ATE472387T1 - Verfahren und vorrichtung zur regelung der herstellung von drahtbondverbindungen - Google Patents

Verfahren und vorrichtung zur regelung der herstellung von drahtbondverbindungen

Info

Publication number
ATE472387T1
ATE472387T1 AT06018609T AT06018609T ATE472387T1 AT E472387 T1 ATE472387 T1 AT E472387T1 AT 06018609 T AT06018609 T AT 06018609T AT 06018609 T AT06018609 T AT 06018609T AT E472387 T1 ATE472387 T1 AT E472387T1
Authority
AT
Austria
Prior art keywords
bond
wire
generation
steps during
deformation
Prior art date
Application number
AT06018609T
Other languages
English (en)
Inventor
Holger Gaul
Herbert Reichl
Martin Schneider-Ramelow
Klaus-Dieter Lang
Ute Geissler
Original Assignee
Univ Berlin Tech
Fraunhofer Ges Forschung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Berlin Tech, Fraunhofer Ges Forschung filed Critical Univ Berlin Tech
Application granted granted Critical
Publication of ATE472387T1 publication Critical patent/ATE472387T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Coating With Molten Metal (AREA)
  • Wire Processing (AREA)
AT06018609T 2006-09-05 2006-09-05 Verfahren und vorrichtung zur regelung der herstellung von drahtbondverbindungen ATE472387T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP06018609A EP1897648B1 (de) 2006-09-05 2006-09-05 Verfahren und Vorrichtung zur Regelung der Herstellung von Drahtbondverbindungen

Publications (1)

Publication Number Publication Date
ATE472387T1 true ATE472387T1 (de) 2010-07-15

Family

ID=37696087

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06018609T ATE472387T1 (de) 2006-09-05 2006-09-05 Verfahren und vorrichtung zur regelung der herstellung von drahtbondverbindungen

Country Status (5)

Country Link
US (1) US8020746B2 (de)
EP (1) EP1897648B1 (de)
AT (1) ATE472387T1 (de)
DE (1) DE602006015192D1 (de)
WO (1) WO2008028906A1 (de)

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US20120074206A1 (en) * 2010-09-27 2012-03-29 Kulicke And Soffa Industries, Inc. Methods of forming wire bonds for wire loops and conductive bumps
US20140374151A1 (en) * 2013-06-24 2014-12-25 Jia Lin Yap Wire bonding method for flexible substrates
JP6615094B2 (ja) * 2014-06-12 2019-12-04 株式会社エンビジョンＡｅｓｃジャパン 接合状態検査方法
US20190217130A1 (en) * 2016-08-11 2019-07-18 Sonify Biosciences, Llc Method and system for ultrasound induced hyperthermia with microwave thermometry feedback
EP3603826B1 (de) * 2018-07-31 2023-05-10 Infineon Technologies AG Verfahren zur kalibrierung einer ultraschallverbindungsmaschine
DE102019124334A1 (de) * 2019-09-11 2021-03-11 Hesse Gmbh Bondanordnung und Bondwerkzeug
DE102019124332A1 (de) * 2019-09-11 2021-03-11 Hesse Gmbh Vorrichtung und Verfahren zum Erfassen einer Temperatur eines Bondwerkzeugs beim laserunterstützen Ultraschallbonden
EP4028178B1 (de) 2019-09-11 2025-11-05 Hesse GmbH Ultraschallwerkzeug und ultraschallverbindungsvorrichtung hiermit
DE102019124335A1 (de) 2019-09-11 2021-03-11 Hesse Gmbh Bondvorrichtung
US20250187103A1 (en) * 2023-12-07 2025-06-12 Kulicke And Soffa Industries, Inc. Conductive pins, power modules, ultrasonic welding systems, and methods of using the same

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Also Published As

Publication number Publication date
EP1897648A1 (de) 2008-03-12
WO2008028906A1 (en) 2008-03-13
US20100025453A1 (en) 2010-02-04
DE602006015192D1 (de) 2010-08-12
EP1897648B1 (de) 2010-06-30
US8020746B2 (en) 2011-09-20

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Legal Events

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