WO2011142975A3 - Pad window insert - Google Patents
Pad window insert Download PDFInfo
- Publication number
- WO2011142975A3 WO2011142975A3 PCT/US2011/034215 US2011034215W WO2011142975A3 WO 2011142975 A3 WO2011142975 A3 WO 2011142975A3 US 2011034215 W US2011034215 W US 2011034215W WO 2011142975 A3 WO2011142975 A3 WO 2011142975A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polishing
- solid light
- transmitting window
- lateral dimension
- layer
- Prior art date
Links
- 238000005498 polishing Methods 0.000 abstract 7
- 239000010410 layer Substances 0.000 abstract 4
- 239000007787 solid Substances 0.000 abstract 4
- 239000012790 adhesive layer Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
- B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020127032411A KR101762936B1 (en) | 2010-05-12 | 2011-04-27 | Pad window insert |
JP2013510125A JP2013526420A (en) | 2010-05-12 | 2011-04-27 | Pad window insert |
KR1020177020536A KR101956848B1 (en) | 2010-05-12 | 2011-04-27 | Polishing pad assembly |
CN201180023970.8A CN102893377B (en) | 2010-05-12 | 2011-04-27 | Pad window insert |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/778,760 US20110281510A1 (en) | 2010-05-12 | 2010-05-12 | Pad Window Insert |
US12/778,760 | 2010-05-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011142975A2 WO2011142975A2 (en) | 2011-11-17 |
WO2011142975A3 true WO2011142975A3 (en) | 2012-03-01 |
Family
ID=44912183
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2011/034215 WO2011142975A2 (en) | 2010-05-12 | 2011-04-27 | Pad window insert |
Country Status (6)
Country | Link |
---|---|
US (1) | US20110281510A1 (en) |
JP (1) | JP2013526420A (en) |
KR (2) | KR101956848B1 (en) |
CN (1) | CN102893377B (en) |
TW (3) | TWI663021B (en) |
WO (1) | WO2011142975A2 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8535115B2 (en) * | 2011-01-28 | 2013-09-17 | Applied Materials, Inc. | Gathering spectra from multiple optical heads |
US8961266B2 (en) * | 2013-03-15 | 2015-02-24 | Applied Materials, Inc. | Polishing pad with secondary window seal |
US9308620B2 (en) * | 2013-09-18 | 2016-04-12 | Texas Instruments Incorporated | Permeated grooving in CMP polishing pads |
US10012494B2 (en) * | 2013-10-25 | 2018-07-03 | Applied Materials, Inc. | Grouping spectral data from polishing substrates |
SG11201608996TA (en) * | 2014-05-02 | 2016-11-29 | 3M Innovative Properties Co | Interrupted structured abrasive article and methods of polishing a workpiece |
SG11201806662WA (en) * | 2016-02-26 | 2018-09-27 | Applied Materials Inc | Window in thin polishing pad |
US10213894B2 (en) * | 2016-02-26 | 2019-02-26 | Applied Materials, Inc. | Method of placing window in thin polishing pad |
JP6883475B2 (en) * | 2017-06-06 | 2021-06-09 | 株式会社荏原製作所 | Polishing table and polishing equipment equipped with it |
JP7015667B2 (en) * | 2017-10-02 | 2022-02-03 | 株式会社ディスコ | Polishing equipment |
JP2020001162A (en) * | 2018-06-28 | 2020-01-09 | 株式会社荏原製作所 | Polishing pad laminate, polishing pad positioning jig, and method of applying polishing pad to polishing table |
US11571782B2 (en) * | 2018-11-28 | 2023-02-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Single bodied platen housing a detection module for CMP systems |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003163191A (en) * | 2001-11-28 | 2003-06-06 | Tokyo Seimitsu Co Ltd | Polishing pad for mechanochemical polishing device |
US20030205325A1 (en) * | 2001-12-12 | 2003-11-06 | Lam Research Corporation | Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection |
US20070190905A1 (en) * | 2004-03-11 | 2007-08-16 | Tetsuo Shimomura | Polishing pad and semiconductor device manufacturing method |
US20080305729A1 (en) * | 2007-06-08 | 2008-12-11 | Applied Materials, Inc. | Thin polishing pad with window and molding process |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5893796A (en) * | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
US6451398B1 (en) * | 1998-11-24 | 2002-09-17 | Michael S. Sylvester | Double-sided self-adhesive reinforced foam tape |
US6235365B1 (en) * | 1998-12-18 | 2001-05-22 | W. R. Grace & Co.-Conn. | Waterproofing membrane having release sheet cutting system |
US20040082271A1 (en) * | 1999-01-25 | 2004-04-29 | Wiswesser Andreas Norbert | Polishing pad with window |
US6190234B1 (en) * | 1999-01-25 | 2001-02-20 | Applied Materials, Inc. | Endpoint detection with light beams of different wavelengths |
JP2001009699A (en) * | 1999-07-05 | 2001-01-16 | Nichiden Mach Ltd | Plane surface grinding device |
