CN102770239B - 具有局部区域透明部的化学机械抛光垫 - Google Patents
具有局部区域透明部的化学机械抛光垫 Download PDFInfo
- Publication number
- CN102770239B CN102770239B CN201180005898.6A CN201180005898A CN102770239B CN 102770239 B CN102770239 B CN 102770239B CN 201180005898 A CN201180005898 A CN 201180005898A CN 102770239 B CN102770239 B CN 102770239B
- Authority
- CN
- China
- Prior art keywords
- polishing
- polishing pad
- hyalomere
- polyureas
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
- B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/12—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with apertures for inspecting the surface to be abraded
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/657,135 | 2010-01-13 | ||
| US12/657,135 US9017140B2 (en) | 2010-01-13 | 2010-01-13 | CMP pad with local area transparency |
| PCT/US2011/020870 WO2011088057A1 (en) | 2010-01-13 | 2011-01-11 | Cmp pad with local area transparency |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102770239A CN102770239A (zh) | 2012-11-07 |
| CN102770239B true CN102770239B (zh) | 2016-04-20 |
Family
ID=43896755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180005898.6A Active CN102770239B (zh) | 2010-01-13 | 2011-01-11 | 具有局部区域透明部的化学机械抛光垫 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US9017140B2 (https=) |
| EP (1) | EP2523777B1 (https=) |
| JP (3) | JP5503019B2 (https=) |
| KR (1) | KR101495145B1 (https=) |
| CN (1) | CN102770239B (https=) |
| IL (1) | IL220649A (https=) |
| MY (1) | MY165538A (https=) |
| SG (2) | SG10201408738RA (https=) |
| TW (1) | TWI490083B (https=) |
| WO (1) | WO2011088057A1 (https=) |
Families Citing this family (64)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9156124B2 (en) * | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
| US8657653B2 (en) | 2010-09-30 | 2014-02-25 | Nexplanar Corporation | Homogeneous polishing pad for eddy current end-point detection |
| US8628384B2 (en) * | 2010-09-30 | 2014-01-14 | Nexplanar Corporation | Polishing pad for eddy current end-point detection |
| US8535115B2 (en) * | 2011-01-28 | 2013-09-17 | Applied Materials, Inc. | Gathering spectra from multiple optical heads |
| US8920219B2 (en) * | 2011-07-15 | 2014-12-30 | Nexplanar Corporation | Polishing pad with alignment aperture |
| US20130205679A1 (en) * | 2012-02-14 | 2013-08-15 | Innopad, Inc. | Method of manufacturing a chemical mechanical planarization pad |
| US8986585B2 (en) * | 2012-03-22 | 2015-03-24 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of manufacturing chemical mechanical polishing layers having a window |
| US9156125B2 (en) | 2012-04-11 | 2015-10-13 | Cabot Microelectronics Corporation | Polishing pad with light-stable light-transmitting region |
| US20140120802A1 (en) * | 2012-10-31 | 2014-05-01 | Wayne O. Duescher | Abrasive platen wafer surface optical monitoring system |
| US9649742B2 (en) | 2013-01-22 | 2017-05-16 | Nexplanar Corporation | Polishing pad having polishing surface with continuous protrusions |
| US10160092B2 (en) * | 2013-03-14 | 2018-12-25 | Cabot Microelectronics Corporation | Polishing pad having polishing surface with continuous protrusions having tapered sidewalls |
| US9216489B2 (en) * | 2014-03-28 | 2015-12-22 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with endpoint detection window |
| US9259820B2 (en) * | 2014-03-28 | 2016-02-16 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with polishing layer and window |
