MY165538A - Cmp pad with local area transparency - Google Patents

Cmp pad with local area transparency

Info

Publication number
MY165538A
MY165538A MYPI2012003162A MYPI2012003162A MY165538A MY 165538 A MY165538 A MY 165538A MY PI2012003162 A MYPI2012003162 A MY PI2012003162A MY PI2012003162 A MYPI2012003162 A MY PI2012003162A MY 165538 A MY165538 A MY 165538A
Authority
MY
Malaysia
Prior art keywords
polishing
aperture
region
polishing layer
release sheet
Prior art date
Application number
MYPI2012003162A
Other languages
English (en)
Inventor
William Allison
Ping Huang
Diane Scott
Richard Frentzel
Robert Kerprich
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of MY165538A publication Critical patent/MY165538A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/12—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with apertures for inspecting the surface to be abraded

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
MYPI2012003162A 2010-01-13 2011-01-11 Cmp pad with local area transparency MY165538A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/657,135 US9017140B2 (en) 2010-01-13 2010-01-13 CMP pad with local area transparency

Publications (1)

Publication Number Publication Date
MY165538A true MY165538A (en) 2018-04-03

Family

ID=43896755

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2012003162A MY165538A (en) 2010-01-13 2011-01-11 Cmp pad with local area transparency

Country Status (10)

Country Link
US (1) US9017140B2 (https=)
EP (1) EP2523777B1 (https=)
JP (3) JP5503019B2 (https=)
KR (1) KR101495145B1 (https=)
CN (1) CN102770239B (https=)
IL (1) IL220649A (https=)
MY (1) MY165538A (https=)
SG (2) SG10201408738RA (https=)
TW (1) TWI490083B (https=)
WO (1) WO2011088057A1 (https=)