US8485862B2 (en) * | 2000-05-19 | 2013-07-16 | Applied Materials, Inc. | Polishing pad for endpoint detection and related methods |
KR100892924B1 (en) * | 2000-12-01 | 2009-04-09 | 도요 고무 고교 가부시키가이샤 | Polishing pad |
US6641470B1 (en) * | 2001-03-30 | 2003-11-04 | Lam Research Corporation | Apparatus for accurate endpoint detection in supported polishing pads |
US6857941B2 (en) * | 2001-06-01 | 2005-02-22 | Applied Materials, Inc. | Multi-phase polishing pad |
US20020193058A1 (en) * | 2001-06-15 | 2002-12-19 | Carter Stephen P. | Polishing apparatus that provides a window |
JP2003133270A (en) * | 2001-10-26 | 2003-05-09 | Jsr Corp | Window material for chemical mechanical polishing and polishing pad |
JP2003188124A (en) * | 2001-12-14 | 2003-07-04 | Rodel Nitta Co | Polishing cloth |
US6884146B2 (en) * | 2002-02-04 | 2005-04-26 | Kla-Tencor Technologies Corp. | Systems and methods for characterizing a polishing process |
US20040146682A1 (en) * | 2003-01-29 | 2004-07-29 | David Emmert | Decal form with sub-surface window |
WO2004090963A1 (en) * | 2003-04-03 | 2004-10-21 | Hitachi Chemical Co. Ltd. | Polishing pad, process for producing the same and method of polishing therewith |
US20040209066A1 (en) * | 2003-04-17 | 2004-10-21 | Swisher Robert G. | Polishing pad with window for planarization |
WO2005043132A1 (en) * | 2003-10-31 | 2005-05-12 | Applied Materials, Inc. | Polishing endpoint detection system and method using friction sensor |
US7323415B2 (en) * | 2004-04-23 | 2008-01-29 | Jsr Corporation | Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer |
CN102554766B (en) * | 2004-12-10 | 2014-11-05 | 东洋橡胶工业株式会社 | Polishing pad and manufacturing method of the same |
US7306507B2 (en) * | 2005-08-22 | 2007-12-11 | Applied Materials, Inc. | Polishing pad assembly with glass or crystalline window |
KR101324644B1 (en) * | 2005-08-22 | 2013-11-01 | 어플라이드 머티어리얼스, 인코포레이티드 | Apparatus and methods for spectrum based monitoring of chemical mechanical polishing |
US20070193126A1 (en) * | 2006-01-10 | 2007-08-23 | Mishko Teodorovich | Apparatus and method for door and window side flashing |
US7942724B2 (en) * | 2006-07-03 | 2011-05-17 | Applied Materials, Inc. | Polishing pad with window having multiple portions |
US7815997B2 (en) * | 2006-12-29 | 2010-10-19 | 3M Innovative Properties Company | Window film assembly and method of installing |
KR20090055857A (en) * | 2007-11-29 | 2009-06-03 | 주식회사 동부하이텍 | Chamical machanical polishing pad |
US7839496B2 (en) * | 2008-04-24 | 2010-11-23 | Araca Incorporated | Confocal microscopy pad sample holder and method of hand using the same |
-
2010
- 2010-05-12 US US12/778,760 patent/US20110281510A1/en not_active Abandoned
-
2011
- 2011-04-27 KR KR1020177020536A patent/KR101956848B1/en active IP Right Grant
- 2011-04-27 KR KR1020127032411A patent/KR101762936B1/en active IP Right Grant
- 2011-04-27 JP JP2013510125A patent/JP2013526420A/en not_active Withdrawn
- 2011-04-27 CN CN201180023970.8A patent/CN102893377B/en active Active
- 2011-04-27 WO PCT/US2011/034215 patent/WO2011142975A2/en active Application Filing
- 2011-04-28 TW TW106137496A patent/TWI663021B/en active
- 2011-04-28 TW TW106129437A patent/TWI663020B/en active
- 2011-04-28 TW TW100114926A patent/TWI611866B/en active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003163191A (en) * | 2001-11-28 | 2003-06-06 | Tokyo Seimitsu Co Ltd | Polishing pad for mechanochemical polishing device |
US20030205325A1 (en) * | 2001-12-12 | 2003-11-06 | Lam Research Corporation | Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection |
US20070190905A1 (en) * | 2004-03-11 | 2007-08-16 | Tetsuo Shimomura | Polishing pad and semiconductor device manufacturing method |
US20080305729A1 (en) * | 2007-06-08 | 2008-12-11 | Applied Materials, Inc. | Thin polishing pad with window and molding process |
Also Published As
Publication number | Publication date |
---|---|
CN102893377B (en) | 2016-08-10 |
KR20130103674A (en) | 2013-09-24 |
US20110281510A1 (en) | 2011-11-17 |
TW201742705A (en) | 2017-12-16 |
TW201817541A (en) | 2018-05-16 |
TWI663021B (en) | 2019-06-21 |
KR20170088444A (en) | 2017-08-01 |
JP2013526420A (en) | 2013-06-24 |
KR101956848B1 (en) | 2019-03-11 |
WO2011142975A2 (en) | 2011-11-17 |
TWI611866B (en) | 2018-01-21 |
CN102893377A (en) | 2013-01-23 |
KR101762936B1 (en) | 2017-07-28 |
TWI663020B (en) | 2019-06-21 |
TW201217104A (en) | 2012-05-01 |
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