| US9238294B2 (en) * | 2014-06-18 | 2016-01-19 | Nexplanar Corporation | Polishing pad having porogens with liquid filler |
| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| KR20240015167A (ko) | 2014-10-17 | 2024-02-02 | 어플라이드 머티어리얼스, 인코포레이티드 | 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 cmp 패드 구성 |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
| US20160144477A1 (en) * | 2014-11-21 | 2016-05-26 | Diane Scott | Coated compressive subpad for chemical mechanical polishing |
| US10946495B2 (en) * | 2015-01-30 | 2021-03-16 | Cmc Materials, Inc. | Low density polishing pad |
| US9475168B2 (en) * | 2015-03-26 | 2016-10-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad window |
| TWI754275B (zh) * | 2015-10-16 | 2022-02-01 | 美商應用材料股份有限公司 | 拋光墊及形成其之方法 |
| JP6940495B2 (ja) | 2015-10-30 | 2021-09-29 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法 |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| KR102629800B1 (ko) | 2016-01-19 | 2024-01-29 | 어플라이드 머티어리얼스, 인코포레이티드 | 다공성 화학적 기계적 연마 패드들 |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| US10213894B2 (en) * | 2016-02-26 | 2019-02-26 | Applied Materials, Inc. | Method of placing window in thin polishing pad |
| TWI593511B (zh) | 2016-06-08 | 2017-08-01 | 智勝科技股份有限公司 | 研磨墊及研磨方法 |
| WO2018045039A1 (en) * | 2016-08-31 | 2018-03-08 | Applied Materials, Inc. | Polishing system with annular platen or polishing pad |
| SG11201906131WA (en) * | 2017-01-20 | 2019-08-27 | Applied Materials Inc | A thin plastic polishing article for cmp applications |
| US20180265989A1 (en) * | 2017-03-17 | 2018-09-20 | Toshiba Memory Corporation | Substrate treatment apparatus and substrate treatment method |
| JP6360586B1 (ja) * | 2017-04-13 | 2018-07-18 | 三菱電線工業株式会社 | Cmp装置のウエハ保持用の弾性膜 |
| US20180304539A1 (en) | 2017-04-21 | 2018-10-25 | Applied Materials, Inc. | Energy delivery system with array of energy sources for an additive manufacturing apparatus |
| KR101966809B1 (ko) * | 2017-05-18 | 2019-08-13 | 세메스 주식회사 | 기판 연마 장치 및 기판 연마 방법 |
| KR20200014364A (ko) * | 2017-06-01 | 2020-02-10 | 도쿄엘렉트론가부시키가이샤 | 게터링층 형성 장치, 게터링층 형성 방법 및 컴퓨터 기억 매체 |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| US11072050B2 (en) | 2017-08-04 | 2021-07-27 | Applied Materials, Inc. | Polishing pad with window and manufacturing methods thereof |
| WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
| JP6948878B2 (ja) * | 2017-08-22 | 2021-10-13 | ラピスセミコンダクタ株式会社 | 半導体製造装置及び半導体基板の研磨方法 |
| US10636761B2 (en) * | 2017-08-29 | 2020-04-28 | Electronics And Telecommunications Reearch Institute | Method of fabricating a semiconductor package |
| US10465097B2 (en) * | 2017-11-16 | 2019-11-05 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Aliphatic UV cured polyurethane optical endpoint detection windows with high UV transparency for CMP polishing pads |
| US11325221B2 (en) * | 2017-11-16 | 2022-05-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with multipurpose composite window |
| US11192215B2 (en) * | 2017-11-16 | 2021-12-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with pad wear indicator |
| EP3790706A4 (en) | 2018-05-07 | 2022-02-16 | Applied Materials, Inc. | CHEMICAL MECHANICAL POLISHING PADS WITH ADJUSTABLE HYDROPHIL AND ZETA POTENTIAL |
| WO2020050932A1 (en) | 2018-09-04 | 2020-03-12 | Applied Materials, Inc. | Formulations for advanced polishing pads |
