CN1306577C - 当用引线接合器接合时确定最优接合参数的方法 - Google Patents

当用引线接合器接合时确定最优接合参数的方法 Download PDF

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CN1306577C
CN1306577C CNB03103537XA CN03103537A CN1306577C CN 1306577 C CN1306577 C CN 1306577C CN B03103537X A CNB03103537X A CN B03103537XA CN 03103537 A CN03103537 A CN 03103537A CN 1306577 C CN1306577 C CN 1306577C
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迈克尔·梅尔
朱格·施维泽
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Besi Switzerland AG
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Abstract

通过一种带有以下步骤的方法确定引线接合器的接合力FB、超声波变量P和任选的至少另一个的接合参数的最优接合参数：进行数次接合操作，以把形成为球形的引线头接合到一个连接点上，其中每次在预定范围内按离散步长改变接合力FB和超声波变量P并且如果需要改变该至少另一个的接合参数，其中在接合过程期间，对每次接合操作利用一个传感器产生一个和施加到相应连接点上的剪切力成比例的电信号；对每次接合操作，从该由传感器在接合操作期间传送的电信号确定一个量G；确定量G的最大值以及接合力FB、超声波变量P并且若需要该至少另一个的接合参数的对应值，或者确定量G的全局最大值并确定接合力FB、超声波变量P和若需要该至少另一个的接合参数的对应值，或者对量G确定一个其中量G满足预定准则的范围H并且确定接合力FB、超声波变量P和若需要该至少另一个的接合参数处于该范围H内的一个值。