Families Citing this family (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9156124B2 (en) * 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US8657653B2 (en) 2010-09-30 2014-02-25 Nexplanar Corporation Homogeneous polishing pad for eddy current end-point detection
US8628384B2 (en) * 2010-09-30 2014-01-14 Nexplanar Corporation Polishing pad for eddy current end-point detection
US8535115B2 (en) * 2011-01-28 2013-09-17 Applied Materials, Inc. Gathering spectra from multiple optical heads
US8920219B2 (en) * 2011-07-15 2014-12-30 Nexplanar Corporation Polishing pad with alignment aperture
US20130205679A1 (en) * 2012-02-14 2013-08-15 Innopad, Inc. Method of manufacturing a chemical mechanical planarization pad
US8986585B2 (en) * 2012-03-22 2015-03-24 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing chemical mechanical polishing layers having a window
US9156125B2 (en) 2012-04-11 2015-10-13 Cabot Microelectronics Corporation Polishing pad with light-stable light-transmitting region
US20140120802A1 (en) * 2012-10-31 2014-05-01 Wayne O. Duescher Abrasive platen wafer surface optical monitoring system
US9649742B2 (en) 2013-01-22 2017-05-16 Nexplanar Corporation Polishing pad having polishing surface with continuous protrusions
US10160092B2 (en) * 2013-03-14 2018-12-25 Cabot Microelectronics Corporation Polishing pad having polishing surface with continuous protrusions having tapered sidewalls
US9216489B2 (en) * 2014-03-28 2015-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9259820B2 (en) * 2014-03-28 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with polishing layer and window
US9238294B2 (en) * 2014-06-18 2016-01-19 Nexplanar Corporation Polishing pad having porogens with liquid filler
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
KR20240015167A (ko) 2014-10-17 2024-02-02 어플라이드 머티어리얼스, 인코포레이티드 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US20160144477A1 (en) * 2014-11-21 2016-05-26 Diane Scott Coated compressive subpad for chemical mechanical polishing
US10946495B2 (en) * 2015-01-30 2021-03-16 Cmc Materials, Inc. Low density polishing pad
US9475168B2 (en) * 2015-03-26 2016-10-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad window
TWI754275B (zh) * 2015-10-16 2022-02-01 美商應用材料股份有限公司 拋光墊及形成其之方法
JP6940495B2 (ja) 2015-10-30 2021-09-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
KR102629800B1 (ko) 2016-01-19 2024-01-29 어플라이드 머티어리얼스, 인코포레이티드 다공성 화학적 기계적 연마 패드들
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US10213894B2 (en) * 2016-02-26 2019-02-26 Applied Materials, Inc. Method of placing window in thin polishing pad
TWI593511B (zh) 2016-06-08 2017-08-01 智勝科技股份有限公司 研磨墊及研磨方法
WO2018045039A1 (en) * 2016-08-31 2018-03-08 Applied Materials, Inc. Polishing system with annular platen or polishing pad
SG11201906131WA (en) * 2017-01-20 2019-08-27 Applied Materials Inc A thin plastic polishing article for cmp applications
US20180265989A1 (en) * 2017-03-17 2018-09-20 Toshiba Memory Corporation Substrate treatment apparatus and substrate treatment method
JP6360586B1 (ja) * 2017-04-13 2018-07-18 三菱電線工業株式会社 Ｃｍｐ装置のウエハ保持用の弾性膜
US20180304539A1 (en) 2017-04-21 2018-10-25 Applied Materials, Inc. Energy delivery system with array of energy sources for an additive manufacturing apparatus
KR101966809B1 (ko) * 2017-05-18 2019-08-13 세메스 주식회사 기판 연마 장치 및 기판 연마 방법
KR20200014364A (ko) * 2017-06-01 2020-02-10 도쿄엘렉트론가부시키가이샤 게터링층 형성 장치, 게터링층 형성 방법 및 컴퓨터 기억 매체
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
JP6948878B2 (ja) * 2017-08-22 2021-10-13 ラピスセミコンダクタ株式会社 半導体製造装置及び半導体基板の研磨方法
US10636761B2 (en) * 2017-08-29 2020-04-28 Electronics And Telecommunications Reearch Institute Method of fabricating a semiconductor package
US10465097B2 (en) * 2017-11-16 2019-11-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aliphatic UV cured polyurethane optical endpoint detection windows with high UV transparency for CMP polishing pads
US11325221B2 (en) * 2017-11-16 2022-05-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with multipurpose composite window
US11192215B2 (en) * 2017-11-16 2021-12-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with pad wear indicator
EP3790706A4 (en) 2018-05-07 2022-02-16 Applied Materials, Inc. CHEMICAL MECHANICAL POLISHING PADS WITH ADJUSTABLE HYDROPHIL AND ZETA POTENTIAL
WO2020050932A1 (en) 2018-09-04 2020-03-12 Applied Materials, Inc. Formulations for advanced polishing pads
US12138735B2 (en) * 2018-11-28 2024-11-12 Taiwan Semiconductor Manufacturing Co., Ltd. Multi-layered windows for use in chemical-mechanical planarization systems
KR102674027B1 (ko) 2019-01-29 2024-06-12 삼성전자주식회사 재생 연마패드
US11851570B2 (en) 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
KR102142236B1 (ko) * 2020-01-10 2020-08-06 (주)제이쓰리 초평탄화 형상제어 웨이퍼 가공장치
KR20220161318A (ko) * 2020-03-31 2022-12-06 가부시끼가이샤 도꾸야마 Cmp 연마 패드용 중공 마이크로벌룬
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
TW202225286A (zh) * 2020-09-30 2022-07-01 日商富士紡控股股份有限公司 研磨墊及研磨墊之製造方法
WO2022159810A1 (en) * 2021-01-25 2022-07-28 Cmc Materials, Inc. Endpoint window with controlled texture surface
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
US12491603B2 (en) * 2021-03-03 2025-12-09 Applied Materials, Inc. Passive acoustic monitoring and acoustic sensors for chemical mechanical polishing
CN115122232B (zh) * 2021-03-29 2024-08-20 万华化学集团电子材料有限公司 一种微孔聚氨酯抛光垫的制备方法、抛光垫及其应用
KR102624629B1 (ko) 2021-11-19 2024-01-15 에스케이하이닉스 주식회사 윈도우 삽입형 연마패드 및 이의 제조방법
JP7696822B2 (ja) * 2021-12-28 2025-06-23 株式会社荏原製作所 研磨装置および研磨方法
US20230398659A1 (en) * 2022-06-09 2023-12-14 Taiwan Semiconductor Manufacturing Co., Ltd. Polishing Pad for Chemical Mechanical Polishing and Method

