CN102186620B - 接合装置，超声波转换器和用于建立接合连接的方法 - Google Patents

接合装置，超声波转换器和用于建立接合连接的方法 Download PDF

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Publication number
CN102186620B
CN102186620B CN200980140650.3A CN200980140650A CN102186620B CN 102186620 B CN102186620 B CN 102186620B CN 200980140650 A CN200980140650 A CN 200980140650A CN 102186620 B CN102186620 B CN 102186620B
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CN
China
Prior art keywords
piezoelectric element
vibratory stimulation
ultrasonic transducer
ultrasonic
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200980140650.3A
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English (en)
Chinese (zh)
Other versions
CN102186620A (zh
Inventor
H-J·黑塞
J·瓦拉斯切克
M·布勒克曼
P·瓦希杰夫
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Hesse GmbH
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Hesse GmbH
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Publication date
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Publication of CN102186620A publication Critical patent/CN102186620A/zh
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Publication of CN102186620B publication Critical patent/CN102186620B/zh
Expired - Fee Related legal-status Critical Current
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/106—Features related to sonotrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0444—Apparatus for wiring semiconductor or solid-state device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/533—Cross-sectional shape
    • H10W72/534—Cross-sectional shape being rectangular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
CN200980140650.3A 2008-10-14 2009-10-07 接合装置，超声波转换器和用于建立接合连接的方法 Expired - Fee Related CN102186620B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE102008037450 2008-10-14
DE102008037450.4 2008-10-14
DE102009003312A DE102009003312A1 (de) 2008-10-14 2009-01-06 Bondvorrichtung, Ultraschall-Transducer und Bondverfahren
DE102009003312.2 2009-01-06
PCT/EP2009/063000 WO2010043517A2 (de) 2008-10-14 2009-10-07 Bondvorrichtung, ultraschall-transducer und bondverfahren

Publications (2)

Publication Number Publication Date
CN102186620A CN102186620A (zh) 2011-09-14
CN102186620B true CN102186620B (zh) 2014-03-05

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980140650.3A Expired - Fee Related CN102186620B (zh) 2008-10-14 2009-10-07 接合装置，超声波转换器和用于建立接合连接的方法

Country Status (9)

Country Link
US (1) US8434659B2 (enExample)
EP (1) EP2344295B1 (enExample)
JP (1) JP5683470B2 (enExample)
KR (1) KR20110084899A (enExample)
CN (1) CN102186620B (enExample)
DE (1) DE102009003312A1 (enExample)
MY (1) MY158655A (enExample)
TW (1) TWI519017B (enExample)
WO (1) WO2010043517A2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120109207A1 (en) * 2010-10-29 2012-05-03 Warsaw Orthopedic, Inc. Enhanced Interfacial Conformance for a Composite Rod for Spinal Implant Systems with Higher Modulus Core and Lower Modulus Polymeric Sleeve
US8640760B2 (en) * 2011-08-19 2014-02-04 Lg Chem, Ltd. Ultrasonic welding machine and method of aligning an ultrasonic welding horn relative to an anvil
DE102014109630A1 (de) 2014-07-09 2016-01-14 Hesse Gmbh Vorrichtung zum Herstellen einer Bondverbindung und Transducer hierfür
DE102015120824A1 (de) * 2015-12-01 2017-06-01 Hesse Gmbh Betriebsverfahren für einen Ultraschalldrahtbonder
US10052714B2 (en) * 2016-10-14 2018-08-21 Sonics & Materials, Inc. Ultrasonic welding device with dual converters
JP6483079B2 (ja) * 2016-12-13 2019-03-13 本田技研工業株式会社 電気導体の接合方法
US10381321B2 (en) * 2017-02-18 2019-08-13 Kulicke And Soffa Industries, Inc Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same
CN108555429B (zh) * 2018-05-16 2023-06-20 华侨大学 金属箔大范围连续超声焊接装置
DE102019109262B4 (de) * 2019-04-09 2025-11-20 Lisa Dräxlmaier GmbH VORRICHTUNG UND VERFAHREN ZUM BESTIMMEN EINES ZUSTANDS EINES ULTRASCHALLSCHWEIßPROZESSES
TWI741705B (zh) 2020-07-28 2021-10-01 國立中興大學 主軸之外電源供應器
CN112427281B (zh) * 2020-09-18 2022-05-24 集美大学 一种复频超声振动加工装置
US11937979B2 (en) * 2021-04-27 2024-03-26 Kulicke And Soffa Industries, Inc. Ultrasonic transducers, wire bonding machines including ultrasonic transducers, and related methods
CN114388407B (zh) * 2021-12-24 2023-02-17 凌波微步半导体设备(常熟)有限公司 一种键合头装置及键合机

