MY165894A - Epoxy resin molding material for encapsulation and electronic component device including element encapsulated with same - Google Patents
Epoxy resin molding material for encapsulation and electronic component device including element encapsulated with sameInfo
- Publication number
- MY165894A MY165894A MYPI2013700814A MYPI2013700814A MY165894A MY 165894 A MY165894 A MY 165894A MY PI2013700814 A MYPI2013700814 A MY PI2013700814A MY PI2013700814 A MYPI2013700814 A MY PI2013700814A MY 165894 A MY165894 A MY 165894A
- Authority
- MY
- Malaysia
- Prior art keywords
- epoxy resin
- encapsulation
- molding material
- resin molding
- electronic component
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/315—Compounds containing carbon-to-nitrogen triple bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010263558 | 2010-11-26 | ||
| JP2011240690A JP5906673B2 (ja) | 2010-11-26 | 2011-11-01 | 封止用エポキシ樹脂成形材料、及びこの成形材料で封止した素子を備えた電子部品装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY165894A true MY165894A (en) | 2018-05-18 |
Family
ID=46145750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2013700814A MY165894A (en) | 2010-11-26 | 2011-11-10 | Epoxy resin molding material for encapsulation and electronic component device including element encapsulated with same |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5906673B2 (fr) |
| CN (1) | CN103221452B (fr) |
| MY (1) | MY165894A (fr) |
| TW (1) | TWI568788B (fr) |
| WO (1) | WO2012070402A1 (fr) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6291742B2 (ja) * | 2013-08-12 | 2018-03-14 | 日立化成株式会社 | 樹脂組成物、めっきプロセス用接着補助層、支持体付きめっきプロセス用接着補助層、配線板用積層板、配線板用積層板の製造方法、多層配線板、及び多層配線板の製造方法 |
| CN106553350A (zh) * | 2015-09-30 | 2017-04-05 | 明光市奇美橡塑有限公司 | 一种高强度油封的生产方法 |
| CN105419232A (zh) * | 2015-12-03 | 2016-03-23 | 佛山市顺德区创格电子实业有限公司 | 一种电容器环氧树脂组合物 |
| JP6916997B2 (ja) * | 2016-03-17 | 2021-08-11 | 富士電機株式会社 | 半導体装置 |
| JP7343978B2 (ja) * | 2016-04-28 | 2023-09-13 | 株式会社レゾナック | エポキシ樹脂組成物及び電子部品装置 |
| JP6520872B2 (ja) * | 2016-09-01 | 2019-05-29 | 信越化学工業株式会社 | 半導体封止用熱硬化性樹脂組成物 |
| MY177304A (en) * | 2017-03-31 | 2020-09-11 | Hitachi Chemical Co Ltd | Protective material for electronic circuit, sealing material for protective material for electronic circuit, sealing method, and method for manufacturing semiconductor device |
| KR20200094221A (ko) * | 2017-12-28 | 2020-08-06 | 히타치가세이가부시끼가이샤 | 볼 그리드 어레이 패키지 밀봉용 에폭시 수지 조성물, 에폭시 수지 경화물 및 전자 부품 장치 |
| JP7324283B2 (ja) * | 2019-07-26 | 2023-08-09 | 富士フイルム株式会社 | 熱伝導材料形成用組成物、熱伝導材料、熱伝導シート、熱伝導層付きデバイス |
| CN113201302B (zh) * | 2021-05-06 | 2023-03-03 | 黑龙江省科学院石油化学研究院 | 一种双氨基双邻苯二甲腈改性环氧树脂胶粘剂及其制备方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0780435A1 (fr) * | 1995-12-21 | 1997-06-25 | National Starch and Chemical Investment Holding Corporation | Adhésive epog, flexible ayant une tendance de migration faible |
| JPH09302070A (ja) * | 1996-05-20 | 1997-11-25 | Sumitomo Metal Ind Ltd | 熱硬化性エポキシ樹脂組成物とその用途および硬化剤 |
| JPH10130189A (ja) * | 1996-10-25 | 1998-05-19 | Sumitomo Chem Co Ltd | 多価フェノール化合物、およびそれを用いた樹脂組成物 |
| JP4572522B2 (ja) * | 2003-07-31 | 2010-11-04 | Ｄｉｃ株式会社 | エポキシ樹脂組成物、エポキシ樹脂硬化物、及びノボラック樹脂 |
| KR101404141B1 (ko) * | 2008-01-30 | 2014-06-10 | 닛산 가가쿠 고교 가부시키 가이샤 | 유황원자를 함유하는 레지스트 하층막 형성용 조성물 및 레지스트패턴의 형성방법 |
-
2011
- 2011-11-01 JP JP2011240690A patent/JP5906673B2/ja not_active Expired - Fee Related
- 2011-11-10 MY MYPI2013700814A patent/MY165894A/en unknown
- 2011-11-10 WO PCT/JP2011/076002 patent/WO2012070402A1/fr active Application Filing
- 2011-11-10 CN CN201180055907.2A patent/CN103221452B/zh not_active Expired - Fee Related
- 2011-11-22 TW TW100142727A patent/TWI568788B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN103221452A (zh) | 2013-07-24 |
| JP5906673B2 (ja) | 2016-04-20 |
| TW201229124A (en) | 2012-07-16 |
| JP2012126891A (ja) | 2012-07-05 |
| CN103221452B (zh) | 2016-06-22 |
| TWI568788B (zh) | 2017-02-01 |
| WO2012070402A1 (fr) | 2012-05-31 |
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