| US12138735B2 (en) * | 2018-11-28 | 2024-11-12 | Taiwan Semiconductor Manufacturing Co., Ltd. | Multi-layered windows for use in chemical-mechanical planarization systems |
| KR102674027B1 (ko) | 2019-01-29 | 2024-06-12 | 삼성전자주식회사 | 재생 연마패드 |
| US11851570B2 (en) | 2019-04-12 | 2023-12-26 | Applied Materials, Inc. | Anionic polishing pads formed by printing processes |
| US11813712B2 (en) | 2019-12-20 | 2023-11-14 | Applied Materials, Inc. | Polishing pads having selectively arranged porosity |
| KR102142236B1 (ko) * | 2020-01-10 | 2020-08-06 | (주)제이쓰리 | 초평탄화 형상제어 웨이퍼 가공장치 |
| KR20220161318A (ko) * | 2020-03-31 | 2022-12-06 | 가부시끼가이샤 도꾸야마 | Cmp 연마 패드용 중공 마이크로벌룬 |
| US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
| TW202225286A (zh) * | 2020-09-30 | 2022-07-01 | 日商富士紡控股股份有限公司 | 研磨墊及研磨墊之製造方法 |
| WO2022159810A1 (en) * | 2021-01-25 | 2022-07-28 | Cmc Materials, Inc. | Endpoint window with controlled texture surface |
| US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
| US12491603B2 (en) * | 2021-03-03 | 2025-12-09 | Applied Materials, Inc. | Passive acoustic monitoring and acoustic sensors for chemical mechanical polishing |
| CN115122232B (zh) * | 2021-03-29 | 2024-08-20 | 万华化学集团电子材料有限公司 | 一种微孔聚氨酯抛光垫的制备方法、抛光垫及其应用 |
| KR102624629B1 (ko) | 2021-11-19 | 2024-01-15 | 에스케이하이닉스 주식회사 | 윈도우 삽입형 연마패드 및 이의 제조방법 |
| JP7696822B2 (ja) * | 2021-12-28 | 2025-06-23 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
| US20230398659A1 (en) * | 2022-06-09 | 2023-12-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Polishing Pad for Chemical Mechanical Polishing and Method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0663265A1 (en) * | 1993-12-22 | 1995-07-19 | International Business Machines Corporation | In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing |
| US20010036805A1 (en) * | 1995-03-28 | 2001-11-01 | Applied Materials, Inc., A Delaware Corporation | Forming a transparent window in a polishing pad for a chemical mehcanical polishing apparatus |
| CN2841246Y (zh) * | 2004-04-21 | 2006-11-29 | 应用材料股份有限公司 | 研磨垫 |
| US20060276109A1 (en) * | 2003-03-24 | 2006-12-07 | Roy Pradip K | Customized polishing pads for CMP and methods of fabrication and use thereof |
Family Cites Families (135)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5196353A (en) | 1992-01-03 | 1993-03-23 | Micron Technology, Inc. | Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer |
| US6614529B1 (en) | 1992-12-28 | 2003-09-02 | Applied Materials, Inc. | In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization |
| US5658183A (en) | 1993-08-25 | 1997-08-19 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing including optical monitoring |
| JP3270282B2 (ja) | 1994-02-21 | 2002-04-02 | 株式会社東芝 | 半導体製造装置及び半導体装置の製造方法 |
| JP3313505B2 (ja) | 1994-04-14 | 2002-08-12 | 株式会社日立製作所 | 研磨加工法 |
| US6876454B1 (en) | 1995-03-28 | 2005-04-05 | Applied Materials, Inc. | Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations |
| US6676717B1 (en) | 1995-03-28 | 2004-01-13 | Applied Materials Inc | Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations |
| US5964643A (en) | 1995-03-28 | 1999-10-12 | Applied Materials, Inc. | Apparatus and method for in-situ monitoring of chemical mechanical polishing operations |
| US6537133B1 (en) | 1995-03-28 | 2003-03-25 | Applied Materials, Inc. | Method for in-situ endpoint detection for chemical mechanical polishing operations |
