WO2012148967A3 - Cleaning lead-frames to improve wirebonding process - Google Patents
Cleaning lead-frames to improve wirebonding process Download PDFInfo
- Publication number
- WO2012148967A3 WO2012148967A3 PCT/US2012/034912 US2012034912W WO2012148967A3 WO 2012148967 A3 WO2012148967 A3 WO 2012148967A3 US 2012034912 W US2012034912 W US 2012034912W WO 2012148967 A3 WO2012148967 A3 WO 2012148967A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- frames
- improve
- wirebonding process
- cleaning lead
- substrate
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 4
- 238000004140 cleaning Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 4
- 239000000203 mixture Substances 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
- 239000007788 liquid Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
Classifications
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/265—Carboxylic acids or salts thereof
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4835—Cleaning, e.g. removing of solder
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- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
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- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
- H01L2924/15747—Copper [Cu] as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Emergency Medicine (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Detergent Compositions (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Wire Bonding (AREA)
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG2013077417A SG194523A1 (en) | 2011-04-25 | 2012-04-25 | Cleaning lead-frames to improve wirebonding process |
EP12776905.7A EP2702607A4 (en) | 2011-04-25 | 2012-04-25 | Cleaning lead-frames to improve wirebonding process |
JP2014508496A JP6030637B2 (en) | 2011-04-25 | 2012-04-25 | Lead frame cleaning to improve wire bonding. |
CN201280030395.9A CN103620753B (en) | 2011-04-25 | 2012-04-25 | Cleaning lead-frames to improve wirebonding process |
KR1020137031200A KR101729203B1 (en) | 2011-04-25 | 2012-04-25 | Cleaning lead-frames to improve wirebonding process |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161478582P | 2011-04-25 | 2011-04-25 | |
US61/478,582 | 2011-04-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2012148967A2 WO2012148967A2 (en) | 2012-11-01 |
WO2012148967A3 true WO2012148967A3 (en) | 2013-01-17 |
Family
ID=47073028
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2012/034912 WO2012148967A2 (en) | 2011-04-25 | 2012-04-25 | Cleaning lead-frames to improve wirebonding process |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP2702607A4 (en) |
JP (1) | JP6030637B2 (en) |
KR (1) | KR101729203B1 (en) |
CN (1) | CN103620753B (en) |
MY (1) | MY175223A (en) |
SG (1) | SG194523A1 (en) |
TW (1) | TWI467675B (en) |
WO (1) | WO2012148967A2 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201428901A (en) * | 2013-01-07 | 2014-07-16 | 矽品精密工業股份有限公司 | Semiconductor package and fabrication method thereof |
WO2015084921A1 (en) | 2013-12-06 | 2015-06-11 | Fujifilm Electronic Materials U.S.A., Inc. | Cleaning formulation for removing residues on surfaces |
US11302669B2 (en) | 2015-10-15 | 2022-04-12 | Skyworks Solutions, Inc. | Wire bond cleaning method and wire bonding recovery process |
CN111902379B (en) * | 2018-03-28 | 2023-02-17 | 富士胶片电子材料美国有限公司 | Cleaning composition |
US10713583B1 (en) | 2019-01-02 | 2020-07-14 | International Business Machines Corporation | Removal of wirebonds in quantum hardware |
JP7296835B2 (en) | 2019-09-19 | 2023-06-23 | 株式会社ディスコ | WAFER PROCESSING METHOD AND CHIP MEASURING DEVICE |
CN117594453B (en) * | 2024-01-18 | 2024-05-28 | 瑞能微恩半导体(上海)有限公司 | Packaging method of transistor packaging structure and transistor packaging structure |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020058417A1 (en) * | 1999-03-31 | 2002-05-16 | Hugh Li | Bond pad and wire bond |
US20020127825A1 (en) * | 2001-03-12 | 2002-09-12 | Motorola, Inc. | Method of preparing copper metallization die for wirebonding |
KR20040060545A (en) * | 2002-12-30 | 2004-07-06 | 동부전자 주식회사 | pad aluminum structure of semiconductor device and its processing method |
