2015-07-06 | 日東電工株式会社 | 半導体パッケージの製造方法 |
-
2015
- 2015-12-25 JP JP2015254480A patent/JP5978380B1/ja active Active
-
2016
- 2016-12-22 MY MYPI2018000991A patent/MY196462A/en unknown
- 2016-12-22 WO PCT/JP2016/088444 patent/WO2017111057A1/ja active Application Filing
- 2016-12-22 CN CN201680073780.XA patent/CN108369928B/zh active Active
- 2016-12-22 KR KR1020187017963A patent/KR102384582B1/ko active IP Right Grant
- 2016-12-23 TW TW105143052A patent/TWI750145B/zh active
-
2018
- 2018-06-19 PH PH12018501308A patent/PH12018501308A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP5978380B1 (ja) | 2016-08-24 |
| TWI750145B (zh) | 2021-12-21 |
| KR20180098558A (ko) | 2018-09-04 |
| CN108369928B (zh) | 2022-01-18 |
| WO2017111057A1 (ja) | 2017-06-29 |
| KR102384582B1 (ko) | 2022-04-08 |
| JP2017118045A (ja) | 2017-06-29 |
| CN108369928A (zh) | 2018-08-03 |
| PH12018501308A1 (en) | 2019-02-11 |
| TW201737429A (zh) | 2017-10-16 |
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