WO2011142975A3 - Pad window insert - Google Patents

Pad window insert Download PDF

Info

Publication number
WO2011142975A3
WO2011142975A3 PCT/US2011/034215 US2011034215W WO2011142975A3 WO 2011142975 A3 WO2011142975 A3 WO 2011142975A3 US 2011034215 W US2011034215 W US 2011034215W WO 2011142975 A3 WO2011142975 A3 WO 2011142975A3
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
solid light
transmitting window
lateral dimension
layer
Prior art date
Application number
PCT/US2011/034215
Other languages
French (fr)
Other versions
WO2011142975A2 (en
Inventor
Boguslaw A. Swedek
Dominic J. Benvegnu
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to KR1020177020536A priority Critical patent/KR101956848B1/en
Priority to JP2013510125A priority patent/JP2013526420A/en
Priority to CN201180023970.8A priority patent/CN102893377B/en
Priority to KR1020127032411A priority patent/KR101762936B1/en
Publication of WO2011142975A2 publication Critical patent/WO2011142975A2/en
Publication of WO2011142975A3 publication Critical patent/WO2011142975A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A polishing pad includes a polishing layer having a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The solid light-transmitting window has an upper portion with a first lateral dimension and a lower portion with a second lateral dimension that is smaller than the first lateral dimension. A top surface of the solid light-transmitting window coplanar with the polishing surface and a bottom surface of the solid light-transmitting window coplanar with a lower surface of the adhesive layer.
PCT/US2011/034215 2010-05-12 2011-04-27 Pad window insert WO2011142975A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020177020536A KR101956848B1 (en) 2010-05-12 2011-04-27 Polishing pad assembly
JP2013510125A JP2013526420A (en) 2010-05-12 2011-04-27 Pad window insert
CN201180023970.8A CN102893377B (en) 2010-05-12 2011-04-27 Pad window insert
KR1020127032411A KR101762936B1 (en) 2010-05-12 2011-04-27 Pad window insert

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/778,760 2010-05-12
US12/778,760 US20110281510A1 (en) 2010-05-12 2010-05-12 Pad Window Insert

Publications (2)

Publication Number Publication Date
WO2011142975A2 WO2011142975A2 (en) 2011-11-17
WO2011142975A3 true WO2011142975A3 (en) 2012-03-01

Family

ID=44912183

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2011/034215 WO2011142975A2 (en) 2010-05-12 2011-04-27 Pad window insert

Country Status (6)

Country Link
US (1) US20110281510A1 (en)
JP (1) JP2013526420A (en)
KR (2) KR101956848B1 (en)
CN (1) CN102893377B (en)
TW (3) TWI663020B (en)
WO (1) WO2011142975A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8535115B2 (en) * 2011-01-28 2013-09-17 Applied Materials, Inc. Gathering spectra from multiple optical heads
US8961266B2 (en) 2013-03-15 2015-02-24 Applied Materials, Inc. Polishing pad with secondary window seal
US9308620B2 (en) * 2013-09-18 2016-04-12 Texas Instruments Incorporated Permeated grooving in CMP polishing pads
US10012494B2 (en) * 2013-10-25 2018-07-03 Applied Materials, Inc. Grouping spectral data from polishing substrates
JP6838811B2 (en) 2014-05-02 2021-03-03 スリーエム イノベイティブ プロパティズ カンパニー Method of polishing intermittent structured polished articles and workpieces
US10213894B2 (en) * 2016-02-26 2019-02-26 Applied Materials, Inc. Method of placing window in thin polishing pad
SG11201806662WA (en) * 2016-02-26 2018-09-27 Applied Materials Inc Window in thin polishing pad
JP6883475B2 (en) * 2017-06-06 2021-06-09 株式会社荏原製作所 Polishing table and polishing equipment equipped with it
JP7015667B2 (en) * 2017-10-02 2022-02-03 株式会社ディスコ Polishing equipment
JP2020001162A (en) * 2018-06-28 2020-01-09 株式会社荏原製作所 Polishing pad laminate, polishing pad positioning jig, and method of applying polishing pad to polishing table
US11571782B2 (en) * 2018-11-28 2023-02-07 Taiwan Semiconductor Manufacturing Co., Ltd. Single bodied platen housing a detection module for CMP systems

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003163191A (en) * 2001-11-28 2003-06-06 Tokyo Seimitsu Co Ltd Polishing pad for mechanochemical polishing device
US20030205325A1 (en) * 2001-12-12 2003-11-06 Lam Research Corporation Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection
US20070190905A1 (en) * 2004-03-11 2007-08-16 Tetsuo Shimomura Polishing pad and semiconductor device manufacturing method
US20080305729A1 (en) * 2007-06-08 2008-12-11 Applied Materials, Inc. Thin polishing pad with window and molding process