Family Cites Families (139)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5196353A (en) 1992-01-03 1993-03-23 Micron Technology, Inc. Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer
US6614529B1 (en) 1992-12-28 2003-09-02 Applied Materials, Inc. In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization
US5658183A (en) 1993-08-25 1997-08-19 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing including optical monitoring
US5433651A (en) 1993-12-22 1995-07-18 International Business Machines Corporation In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
JP3270282B2 (ja) 1994-02-21 2002-04-02 株式会社東芝 半導体製造装置及び半導体装置の製造方法
JP3313505B2 (ja) 1994-04-14 2002-08-12 株式会社日立製作所 研磨加工法
US6876454B1 (en) 1995-03-28 2005-04-05 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US6676717B1 (en) 1995-03-28 2004-01-13 Applied Materials Inc Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US5964643A (en) 1995-03-28 1999-10-12 Applied Materials, Inc. Apparatus and method for in-situ monitoring of chemical mechanical polishing operations
US6537133B1 (en) 1995-03-28 2003-03-25 Applied Materials, Inc. Method for in-situ endpoint detection for chemical mechanical polishing operations
US6719818B1 (en) 1995-03-28 2004-04-13 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US5893796A (en) 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US5838447A (en) 1995-07-20 1998-11-17 Ebara Corporation Polishing apparatus including thickness or flatness detector
US5605760A (en) 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US5609517A (en) 1995-11-20 1997-03-11 International Business Machines Corporation Composite polishing pad
US5733176A (en) 1996-05-24 1998-03-31 Micron Technology, Inc. Polishing pad and method of use
US5872633A (en) 1996-07-26 1999-02-16 Speedfam Corporation Methods and apparatus for detecting removal of thin film layers during planarization
US6648733B2 (en) 1997-04-04 2003-11-18 Rodel Holdings, Inc. Polishing pads and methods relating thereto
US6068539A (en) 1998-03-10 2000-05-30 Lam Research Corporation Wafer polishing device with movable window
US6832950B2 (en) 2002-10-28 2004-12-21 Applied Materials, Inc. Polishing pad with window
US6994607B2 (en) 2001-12-28 2006-02-07 Applied Materials, Inc. Polishing pad with window
US6716085B2 (en) 2001-12-28 2004-04-06 Applied Materials Inc. Polishing pad with transparent window
US20040082271A1 (en) 1999-01-25 2004-04-29 Wiswesser Andreas Norbert Polishing pad with window
WO2000060650A1 (en) 1999-03-31 2000-10-12 Nikon Corporation Polishing body, polisher, method for adjusting polisher, method for measuring thickness of polished film or end point of polishing, method for producing semiconductor device
US6146242A (en) 1999-06-11 2000-11-14 Strasbaugh, Inc. Optical view port for chemical mechanical planarization endpoint detection
US6171181B1 (en) 1999-08-17 2001-01-09 Rodel Holdings, Inc. Molded polishing pad having integral window
WO2001015861A1 (en) 1999-08-27 2001-03-08 Asahi Kasei Kabushiki Kaisha Polishing pad and polisher
US6524164B1 (en) 1999-09-14 2003-02-25 Applied Materials, Inc. Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
US6454630B1 (en) 1999-09-14 2002-09-24 Applied Materials, Inc. Rotatable platen having a transparent window for a chemical mechanical polishing apparatus and method of making the same
EP1224060B1 (en) 1999-09-29 2004-06-23 Rodel Holdings, Inc. Polishing pad
US6726528B2 (en) 2002-05-14 2004-04-27 Strasbaugh Polishing pad with optical sensor
JP2003524300A (ja) 2000-02-25 2003-08-12 ロデール ホールディングス インコーポレイテッド 透明部分のある研磨パッド
EP1263548A1 (en) 2000-03-15 2002-12-11 Rodel Holdings, Inc. Window portion with an adjusted rate of wear
