MY158655A - Bonding device, ultrasonic transducer and bonding method - Google Patents

Bonding device, ultrasonic transducer and bonding method

Info

Publication number
MY158655A
MY158655A MYPI2011001664A MYPI20111664A MY158655A MY 158655 A MY158655 A MY 158655A MY PI2011001664 A MYPI2011001664 A MY PI2011001664A MY PI20111664 A MYPI20111664 A MY PI20111664A MY 158655 A MY158655 A MY 158655A
Authority
MY
Malaysia
Prior art keywords
bonding
ultrasonic transducer
bonding device
axis
extension
Prior art date
Application number
MYPI2011001664A
Other languages
English (en)
Inventor
Brokelmann Michael
Wallaschek Jorg
Hesse Hans-Jurgen
Vasiljev Piotr
Original Assignee
Hesse Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hesse Gmbh filed Critical Hesse Gmbh
Publication of MY158655A publication Critical patent/MY158655A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/106—Features related to sonotrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0444—Apparatus for wiring semiconductor or solid-state device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/533—Cross-sectional shape
    • H10W72/534—Cross-sectional shape being rectangular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
MYPI2011001664A 2008-10-14 2009-10-07 Bonding device, ultrasonic transducer and bonding method MY158655A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008037450 2008-10-14
DE102009003312A DE102009003312A1 (de) 2008-10-14 2009-01-06 Bondvorrichtung, Ultraschall-Transducer und Bondverfahren

Publications (1)

Publication Number Publication Date
MY158655A true MY158655A (en) 2016-10-31

Family

ID=41821369

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2011001664A MY158655A (en) 2008-10-14 2009-10-07 Bonding device, ultrasonic transducer and bonding method

Country Status (9)

Country Link
US (1) US8434659B2 (enExample)
EP (1) EP2344295B1 (enExample)
JP (1) JP5683470B2 (enExample)
KR (1) KR20110084899A (enExample)
CN (1) CN102186620B (enExample)
DE (1) DE102009003312A1 (enExample)
MY (1) MY158655A (enExample)
TW (1) TWI519017B (enExample)
WO (1) WO2010043517A2 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120109207A1 (en) * 2010-10-29 2012-05-03 Warsaw Orthopedic, Inc. Enhanced Interfacial Conformance for a Composite Rod for Spinal Implant Systems with Higher Modulus Core and Lower Modulus Polymeric Sleeve
US8640760B2 (en) * 2011-08-19 2014-02-04 Lg Chem, Ltd. Ultrasonic welding machine and method of aligning an ultrasonic welding horn relative to an anvil
DE102014109630A1 (de) * 2014-07-09 2016-01-14 Hesse Gmbh Vorrichtung zum Herstellen einer Bondverbindung und Transducer hierfür
DE102015120824A1 (de) * 2015-12-01 2017-06-01 Hesse Gmbh Betriebsverfahren für einen Ultraschalldrahtbonder
US10052714B2 (en) * 2016-10-14 2018-08-21 Sonics & Materials, Inc. Ultrasonic welding device with dual converters
JP6483079B2 (ja) * 2016-12-13 2019-03-13 本田技研工業株式会社 電気導体の接合方法
US10381321B2 (en) * 2017-02-18 2019-08-13 Kulicke And Soffa Industries, Inc Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same
CN108555429B (zh) * 2018-05-16 2023-06-20 华侨大学 金属箔大范围连续超声焊接装置
DE102019109262B4 (de) * 2019-04-09 2025-11-20 Lisa Dräxlmaier GmbH VORRICHTUNG UND VERFAHREN ZUM BESTIMMEN EINES ZUSTANDS EINES ULTRASCHALLSCHWEIßPROZESSES
TWI741705B (zh) 2020-07-28 2021-10-01 國立中興大學 主軸之外電源供應器
CN112427281B (zh) * 2020-09-18 2022-05-24 集美大学 一种复频超声振动加工装置
US11937979B2 (en) * 2021-04-27 2024-03-26 Kulicke And Soffa Industries, Inc. Ultrasonic transducers, wire bonding machines including ultrasonic transducers, and related methods
EP4174969A1 (en) * 2021-11-01 2023-05-03 Xeryon Mounting arrangement for piezo motor element
CN114388407B (zh) * 2021-12-24 2023-02-17 凌波微步半导体设备(常熟)有限公司 一种键合头装置及键合机

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3549913A (en) 1967-10-31 1970-12-22 Matsushita Electric Industrial Co Ltd Piezo-electric transformer
US3602420A (en) 1970-02-12 1971-08-31 Ibm Ultrasonic bonding device
JPH0777229B2 (ja) * 1988-10-28 1995-08-16 株式会社新川 超音波ワイヤボンディング装置
JPH0653291A (ja) 1992-07-30 1994-02-25 Matsushita Electric Ind Co Ltd ワイヤボンディング装置
DE19601599C1 (de) 1995-08-15 1997-02-20 Hesse & Knipps Gmbh Anordnung zur Führung von Drähten
ES2146989T3 (es) * 1996-02-12 2000-08-16 David Finn Procedimiento y dispositivo para el contacto de un conductor de hilo.
DE59701709C5 (de) * 1996-02-12 2014-01-09 Smartrac Ip B.V. Verfahren und vorrichtung zur kontaktierung eines drahtleiters
JP2000040716A (ja) * 1998-07-24 2000-02-08 Hitachi Ltd ボンディング装置
DE10114672A1 (de) * 2001-03-23 2002-09-26 Hesse & Knipps Gmbh Ultraschallschwinger
JP2006255506A (ja) * 2005-03-15 2006-09-28 Fujitsu Ltd 発振器
KR100680307B1 (ko) 2005-05-20 2007-02-07 삼성전기주식회사 압전 진동자 및 이를 구비한 초음파 모터
JP2007150188A (ja) * 2005-11-30 2007-06-14 Ngk Insulators Ltd 圧電デバイスの制御方法
JP5116250B2 (ja) 2006-04-11 2013-01-09 キヤノン株式会社 積層圧電素子及びその製造方法、並びに振動波駆動装置
TW200801513A (en) * 2006-06-29 2008-01-01 Fermiscan Australia Pty Ltd Improved process
US20100147466A1 (en) * 2007-03-02 2010-06-17 Compania Espanola De Ulltrasonidos, Sa Ultrasonic head and transducer for ultrasonic soldering of plastics
CH700015B1 (de) * 2007-04-04 2010-06-15 Oerlikon Assembly Equipment Ag Ultraschall Transducer.

Also Published As

Publication number Publication date
US8434659B2 (en) 2013-05-07
CN102186620B (zh) 2014-03-05
TWI519017B (zh) 2016-01-21
EP2344295A2 (de) 2011-07-20
JP2012505083A (ja) 2012-03-01
WO2010043517A3 (de) 2010-07-29
US20110266329A1 (en) 2011-11-03
CN102186620A (zh) 2011-09-14
EP2344295B1 (de) 2020-03-11
TW201025771A (en) 2010-07-01
KR20110084899A (ko) 2011-07-26
DE102009003312A1 (de) 2010-04-15
WO2010043517A2 (de) 2010-04-22
JP5683470B2 (ja) 2015-03-11

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