| US6719818B1 (en) | 1995-03-28 | 2004-04-13 | Applied Materials, Inc. | Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations |
| US5838447A (en) | 1995-07-20 | 1998-11-17 | Ebara Corporation | Polishing apparatus including thickness or flatness detector |
| US5605760A (en) | 1995-08-21 | 1997-02-25 | Rodel, Inc. | Polishing pads |
| US5738574A (en) | 1995-10-27 | 1998-04-14 | Applied Materials, Inc. | Continuous processing system for chemical mechanical polishing |
| US5609517A (en) | 1995-11-20 | 1997-03-11 | International Business Machines Corporation | Composite polishing pad |
| US5733176A (en) | 1996-05-24 | 1998-03-31 | Micron Technology, Inc. | Polishing pad and method of use |
| US5872633A (en) | 1996-07-26 | 1999-02-16 | Speedfam Corporation | Methods and apparatus for detecting removal of thin film layers during planarization |
| US6648733B2 (en) | 1997-04-04 | 2003-11-18 | Rodel Holdings, Inc. | Polishing pads and methods relating thereto |
| US6068539A (en) | 1998-03-10 | 2000-05-30 | Lam Research Corporation | Wafer polishing device with movable window |
| US6832950B2 (en) | 2002-10-28 | 2004-12-21 | Applied Materials, Inc. | Polishing pad with window |
| US6994607B2 (en) | 2001-12-28 | 2006-02-07 | Applied Materials, Inc. | Polishing pad with window |
| US6716085B2 (en) | 2001-12-28 | 2004-04-06 | Applied Materials Inc. | Polishing pad with transparent window |
| US20040082271A1 (en) | 1999-01-25 | 2004-04-29 | Wiswesser Andreas Norbert | Polishing pad with window |
| WO2000060650A1 (en) | 1999-03-31 | 2000-10-12 | Nikon Corporation | Polishing body, polisher, method for adjusting polisher, method for measuring thickness of polished film or end point of polishing, method for producing semiconductor device |
| US6146242A (en) | 1999-06-11 | 2000-11-14 | Strasbaugh, Inc. | Optical view port for chemical mechanical planarization endpoint detection |
| US6171181B1 (en) | 1999-08-17 | 2001-01-09 | Rodel Holdings, Inc. | Molded polishing pad having integral window |
| WO2001015861A1 (en) | 1999-08-27 | 2001-03-08 | Asahi Kasei Kabushiki Kaisha | Polishing pad and polisher |
| US6524164B1 (en) | 1999-09-14 | 2003-02-25 | Applied Materials, Inc. | Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus |
| US6454630B1 (en) | 1999-09-14 | 2002-09-24 | Applied Materials, Inc. | Rotatable platen having a transparent window for a chemical mechanical polishing apparatus and method of making the same |
| EP1224060B1 (en) | 1999-09-29 | 2004-06-23 | Rodel Holdings, Inc. | Polishing pad |
| US6726528B2 (en) | 2002-05-14 | 2004-04-27 | Strasbaugh | Polishing pad with optical sensor |
| JP2003524300A (ja) | 2000-02-25 | 2003-08-12 | ロデール ホールディングス インコーポレイテッド | 透明部分のある研磨パッド |
| EP1263548A1 (en) | 2000-03-15 | 2002-12-11 | Rodel Holdings, Inc. | Window portion with an adjusted rate of wear |
| US8485862B2 (en) | 2000-05-19 | 2013-07-16 | Applied Materials, Inc. | Polishing pad for endpoint detection and related methods |
| US6685537B1 (en) | 2000-06-05 | 2004-02-03 | Speedfam-Ipec Corporation | Polishing pad window for a chemical mechanical polishing tool |
| US6612901B1 (en) | 2000-06-07 | 2003-09-02 | Micron Technology, Inc. | Apparatus for in-situ optical endpointing of web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| US6485354B1 (en) | 2000-06-09 | 2002-11-26 | Strasbaugh | Polishing pad with built-in optical sensor |