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1164600A (en) * 1967-10-31 1969-09-17 Matsushita Electric Industrial Co Ltd Piezo-Electric Transformer
GB1326692A (en) * 1970-02-12 1973-08-15 Ibm Ultrasonic bonding device
DE19601599C1 (de) * 1995-08-15 1997-02-20 Hesse & Knipps Gmbh Anordnung zur Führung von Drähten
CN1210602A (zh) * 1996-02-12 1999-03-10 大卫·芬恩 与导线接触用的方法和设备
DE10114672A1 (de) * 2001-03-23 2002-09-26 Hesse & Knipps Gmbh Ultraschallschwinger
CN1833786A (zh) * 2005-03-15 2006-09-20 富士通株式会社 振荡装置
CN1864869A (zh) * 2005-05-20 2006-11-22 三星电机株式会社 压电振动器和具有压电振动器的超声波电机
US7808162B2 (en) * 2006-04-11 2010-10-05 Canon Kabushiki Kaisha Stacked piezoelectric element and vibration wave driving apparatus

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0777229B2 (ja) * 1988-10-28 1995-08-16 株式会社新川 超音波ワイヤボンディング装置
JPH0653291A (ja) * 1992-07-30 1994-02-25 Matsushita Electric Ind Co Ltd ワイヤボンディング装置
DE59701709C5 (de) 1996-02-12 2014-01-09 Smartrac Ip B.V. Verfahren und vorrichtung zur kontaktierung eines drahtleiters
JP2000040716A (ja) * 1998-07-24 2000-02-08 Hitachi Ltd ボンディング装置
JP2007150188A (ja) * 2005-11-30 2007-06-14 Ngk Insulators Ltd 圧電デバイスの制御方法
TW200801513A (en) * 2006-06-29 2008-01-01 Fermiscan Australia Pty Ltd Improved process
EP2133191A4 (en) * 2007-03-02 2013-05-15 Compania Espanola De Ultrasonidos Sa HEAD AND ULTRASONIC TRANSDUCER FOR ULTRASONIC WELDING OF PLASTIC MATERIALS
CH700015B1 (de) * 2007-04-04 2010-06-15 Oerlikon Assembly Equipment Ag Ultraschall Transducer.

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1164600A (en) * 1967-10-31 1969-09-17 Matsushita Electric Industrial Co Ltd Piezo-Electric Transformer
GB1326692A (en) * 1970-02-12 1973-08-15 Ibm Ultrasonic bonding device
DE19601599C1 (de) * 1995-08-15 1997-02-20 Hesse & Knipps Gmbh Anordnung zur Führung von Drähten
CN1210602A (zh) * 1996-02-12 1999-03-10 大卫·芬恩 与导线接触用的方法和设备
DE10114672A1 (de) * 2001-03-23 2002-09-26 Hesse & Knipps Gmbh Ultraschallschwinger
CN1833786A (zh) * 2005-03-15 2006-09-20 富士通株式会社 振荡装置
CN1864869A (zh) * 2005-05-20 2006-11-22 三星电机株式会社 压电振动器和具有压电振动器的超声波电机
US7808162B2 (en) * 2006-04-11 2010-10-05 Canon Kabushiki Kaisha Stacked piezoelectric element and vibration wave driving apparatus

Also Published As

Publication number Publication date
WO2010043517A2 (de) 2010-04-22
DE102009003312A1 (de) 2010-04-15
CN102186620A (zh) 2011-09-14
US8434659B2 (en) 2013-05-07
KR20110084899A (ko) 2011-07-26
EP2344295A2 (de) 2011-07-20
US20110266329A1 (en) 2011-11-03
WO2010043517A3 (de) 2010-07-29
EP2344295B1 (de) 2020-03-11
TWI519017B (zh) 2016-01-21
MY158655A (en) 2016-10-31
TW201025771A (en) 2010-07-01
JP5683470B2 (ja) 2015-03-11
JP2012505083A (ja) 2012-03-01

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SE01 Entry into force of request for substantive examination
C53 Correction of patent of invention or patent application
CB02 Change of applicant information

Address after: Paderborn

Applicant after: HESSE GmbH

Address before: Paderborn

Applicant before: Hesse & Knipps GmbH

COR Change of bibliographic data

Free format text: CORRECT: APPLICANT; FROM: HESSE + KNIPPS GMBH TO: HESSE GMBH + CO. KG

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CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140305