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US6451398B1 (en) * 1998-11-24 2002-09-17 Michael S. Sylvester Double-sided self-adhesive reinforced foam tape
US6235365B1 (en) * 1998-12-18 2001-05-22 W. R. Grace & Co.-Conn. Waterproofing membrane having release sheet cutting system
US20040082271A1 (en) * 1999-01-25 2004-04-29 Wiswesser Andreas Norbert Polishing pad with window
US6190234B1 (en) * 1999-01-25 2001-02-20 Applied Materials, Inc. Endpoint detection with light beams of different wavelengths
JP2001009699A (en) * 1999-07-05 2001-01-16 Nichiden Mach Ltd Plane surface grinding device
US8485862B2 (en) * 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
CN100379522C (en) * 2000-12-01 2008-04-09 东洋橡膠工业株式会社 Polishing pad, method of manufacturing the polishing pad, and cushion layer for polishing pad
US6641470B1 (en) * 2001-03-30 2003-11-04 Lam Research Corporation Apparatus for accurate endpoint detection in supported polishing pads
US6857941B2 (en) * 2001-06-01 2005-02-22 Applied Materials, Inc. Multi-phase polishing pad
WO2002102547A1 (en) * 2001-06-15 2002-12-27 Rodel Holdings, Inc. Polishing apparatus that provides a window
JP2003133270A (en) * 2001-10-26 2003-05-09 Jsr Corp Window material for chemical mechanical polishing and polishing pad
JP2003188124A (en) * 2001-12-14 2003-07-04 Rodel Nitta Co Polishing cloth
US6935922B2 (en) * 2002-02-04 2005-08-30 Kla-Tencor Technologies Corp. Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing
US20040146682A1 (en) * 2003-01-29 2004-07-29 David Emmert Decal form with sub-surface window
US20060199473A1 (en) * 2003-04-03 2006-09-07 Masao Suzuki Polishing pad, process for producing the same and method of polishing therewith
US20040209066A1 (en) * 2003-04-17 2004-10-21 Swisher Robert G. Polishing pad with window for planarization
WO2005043132A1 (en) * 2003-10-31 2005-05-12 Applied Materials, Inc. Polishing endpoint detection system and method using friction sensor
CN100424830C (en) * 2004-04-23 2008-10-08 Jsr株式会社 Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer
CN102554766B (en) * 2004-12-10 2014-11-05 东洋橡胶工业株式会社 Polishing pad and manufacturing method of the same
JP5534672B2 (en) * 2005-08-22 2014-07-02 アプライド マテリアルズ インコーポレイテッド Apparatus and method for spectrum-based monitoring of chemical mechanical polishing
US7764377B2 (en) * 2005-08-22 2010-07-27 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
US20070193126A1 (en) * 2006-01-10 2007-08-23 Mishko Teodorovich Apparatus and method for door and window side flashing
US7942724B2 (en) * 2006-07-03 2011-05-17 Applied Materials, Inc. Polishing pad with window having multiple portions
US7815997B2 (en) * 2006-12-29 2010-10-19 3M Innovative Properties Company Window film assembly and method of installing
KR20090055857A (en) * 2007-11-29 2009-06-03 주식회사 동부하이텍 Chamical machanical polishing pad
US7839496B2 (en) * 2008-04-24 2010-11-23 Araca Incorporated Confocal microscopy pad sample holder and method of hand using the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003163191A (en) * 2001-11-28 2003-06-06 Tokyo Seimitsu Co Ltd Polishing pad for mechanochemical polishing device
US20030205325A1 (en) * 2001-12-12 2003-11-06 Lam Research Corporation Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection
US20070190905A1 (en) * 2004-03-11 2007-08-16 Tetsuo Shimomura Polishing pad and semiconductor device manufacturing method
US20080305729A1 (en) * 2007-06-08 2008-12-11 Applied Materials, Inc. Thin polishing pad with window and molding process

Also Published As

Publication number Publication date
TW201742705A (en) 2017-12-16
WO2011142975A2 (en) 2011-11-17
TWI663021B (en) 2019-06-21
TWI663020B (en) 2019-06-21
KR101956848B1 (en) 2019-03-11
CN102893377B (en) 2016-08-10
KR101762936B1 (en) 2017-07-28
CN102893377A (en) 2013-01-23
TW201217104A (en) 2012-05-01
JP2013526420A (en) 2013-06-24
KR20170088444A (en) 2017-08-01
KR20130103674A (en) 2013-09-24
TW201817541A (en) 2018-05-16
US20110281510A1 (en) 2011-11-17
TWI611866B (en) 2018-01-21

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