| US6428386B1 (en) | 2000-06-16 | 2002-08-06 | Micron Technology, Inc. | Planarizing pads, planarizing machines, and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| JP2002001647A (ja) * | 2000-06-19 | 2002-01-08 | Rodel Nitta Co | 研磨パッド |
| CN1250372C (zh) | 2000-09-29 | 2006-04-12 | 斯特拉斯保 | 带有内置光学传感器的抛光垫 |
| WO2002030617A1 (en) | 2000-10-06 | 2002-04-18 | Cabot Microelectronics Corporation | Polishing pad comprising a filled translucent region |
| US20020072296A1 (en) | 2000-11-29 | 2002-06-13 | Muilenburg Michael J. | Abrasive article having a window system for polishing wafers, and methods |
| US6623331B2 (en) | 2001-02-16 | 2003-09-23 | Cabot Microelectronics Corporation | Polishing disk with end-point detection port |
| US6840843B2 (en) | 2001-03-01 | 2005-01-11 | Cabot Microelectronics Corporation | Method for manufacturing a polishing pad having a compressed translucent region |
| US20020137431A1 (en) | 2001-03-23 | 2002-09-26 | Labunsky Michael A. | Methods and apparatus for polishing and planarization |
| US6641470B1 (en) | 2001-03-30 | 2003-11-04 | Lam Research Corporation | Apparatus for accurate endpoint detection in supported polishing pads |
| KR100858392B1 (ko) | 2001-04-25 | 2008-09-11 | 제이에스알 가부시끼가이샤 | 반도체 웨이퍼용 연마 패드와, 이를 구비한 반도체웨이퍼용 연마 적층체와, 반도체 웨이퍼의 연마 방법 |
| JP4131632B2 (ja) | 2001-06-15 | 2008-08-13 | 株式会社荏原製作所 | ポリッシング装置及び研磨パッド |
| JP4570286B2 (ja) | 2001-07-03 | 2010-10-27 | ニッタ・ハース株式会社 | 研磨パッド |
| JP2003133270A (ja) | 2001-10-26 | 2003-05-09 | Jsr Corp | 化学機械研磨用窓材及び研磨パッド |
| US6722249B2 (en) | 2001-11-06 | 2004-04-20 | Rodel Holdings, Inc | Method of fabricating a polishing pad having an optical window |
| US6702866B2 (en) | 2002-01-10 | 2004-03-09 | Speedfam-Ipec Corporation | Homogeneous fixed abrasive polishing pad |
| US6935922B2 (en) | 2002-02-04 | 2005-08-30 | Kla-Tencor Technologies Corp. | Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing |
| US7001242B2 (en) | 2002-02-06 | 2006-02-21 | Applied Materials, Inc. | Method and apparatus of eddy current monitoring for chemical mechanical polishing |
| US6875077B2 (en) | 2002-03-18 | 2005-04-05 | Raytech Innovative Solutions, Inc. | Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making |
| US6524176B1 (en) | 2002-03-25 | 2003-02-25 | Macronix International Co. Ltd. | Polishing pad |
| US20030207661A1 (en) * | 2002-05-01 | 2003-11-06 | Alexander Tregub | Annealing of CMP polishing pads |
| US6752690B1 (en) * | 2002-06-12 | 2004-06-22 | Clinton O. Fruitman | Method of making polishing pad for planarization of semiconductor wafers |
| US20050148183A1 (en) | 2002-08-30 | 2005-07-07 | Toray Industries, Inc. | Polishing pad, platen hole cover, polishing apparatus, polishing method, and method for fabricating semiconductor device |
| US20070010169A1 (en) | 2002-09-25 | 2007-01-11 | Ppg Industries Ohio, Inc. | Polishing pad with window for planarization |
| KR20050052513A (ko) | 2002-09-25 | 2005-06-02 | 피피지 인더스트리즈 오하이오 인코포레이티드 | 평탄화를 위한 윈도를 가진 연마 패드 |
| US7267607B2 (en) | 2002-10-28 | 2007-09-11 | Cabot Microelectronics Corporation | Transparent microporous materials for CMP |
| US7435165B2 (en) | 2002-10-28 | 2008-10-14 | Cabot Microelectronics Corporation | Transparent microporous materials for CMP |
| TWI220405B (en) | 2002-11-19 | 2004-08-21 | Iv Technologies Co Ltd | Method of fabricating a polishing pad having a detection window thereon |