US20090111220A1 (en) * | 2007-10-29 | 2009-04-30 | Freescale Semiconductor, Inc. | Coated lead frame |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS6057219B2 (en) * | 1980-12-26 | 1985-12-13 | 株式会社東芝 | semiconductor equipment |
US4968397A (en) | 1989-11-27 | 1990-11-06 | Asher Reginald K | Non-cyanide electrode cleaning process |
JP2539093B2 (en) * | 1990-10-25 | 1996-10-02 | 三菱マテリアル株式会社 | Lead frame, manufacturing method thereof, and semiconductor device |
JP3160344B2 (en) | 1991-01-25 | 2001-04-25 | アシュランド インコーポレーテッド | Organic stripping composition |
US5433885A (en) | 1991-07-17 | 1995-07-18 | Church & Dwight Co., Inc. | Stabilization of silicate solutions |
DE4444388A1 (en) * | 1994-11-28 | 1996-05-30 | Atotech Deutschland Gmbh | Process for bonding wires on oxidation-sensitive, solderable metal substrates |
JPH08293576A (en) * | 1995-04-25 | 1996-11-05 | Toppan Printing Co Ltd | Lead frame and manufacture thereof |
JP2904192B2 (en) * | 1997-06-25 | 1999-06-14 | 日本電気株式会社 | Method for manufacturing semiconductor device |
US6230719B1 (en) * | 1998-02-27 | 2001-05-15 | Micron Technology, Inc. | Apparatus for removing contaminants on electronic devices |
US6828289B2 (en) | 1999-01-27 | 2004-12-07 | Air Products And Chemicals, Inc. | Low surface tension, low viscosity, aqueous, acidic compositions containing fluoride and organic, polar solvents for removal of photoresist and organic and inorganic etch residues at room temperature |
JP4044296B2 (en) * | 2001-03-22 | 2008-02-06 | 株式会社東芝 | Manufacturing method of semiconductor device |
US6627546B2 (en) | 2001-06-29 | 2003-09-30 | Ashland Inc. | Process for removing contaminant from a surface and composition useful therefor |
US7049683B1 (en) * | 2003-07-19 | 2006-05-23 | Ns Electronics Bangkok (1993) Ltd. | Semiconductor package including organo-metallic coating formed on surface of leadframe roughened using chemical etchant to prevent separation between leadframe and molding compound |
JP2005150508A (en) * | 2003-11-18 | 2005-06-09 | Sanyo Electric Co Ltd | Method for manufacturing semiconductor device |
JP4700633B2 (en) * | 2007-02-15 | 2011-06-15 | 株式会社新川 | Wire cleaning guide |
JP2009099945A (en) * | 2007-09-28 | 2009-05-07 | Fujifilm Corp | Cleaning agent for semiconductor device and cleaning method using the same |
US9048088B2 (en) * | 2008-03-28 | 2015-06-02 | Lam Research Corporation | Processes and solutions for substrate cleaning and electroless deposition |
JP5561914B2 (en) * | 2008-05-16 | 2014-07-30 | 関東化学株式会社 | Semiconductor substrate cleaning liquid composition |
US20100155260A1 (en) | 2008-12-22 | 2010-06-24 | Kwan Yiu Fai | Micro-blasting treatment for lead frames |
-
2012
- 2012-04-25 WO PCT/US2012/034912 patent/WO2012148967A2/en active Application Filing
- 2012-04-25 MY MYPI2013702006A patent/MY175223A/en unknown
- 2012-04-25 CN CN201280030395.9A patent/CN103620753B/en not_active Expired - Fee Related
- 2012-04-25 JP JP2014508496A patent/JP6030637B2/en not_active Expired - Fee Related
- 2012-04-25 TW TW101114791A patent/TWI467675B/en not_active IP Right Cessation
- 2012-04-25 EP EP12776905.7A patent/EP2702607A4/en not_active Ceased
- 2012-04-25 KR KR1020137031200A patent/KR101729203B1/en active IP Right Grant
- 2012-04-25 SG SG2013077417A patent/SG194523A1/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020058417A1 (en) * | 1999-03-31 | 2002-05-16 | Hugh Li | Bond pad and wire bond |
US20020127825A1 (en) * | 2001-03-12 | 2002-09-12 | Motorola, Inc. | Method of preparing copper metallization die for wirebonding |
KR20040060545A (en) * | 2002-12-30 | 2004-07-06 | 동부전자 주식회사 | pad aluminum structure of semiconductor device and its processing method |
US20090111220A1 (en) * | 2007-10-29 | 2009-04-30 | Freescale Semiconductor, Inc. | Coated lead frame |
Also Published As
Publication number | Publication date |
---|---|
JP2014516478A (en) | 2014-07-10 |
MY175223A (en) | 2020-06-16 |
EP2702607A2 (en) | 2014-03-05 |
KR101729203B1 (en) | 2017-04-21 |
EP2702607A4 (en) | 2015-06-24 |
WO2012148967A2 (en) | 2012-11-01 |
KR20130142197A (en) | 2013-12-27 |
JP6030637B2 (en) | 2016-11-24 |
SG194523A1 (en) | 2013-12-30 |
TW201308455A (en) | 2013-02-16 |
CN103620753B (en) | 2017-05-24 |
TWI467675B (en) | 2015-01-01 |
CN103620753A (en) | 2014-03-05 |
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