US8485862B2 (en) 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
US6685537B1 (en) 2000-06-05 2004-02-03 Speedfam-Ipec Corporation Polishing pad window for a chemical mechanical polishing tool
US6612901B1 (en) 2000-06-07 2003-09-02 Micron Technology, Inc. Apparatus for in-situ optical endpointing of web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6485354B1 (en) 2000-06-09 2002-11-26 Strasbaugh Polishing pad with built-in optical sensor
US6428386B1 (en) 2000-06-16 2002-08-06 Micron Technology, Inc. Planarizing pads, planarizing machines, and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies
JP2002001647A (ja) * 2000-06-19 2002-01-08 Rodel Nitta Co 研磨パッド
CN1250372C (zh) 2000-09-29 2006-04-12 斯特拉斯保 带有内置光学传感器的抛光垫
WO2002030617A1 (en) 2000-10-06 2002-04-18 Cabot Microelectronics Corporation Polishing pad comprising a filled translucent region
US20020072296A1 (en) 2000-11-29 2002-06-13 Muilenburg Michael J. Abrasive article having a window system for polishing wafers, and methods
US6623331B2 (en) 2001-02-16 2003-09-23 Cabot Microelectronics Corporation Polishing disk with end-point detection port
US6840843B2 (en) 2001-03-01 2005-01-11 Cabot Microelectronics Corporation Method for manufacturing a polishing pad having a compressed translucent region
US20020137431A1 (en) 2001-03-23 2002-09-26 Labunsky Michael A. Methods and apparatus for polishing and planarization
US6641470B1 (en) 2001-03-30 2003-11-04 Lam Research Corporation Apparatus for accurate endpoint detection in supported polishing pads
KR100858392B1 (ko) 2001-04-25 2008-09-11 제이에스알 가부시끼가이샤 반도체 웨이퍼용 연마 패드와, 이를 구비한 반도체웨이퍼용 연마 적층체와, 반도체 웨이퍼의 연마 방법
JP4131632B2 (ja) 2001-06-15 2008-08-13 株式会社荏原製作所 ポリッシング装置及び研磨パッド
JP4570286B2 (ja) 2001-07-03 2010-10-27 ニッタ・ハース株式会社 研磨パッド
JP2003133270A (ja) 2001-10-26 2003-05-09 Jsr Corp 化学機械研磨用窓材及び研磨パッド
US6722249B2 (en) 2001-11-06 2004-04-20 Rodel Holdings, Inc Method of fabricating a polishing pad having an optical window
US6702866B2 (en) 2002-01-10 2004-03-09 Speedfam-Ipec Corporation Homogeneous fixed abrasive polishing pad
US6935922B2 (en) 2002-02-04 2005-08-30 Kla-Tencor Technologies Corp. Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing
US7001242B2 (en) 2002-02-06 2006-02-21 Applied Materials, Inc. Method and apparatus of eddy current monitoring for chemical mechanical polishing
US6875077B2 (en) 2002-03-18 2005-04-05 Raytech Innovative Solutions, Inc. Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making
US6524176B1 (en) 2002-03-25 2003-02-25 Macronix International Co. Ltd. Polishing pad
US20030207661A1 (en) * 2002-05-01 2003-11-06 Alexander Tregub Annealing of CMP polishing pads
US6752690B1 (en) * 2002-06-12 2004-06-22 Clinton O. Fruitman Method of making polishing pad for planarization of semiconductor wafers
US20050148183A1 (en) 2002-08-30 2005-07-07 Toray Industries, Inc. Polishing pad, platen hole cover, polishing apparatus, polishing method, and method for fabricating semiconductor device
US20070010169A1 (en) 2002-09-25 2007-01-11 Ppg Industries Ohio, Inc. Polishing pad with window for planarization
KR20050052513A (ko) 2002-09-25 2005-06-02 피피지 인더스트리즈 오하이오 인코포레이티드 평탄화를 위한 윈도를 가진 연마 패드
US7267607B2 (en) 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7435165B2 (en) 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
TWI220405B (en) 2002-11-19 2004-08-21 Iv Technologies Co Ltd Method of fabricating a polishing pad having a detection window thereon
KR101047933B1 (ko) 2002-11-27 2011-07-11 도요 고무 고교 가부시키가이샤 연마 패드 및 반도체 장치의 제조 방법
US6806100B1 (en) 2002-12-24 2004-10-19 Lam Research Corporation Molded end point detection window for chemical mechanical planarization