| KR101047933B1 (ko) | 2002-11-27 | 2011-07-11 | 도요 고무 고교 가부시키가이샤 | 연마 패드 및 반도체 장치의 제조 방법 |
| US6806100B1 (en) | 2002-12-24 | 2004-10-19 | Lam Research Corporation | Molded end point detection window for chemical mechanical planarization |
| US6676483B1 (en) | 2003-02-03 | 2004-01-13 | Rodel Holdings, Inc. | Anti-scattering layer for polishing pad windows |
| US6960120B2 (en) | 2003-02-10 | 2005-11-01 | Cabot Microelectronics Corporation | CMP pad with composite transparent window |
| US6832947B2 (en) * | 2003-02-10 | 2004-12-21 | Cabot Microelectronics Corporation | CMP pad with composite transparent window |
| US7377840B2 (en) | 2004-07-21 | 2008-05-27 | Neopad Technologies Corporation | Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs |
| TWI286964B (en) | 2003-03-25 | 2007-09-21 | Neopad Technologies Corp | Customized polish pads for chemical mechanical planarization |
| US8864859B2 (en) | 2003-03-25 | 2014-10-21 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
| EP1466699A1 (en) | 2003-04-09 | 2004-10-13 | JSR Corporation | Abrasive pad, method and metal mold for manufacturing the same, and semiconductor wafer polishing method |
| US7238097B2 (en) | 2003-04-11 | 2007-07-03 | Nihon Microcoating Co., Ltd. | Polishing pad and method of producing same |
| US20040209066A1 (en) | 2003-04-17 | 2004-10-21 | Swisher Robert G. | Polishing pad with window for planarization |
| KR20040093402A (ko) | 2003-04-22 | 2004-11-05 | 제이에스알 가부시끼가이샤 | 연마 패드 및 반도체 웨이퍼의 연마 방법 |
| KR100532440B1 (ko) | 2003-06-05 | 2005-11-30 | 삼성전자주식회사 | 윈도로의 유체의 침투를 막는 실링 장벽부를 가지는 화학기계적 연마 장비에 사용되는 연마 패드 |
| KR100541545B1 (ko) | 2003-06-16 | 2006-01-11 | 삼성전자주식회사 | 화학기계적 연마 장비의 연마 테이블 |
| US6884156B2 (en) | 2003-06-17 | 2005-04-26 | Cabot Microelectronics Corporation | Multi-layer polishing pad material for CMP |
| US6997777B2 (en) | 2003-06-17 | 2006-02-14 | Cabot Microelectronics Corporation | Ultrasonic welding method for the manufacture of a polishing pad comprising an optically transmissive region |
| KR100526877B1 (ko) | 2003-06-23 | 2005-11-09 | 삼성전자주식회사 | 반도체 웨이퍼용 cmp 설비의 폴리싱 패드 |
| KR100627202B1 (ko) | 2003-07-17 | 2006-09-25 | 제이에스알 가부시끼가이샤 | 화학 기계 연마용 패드 및 화학 기계 연마 방법 |
| US7195539B2 (en) | 2003-09-19 | 2007-03-27 | Cabot Microelectronics Coporation | Polishing pad with recessed window |
| US7264536B2 (en) | 2003-09-23 | 2007-09-04 | Applied Materials, Inc. | Polishing pad with window |
| US8066552B2 (en) | 2003-10-03 | 2011-11-29 | Applied Materials, Inc. | Multi-layer polishing pad for low-pressure polishing |
| US20050173259A1 (en) | 2004-02-06 | 2005-08-11 | Applied Materials, Inc. | Endpoint system for electro-chemical mechanical polishing |
| US7258602B2 (en) | 2003-10-22 | 2007-08-21 | Iv Technologies Co., Ltd. | Polishing pad having grooved window therein and method of forming the same |
| KR101152747B1 (ko) | 2003-10-31 | 2012-06-18 | 어플라이드 머티어리얼스, 인코포레이티드 | 마찰 센서를 이용한 폴리싱 종료점 탐지 시스템 및 방법 |
| US6984163B2 (en) | 2003-11-25 | 2006-01-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with high optical transmission window |
| US7132033B2 (en) | 2004-02-27 | 2006-11-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of forming a layered polishing pad |
| CN1926666A (zh) | 2004-03-11 | 2007-03-07 | 东洋橡胶工业株式会社 | 研磨垫及半导体器件的制造方法 |
| USD559063S1 (en) | 2004-03-17 | 2008-01-08 | Jsr Corporation | Polishing pad |
| USD559064S1 (en) | 2004-03-17 | 2008-01-08 | Jsr Corporation | Polishing pad |
| US7204742B2 (en) | 2004-03-25 | 2007-04-17 | Cabot Microelectronics Corporation | Polishing pad comprising hydrophobic region and endpoint detection port |
| US6986705B2 (en) | 2004-04-05 | 2006-01-17 | Rimpad Tech Ltd. | Polishing pad and method of making same |
| EP1739729B1 (en) | 2004-04-23 | 2012-03-28 | JSR Corporation | Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer |
| KR100737201B1 (ko) | 2004-04-28 | 2007-07-10 | 제이에스알 가부시끼가이샤 | 화학 기계 연마 패드, 그 제조 방법 및 반도체 웨이퍼의화학 기계 연마 방법 |
| US7354334B1 (en) | 2004-05-07 | 2008-04-08 | Applied Materials, Inc. | Reducing polishing pad deformation |
| US7018581B2 (en) * | 2004-06-10 | 2006-03-28 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of forming a polishing pad with reduced stress window |
| US7252871B2 (en) | 2004-06-16 | 2007-08-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad having a pressure relief channel |
| US7182670B2 (en) | 2004-09-22 | 2007-02-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | CMP pad having a streamlined windowpane |
| TWD111897S1 (zh) | 2004-10-05 | 2006-07-11 | 股份有限公司 | 研磨用墊片 |
| USD559648S1 (en) | 2004-10-05 | 2008-01-15 | Jsr Corporation | Polishing pad |
| USD560457S1 (en) | 2004-10-05 | 2008-01-29 | Jsr Corporation | Polishing pad |
| US20060089095A1 (en) | 2004-10-27 | 2006-04-27 | Swisher Robert G | Polyurethane urea polishing pad |
| US20060089094A1 (en) | 2004-10-27 | 2006-04-27 | Swisher Robert G | Polyurethane urea polishing pad |
| KR100953928B1 (ko) | 2004-12-10 | 2010-04-23 | 도요 고무 고교 가부시키가이샤 | 연마 패드 및 연마 패드의 제조 방법 |
| TWI385050B (zh) | 2005-02-18 | 2013-02-11 | Nexplanar Corp | 用於cmp之特製拋光墊及其製造方法及其用途 |
| WO2006089293A1 (en) | 2005-02-18 | 2006-08-24 | Neopad Technologies Corporation | Customized polishing pads for cmp and methods of fabrication and use thereof |
| US7179159B2 (en) | 2005-05-02 | 2007-02-20 | Applied Materials, Inc. | Materials for chemical mechanical polishing |
| US20060291530A1 (en) | 2005-06-23 | 2006-12-28 | Alexander Tregub | Treatment of CMP pad window to improve transmittance |
| US20070049169A1 (en) | 2005-08-02 | 2007-03-01 | Vaidya Neha P | Nonwoven polishing pads for chemical mechanical polishing |
| US20070037487A1 (en) | 2005-08-10 | 2007-02-15 | Kuo Charles C | Polishing pad having a sealed pressure relief channel |
| US7169017B1 (en) | 2005-08-10 | 2007-01-30 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad having a window with reduced surface roughness |
| TW200709892A (en) | 2005-08-18 | 2007-03-16 | Rohm & Haas Elect Mat | Transparent polishing pad |
| US7306507B2 (en) | 2005-08-22 | 2007-12-11 | Applied Materials, Inc. | Polishing pad assembly with glass or crystalline window |
| US7210980B2 (en) | 2005-08-26 | 2007-05-01 | Applied Materials, Inc. | Sealed polishing pad, system and methods |
| TWI288048B (en) | 2005-10-20 | 2007-10-11 | Iv Technologies Co Ltd | A polishing pad and producing method thereof |
| CN101244535B (zh) | 2006-02-15 | 2012-06-13 | 应用材料公司 | 抛光仓 |
| US7621798B1 (en) | 2006-03-07 | 2009-11-24 | Applied Materials, Inc. | Reducing polishing pad deformation |
| US7497763B2 (en) | 2006-03-27 | 2009-03-03 | Freescale Semiconductor, Inc. | Polishing pad, a polishing apparatus, and a process for using the polishing pad |