US6676483B1 (en) 2003-02-03 2004-01-13 Rodel Holdings, Inc. Anti-scattering layer for polishing pad windows
US6960120B2 (en) 2003-02-10 2005-11-01 Cabot Microelectronics Corporation CMP pad with composite transparent window
US6832947B2 (en) * 2003-02-10 2004-12-21 Cabot Microelectronics Corporation CMP pad with composite transparent window
US7704125B2 (en) * 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US7377840B2 (en) 2004-07-21 2008-05-27 Neopad Technologies Corporation Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs
TWI286964B (en) 2003-03-25 2007-09-21 Neopad Technologies Corp Customized polish pads for chemical mechanical planarization
US8864859B2 (en) 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
EP1466699A1 (en) 2003-04-09 2004-10-13 JSR Corporation Abrasive pad, method and metal mold for manufacturing the same, and semiconductor wafer polishing method
US7238097B2 (en) 2003-04-11 2007-07-03 Nihon Microcoating Co., Ltd. Polishing pad and method of producing same
US20040209066A1 (en) 2003-04-17 2004-10-21 Swisher Robert G. Polishing pad with window for planarization
KR20040093402A (ko) 2003-04-22 2004-11-05 제이에스알 가부시끼가이샤 연마 패드 및 반도체 웨이퍼의 연마 방법
KR100532440B1 (ko) 2003-06-05 2005-11-30 삼성전자주식회사 윈도로의 유체의 침투를 막는 실링 장벽부를 가지는 화학기계적 연마 장비에 사용되는 연마 패드
KR100541545B1 (ko) 2003-06-16 2006-01-11 삼성전자주식회사 화학기계적 연마 장비의 연마 테이블
US6884156B2 (en) 2003-06-17 2005-04-26 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US6997777B2 (en) 2003-06-17 2006-02-14 Cabot Microelectronics Corporation Ultrasonic welding method for the manufacture of a polishing pad comprising an optically transmissive region
KR100526877B1 (ko) 2003-06-23 2005-11-09 삼성전자주식회사 반도체 웨이퍼용 ｃｍｐ 설비의 폴리싱 패드
KR100627202B1 (ko) 2003-07-17 2006-09-25 제이에스알 가부시끼가이샤 화학 기계 연마용 패드 및 화학 기계 연마 방법
US7195539B2 (en) 2003-09-19 2007-03-27 Cabot Microelectronics Coporation Polishing pad with recessed window
US7264536B2 (en) 2003-09-23 2007-09-04 Applied Materials, Inc. Polishing pad with window
US8066552B2 (en) 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
US20050173259A1 (en) 2004-02-06 2005-08-11 Applied Materials, Inc. Endpoint system for electro-chemical mechanical polishing
US7258602B2 (en) 2003-10-22 2007-08-21 Iv Technologies Co., Ltd. Polishing pad having grooved window therein and method of forming the same
KR101152747B1 (ko) 2003-10-31 2012-06-18 어플라이드 머티어리얼스, 인코포레이티드 마찰 센서를 이용한 폴리싱 종료점 탐지 시스템 및 방법
US6984163B2 (en) 2003-11-25 2006-01-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with high optical transmission window
US7132033B2 (en) 2004-02-27 2006-11-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a layered polishing pad
CN1926666A (zh) 2004-03-11 2007-03-07 东洋橡胶工业株式会社 研磨垫及半导体器件的制造方法
USD559063S1 (en) 2004-03-17 2008-01-08 Jsr Corporation Polishing pad
USD559064S1 (en) 2004-03-17 2008-01-08 Jsr Corporation Polishing pad
US7204742B2 (en) 2004-03-25 2007-04-17 Cabot Microelectronics Corporation Polishing pad comprising hydrophobic region and endpoint detection port
US6986705B2 (en) 2004-04-05 2006-01-17 Rimpad Tech Ltd. Polishing pad and method of making same
CN2841246Y (zh) * 2004-04-21 2006-11-29 应用材料股份有限公司 研磨垫
EP1739729B1 (en) 2004-04-23 2012-03-28 JSR Corporation Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer
KR100737201B1 (ko) 2004-04-28 2007-07-10 제이에스알 가부시끼가이샤 화학 기계 연마 패드, 그 제조 방법 및 반도체 웨이퍼의화학 기계 연마 방법
US7354334B1 (en) 2004-05-07 2008-04-08 Applied Materials, Inc. Reducing polishing pad deformation
US7018581B2 (en) * 2004-06-10 2006-03-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a polishing pad with reduced stress window
US7252871B2 (en) 2004-06-16 2007-08-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad having a pressure relief channel
US7182670B2 (en) 2004-09-22 2007-02-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having a streamlined windowpane
TWD111897S1 (zh) 2004-10-05 2006-07-11 股份有限公司 研磨用墊片
USD559648S1 (en) 2004-10-05 2008-01-15 Jsr Corporation Polishing pad
USD560457S1 (en) 2004-10-05 2008-01-29 Jsr Corporation Polishing pad
US20060089095A1 (en) 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089094A1 (en) 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
KR100953928B1 (ko) 2004-12-10 2010-04-23 도요 고무 고교 가부시키가이샤 연마 패드 및 연마 패드의 제조 방법
TWI385050B (zh) 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
WO2006089293A1 (en) 2005-02-18 2006-08-24 Neopad Technologies Corporation Customized polishing pads for cmp and methods of fabrication and use thereof
US7179159B2 (en) 2005-05-02 2007-02-20 Applied Materials, Inc. Materials for chemical mechanical polishing
US20060291530A1 (en) 2005-06-23 2006-12-28 Alexander Tregub Treatment of CMP pad window to improve transmittance
US20070049169A1 (en) 2005-08-02 2007-03-01 Vaidya Neha P Nonwoven polishing pads for chemical mechanical polishing
US20070037487A1 (en) 2005-08-10 2007-02-15 Kuo Charles C Polishing pad having a sealed pressure relief channel
US7169017B1 (en) 2005-08-10 2007-01-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad having a window with reduced surface roughness
TW200709892A (en) 2005-08-18 2007-03-16 Rohm & Haas Elect Mat Transparent polishing pad
US7306507B2 (en) 2005-08-22 2007-12-11 Applied Materials, Inc. Polishing pad assembly with glass or crystalline window
US7210980B2 (en) 2005-08-26 2007-05-01 Applied Materials, Inc. Sealed polishing pad, system and methods
TWI288048B (en) 2005-10-20 2007-10-11 Iv Technologies Co Ltd A polishing pad and producing method thereof
CN101244535B (zh) 2006-02-15 2012-06-13 应用材料公司 抛光仓
US7621798B1 (en) 2006-03-07 2009-11-24 Applied Materials, Inc. Reducing polishing pad deformation
US7497763B2 (en) 2006-03-27 2009-03-03 Freescale Semiconductor, Inc. Polishing pad, a polishing apparatus, and a process for using the polishing pad
US7179151B1 (en) 2006-03-27 2007-02-20 Freescale Semiconductor, Inc. Polishing pad, a polishing apparatus, and a process for using the polishing pad
JP2007260827A (ja) * 2006-03-28 2007-10-11 Toyo Tire & Rubber Co Ltd 研磨パッドの製造方法
JP5110677B2 (ja) 2006-05-17 2012-12-26 東洋ゴム工業株式会社 研磨パッド
JP2007307639A (ja) * 2006-05-17 2007-11-29 Toyo Tire & Rubber Co Ltd 研磨パッド
US7942724B2 (en) * 2006-07-03 2011-05-17 Applied Materials, Inc. Polishing pad with window having multiple portions
JP2008100331A (ja) * 2006-10-20 2008-05-01 Toyo Tire & Rubber Co Ltd 長尺研磨パッドの製造方法
JP2008226911A (ja) * 2007-03-08 2008-09-25 Jsr Corp 化学機械研磨用パッド、化学機械研磨用積層体パッド、および化学機械研磨方法
WO2008154185A2 (en) 2007-06-08 2008-12-18 Applied Materials, Inc. Thin polishing pad with window and molding process
US7455571B1 (en) 2007-06-20 2008-11-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Window polishing pad
WO2009070352A1 (en) 2007-11-30 2009-06-04 Innopad, Inc. Chemical-mechanical planarization pad having end point detection window
JP2009224384A (ja) 2008-03-13 2009-10-01 Toyo Tire & Rubber Co Ltd 研磨パッド及び半導体デバイスの製造方法
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
CN102089122A (zh) 2008-05-15 2011-06-08 3M创新有限公司 具有终点窗口的抛光垫以及使用其的系统和方法
US20090305610A1 (en) 2008-06-06 2009-12-10 Applied Materials, Inc. Multiple window pad assembly
US7967661B2 (en) 2008-06-19 2011-06-28 Micron Technology, Inc. Systems and pads for planarizing microelectronic workpieces and associated methods of use and manufacture