| US7179151B1 (en) | 2006-03-27 | 2007-02-20 | Freescale Semiconductor, Inc. | Polishing pad, a polishing apparatus, and a process for using the polishing pad |
| JP2007260827A (ja) * | 2006-03-28 | 2007-10-11 | Toyo Tire & Rubber Co Ltd | 研磨パッドの製造方法 |
| JP5110677B2 (ja) | 2006-05-17 | 2012-12-26 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP2007307639A (ja) * | 2006-05-17 | 2007-11-29 | Toyo Tire & Rubber Co Ltd | 研磨パッド |
| US7942724B2 (en) * | 2006-07-03 | 2011-05-17 | Applied Materials, Inc. | Polishing pad with window having multiple portions |
| JP2008100331A (ja) * | 2006-10-20 | 2008-05-01 | Toyo Tire & Rubber Co Ltd | 長尺研磨パッドの製造方法 |
| JP2008226911A (ja) * | 2007-03-08 | 2008-09-25 | Jsr Corp | 化学機械研磨用パッド、化学機械研磨用積層体パッド、および化学機械研磨方法 |
| WO2008154185A2 (en) | 2007-06-08 | 2008-12-18 | Applied Materials, Inc. | Thin polishing pad with window and molding process |
| US7455571B1 (en) | 2007-06-20 | 2008-11-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Window polishing pad |
| WO2009070352A1 (en) | 2007-11-30 | 2009-06-04 | Innopad, Inc. | Chemical-mechanical planarization pad having end point detection window |
| JP2009224384A (ja) | 2008-03-13 | 2009-10-01 | Toyo Tire & Rubber Co Ltd | 研磨パッド及び半導体デバイスの製造方法 |
| US9180570B2 (en) | 2008-03-14 | 2015-11-10 | Nexplanar Corporation | Grooved CMP pad |
| CN102089122A (zh) | 2008-05-15 | 2011-06-08 | 3M创新有限公司 | 具有终点窗口的抛光垫以及使用其的系统和方法 |
| US20090305610A1 (en) | 2008-06-06 | 2009-12-10 | Applied Materials, Inc. | Multiple window pad assembly |
| US7967661B2 (en) | 2008-06-19 | 2011-06-28 | Micron Technology, Inc. | Systems and pads for planarizing microelectronic workpieces and associated methods of use and manufacture |
-
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- 2011-01-11 EP EP11700493.7A patent/EP2523777B1/en active Active
- 2011-01-11 CN CN201180005898.6A patent/CN102770239B/zh active Active
- 2011-01-11 WO PCT/US2011/020870 patent/WO2011088057A1/en not_active Ceased
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0663265A1 (en) * | 1993-12-22 | 1995-07-19 | International Business Machines Corporation | In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing |
| US20010036805A1 (en) * | 1995-03-28 | 2001-11-01 | Applied Materials, Inc., A Delaware Corporation | Forming a transparent window in a polishing pad for a chemical mehcanical polishing apparatus |
| US20060276109A1 (en) * | 2003-03-24 | 2006-12-07 | Roy Pradip K | Customized polishing pads for CMP and methods of fabrication and use thereof |
| CN2841246Y (zh) * | 2004-04-21 | 2006-11-29 | 应用材料股份有限公司 | 研磨垫 |
Also Published As
| Publication number | Publication date |
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| IL220649A (en) | 2016-10-31 |
| TW201143985A (en) | 2011-12-16 |
| EP2523777B1 (en) | 2015-12-02 |
| JP5820869B2 (ja) | 2015-11-24 |
| KR20120135210A (ko) | 2012-12-12 |
| US20110171883A1 (en) | 2011-07-14 |
| KR101495145B1 (ko) | 2015-02-24 |
| JP5503019B2 (ja) | 2014-05-28 |
| TWI490083B (zh) | 2015-07-01 |
| IL220649A0 (en) | 2012-08-30 |
| CN102770239A (zh) | 2012-11-07 |
| US9017140B2 (en) | 2015-04-28 |
| EP2523777A1 (en) | 2012-11-21 |
| JP2014050959A (ja) | 2014-03-20 |
| JP2015096293A (ja) | 2015-05-21 |
| WO2011088057A1 (en) | 2011-07-21 |
| MY165538A (en) | 2018-04-03 |
| JP2013517146A (ja) | 2013-05-16 |
| SG182327A1 (en) | 2012-08-30 |
| SG10201408738RA (en) | 2015-02-27 |
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