Also Published As

Publication number Publication date
IL220649A (en) 2016-10-31
TW201143985A (en) 2011-12-16
EP2523777B1 (en) 2015-12-02
JP5820869B2 (ja) 2015-11-24
KR20120135210A (ko) 2012-12-12
US20110171883A1 (en) 2011-07-14
KR101495145B1 (ko) 2015-02-24
JP5503019B2 (ja) 2014-05-28
TWI490083B (zh) 2015-07-01
IL220649A0 (en) 2012-08-30
CN102770239A (zh) 2012-11-07
CN102770239B (zh) 2016-04-20
US9017140B2 (en) 2015-04-28
EP2523777A1 (en) 2012-11-21
JP2014050959A (ja) 2014-03-20
JP2015096293A (ja) 2015-05-21
WO2011088057A1 (en) 2011-07-21
JP2013517146A (ja) 2013-05-16
SG182327A1 (en) 2012-08-30
SG10201408738RA (en) 2015-02-27

Similar Documents

Publication Publication Date Title
MY165538A (en) Cmp pad with local area transparency
USD712545S1 (en) Wound dressing
USD712550S1 (en) Wound dressing
USD712548S1 (en) Wound dressing
USD723703S1 (en) Wound dressing
USD723704S1 (en) Wound dressing
USD754115S1 (en) Mobile phone dual case with adhesive layer for detachably mounting on a surface
USD674587S1 (en) Dual sided adhesive heel pad
WO2011129959A3 (en) Molding windows in thin pads
MY178773A (en) Polishing pad having polishing surface with continuous protrusions having tapered sidewalls
TW201614875A (en) Light emitting device and method for manufacturing thereof
WO2011142975A3 (en) Pad window insert
USD731448S1 (en) Polishing pad for substrate polishing apparatus
WO2015116520A3 (en) Therapeutic wound dressing with solid copper material
TW200709894A (en) Multi-layer polishing pad material for CMP
GB2509650A (en) Slideable and abrasion resistant flexible impact absorbing cusioning pads, clothing incorporating such pads, and methods of making and using
TWD122862S1 (zh) 纜線管理裝置(一)
TW201614031A (en) Photocrosslinkable transparent adhesive material, transparent adhesive material layered body, and layered body for constituting optical device
USD812112S1 (en) Floor sanding sponge pads
WO2014080400A3 (en) Apparatus and methods for applying pressure to a face of a subject
WO2012031591A3 (de) Bremsscheibe und vorrichtung zum prüfen der restdicke einer bremsscheibe
WO2015008210A3 (en) Flexible abrasive for polishing surfaces
AR076574A1 (es) Articulo absorbente envuelto
EP2519941A4 (en) COMPOSITE LIGHT ORIENTATION FILM FOR ENERGY SAVING SIGNAL
CN102815064A (zh) 一种用于复合材料成型的透气离型保护膜