Description

当用引线接合器接合时确定 最优接合参数的方法
技术领域
本发明涉及一种用于当用引线接合器接合时确定最优接合参数的方法。
背景技术
引线接合器是一种在把半导体芯片安装在基片上后使引线和这些半导体芯片相连接的机构。引线接合器具有一个固定在一个角状物的梢上的毛细管。该毛细管起把引线固定在半导体芯片上的连接点上以及基片上的连接点上并且在这二个连接点之间导引引线的作用。为了实现半导体芯片上的连接点和基片上的连接点之间的引线连接，从该毛细管伸出的引线端头首先熔成一个球体。然后，通过压力和超声波使该引线球固定到半导体芯片上的连接点上。为此，超声波从一个超声换能器作用到角状物上。这种处理称为球形接合。接着按所需长度牵引该引线、形成一个线环并且焊接到基片上的连接点上。该后一个处理称为楔形接合。当把该线固定到基片上的连接点上后，撕开该条引线并且开始下一个接合过程。
球形接合受到许多因素的影响。为了达到预定质量的接合连接，必须对每一次具体处理确定数个物理和/或技术参数的适当值。这些参数的例子是：
-接合力，它是在接合处理过程中毛细管施加给球形接点或半导体芯片的连接点的额定力，
-一个本文中称为超声波变量P的参数，它控制对超声换能器施加的超声波，该超声波变量例如是流过该角状物的超声换能器的交流电流的振幅或者是施加到该超声换能器的交流电压的振幅或者是其功率或者是别的变量。
-一个本文中称为超声波时间T的持续时间，其指示把该超声波变量P施加到该超声换能器的时间长度，
-毛细管对连接点的碰撞速度，
-一个指示在毛细管碰撞连接点之前是否已对超声换能器施加超声波变量的二进制参数。
从美国3,458,921专利已知一种确定各最优接合参数的方法。利用该方法，进行数次接合操作，从而每次按离散的步长在预定范围内改变这些要优化的接合参数。然后，使这些连接受到剪切或拉伸试验并且确定给出最好的试验结果的接合操作。
发明内容
本发明的目的是得到一种容易确定最优接合参数的方法。
通过一种带有下述步骤的方法本发明可以确定接合力FB和超声波变量P的并且还可任选地至少另一个引线接合器的接合参数的最优接合参数：
a)进行数次接合操作，以把形成球形的引线末端接合到一个连接点上，其中每次按离散步长在预定范围内改变接合力FB和超声波变量P和如果需要的至少另一个接合参数，其中在接合过程期间，对每次接合操作利用一个传感器产生一个和施到相应连接点上的剪切力成比例的电信号，
b)对每次接合操作，从该由传感器在接合操作期间传送的电信号确定一个量G，
c)确定量G的最大值以及接合力FB、超声波变量P和若需要该至少另一个的接合参数的对应值作为最优接合参数，或者确定量G的全局最大值并确定接合力FB、超声波变量P和若需要该至少另一个的接合参数的对应值作为最优接合参数，或者为量G确定一个其中量G满足预定准则的范围H并且确定接合力FB、超声波变量P和若需要该至少另一个的接合参数处于该范围H内的一个值作为最优接合参数。
量G的例子是各种取决于该剪切力的物理变量，例如，接合操作期间输出的摩擦能或接合操作期间传到半导体芯片上的热能或接合操作期间按在金线和接触区之间形成金属间连接提供的能量或摩擦系数的相应变化、最大可能出现的剪切力等等。其中术语剪切力指的是平行于连接点表面作为引线球在该连接点上的摩擦力而施加在该连接点上的力。该力分量还称为切向力。
本发明的优点在于在外部设备上进行的质量检查例如常规拉伸和剪切实验变成是多余的。
附图说明
以下，根据各附图更详细地解释本发明的各实施例。
附图中：
图1、2示出一个压阻传感器，
图3是该传感器的电路图，
图4示出引线接合器的各部分，
图5是接合处理期间压阻传感器的信号波形，
图6是从压阻传感器信号导出的信号，以及
图7是把一个振动计作为传感器的测量方案。
具体实施方式
图1和图2示出一个集成到一块半导体芯片中的传感器1的平面图和剖面图，该传感器包括四个电气上连接成一个惠斯登电桥的压阻元件2至5。传感器1的输出信号和该惠斯登电桥的输出信号对应。传感器1最好由一个表面7的其中嵌有由P型杂质硅做成的方波形电阻路径式的压阻元件2至5的N型杂质硅6构成。传感器1的表面7由一个绝缘层8覆盖。压阻元件2至5排列在一个大致方形的金属接触区9的外面，在该接触区内引线接合器的毛细管11的梢端把熔化成球形的引线压到该半导体芯片上。理想地把球形接头10压到传感器1上的区域用虚线环10’表示。在图1中直角坐标系统的坐标轴用x和y表示。X方向最好与硅晶的一个[110]轴平行。压阻元件2至5的方形路径沿着x方向并且在x方向上排列在接触区9的左侧和右侧。它们用于获取施加超声波时在x方向上球形接头10在传感器1产生的剪切力Fx。在测量时，应相对于引线接合器定位传感器1以使毛细管11的振荡方向尽可能地和x方向平行。
图3示出由四个压阻元件2至5构成的惠斯登电桥的电路图。通过铝制的常规导线对四个压阻元件2至5接线。最好用电压为U的恒压源对该惠斯登电桥供电。从而该惠斯登电桥的输出电压Uout＝V1-V2为：
U Out = R 2 R 4 - R 3 R 5 ( R 3 + R 4 ) * ( R 2 + R 5 ) U - - - ( 1 ) ,
其中R2至R5代表压阻元件2至5的欧姆律电阻。
图4示意示出引线接合器的各个部分，即，在其稍部固定毛细管11的角状物12，由压电元件组成的超声换能器13以及对超声换能器13供电的电源14。
下面，详细解释依据本发明的用于对接合力FB、超声波变量P以及，任选地，至少另一个接合参数确定最佳接合参数的方法。该方法的第一个步骤包括进行预定量的接合操作，其中在预定范围按离散步长改变接合力FB和超声波变量P以及，若需要，其它接合参数。通过至少一个的传感器监视每次接合操作。存储并且评定传感器传送的信号。这样做时，从传感器信号中确定一个表征接合操作的量G。下面的例子示出如何可以确定接合操作期间输出的摩擦能、接合操作期间传到半导体芯片的热能以及摩擦系数的相对变化。
为了简单，在下面的该例中，仅在n＝1…h步长下改变接合力FB并且在m＝1…k步长下改变超声波变量P。从而对每次接合操作指定一个接合力Fn和一个超声波变量Pm，以及还有一个要确定的量Gn，m。超声波变量P的一个例子是流过超声换能器的交变电流的振幅，即每个值Pm和一个振幅Im对应。对于每次接合操作，把毛细管11放在一个新的接触区9上并且接合一个球形接点。这通常按如下进行：
1.把毛细管11放在一个新接触区9上。
2.对该毛细管施加预定的接合力Fn。
3.一旦达到该接合力Fn，向超声换能器施加振幅Im和频率f给定的固定交变电流Pm＝I(t)＝Imcos(2πft)。获取并且评定接合操作期间由一个指定给接触区9中之一的传感器传送的信号，即，为每次接合操作从传感器传送的信号确定出一个表征量Gn，m。
下面更详细地解释来自传感器传送的信号的表征量Gn，m和它的计算的各种不同的例子。
例1
该例子下量Gn，m是接合操作期间输出的摩擦能Wn，m或者一个和它成比例的变量。为了确定Gn，m，使用一个含有多个接触区9的并且每个接触区9带有一个指定的按照图1的传感器的半导体芯片。每个不同的接触区9用于h*k次接合操作中的一次。在各次接合操作期间，获取并且评定由指定给其接触区9的传感器传送的信号Uout(t)。
图5示出接合处理期间不同时间点下的信号Uout(t)的波形。水平轴代表时间轴t。接合处理开始时和结束时，波形几乎是正弦的(曲线A和D)。另一方面在中间阶段中，出现波形的压扁。这是出现谐波的同义语。可以从“Active test chips for in situ wire bonding processcharacterisation”一文中得到这种情况的物理模型，该文提交并且发表在“Advanced Packaging Technologies Seminar I”的Semicon Singapore2001的会议报告中。该物理模型的另一篇文献是：J.Schwizer，M.Mayer，D.Bolliger，O.Paul和H.Baltes的“热声波球形接点：基于集成式微传感器测量的摩擦模型”，24th IEEE/CPMT Intl.ElectronicManufacturing Technology Symposium IEMT’99 inAustin，Texas，Oct.18-19，1999，pp.108-114。
各个传感器传送的信号Uout(t)按流过超声换能器13的交流电流的频率振荡。图6示意地示出信号Uout(t)的包络线S(t)(虚线)，信号Uout(t)的第一谐波A1(t)的包络线以及第三谐波A3(t)的包络线。信号A3(t)是在放大五倍下显示的。在to＝0时接通超声波换能器，接着信号S(t)增大，在时刻t1处经过局部最大值M1，在时刻t2达到局部最小值M2，并且在于时刻t3达到全局最大值M3之前继续增大。局部最大值M1表示现在开始接合线和接触区之间的摩擦。由于这个原因，现在出现第三谐波，它的包络线A3(t)开始增大，在时刻t4达到最大值M4，接着再次下降并最终几乎保持在几乎不变的电平下。达到不变电平表示可以结束该接合操作。从信号S(t)、A1(t)和A3(t)的时间特征曲线，可以把接合操作期间输出的摩擦能Wn，m确定为：
W n , m = ∫ t a t b Q ( t ) dt , - - - ( 1 )
其中时刻ta代表摩擦的开始，时刻tb代表摩擦的结束，而Q(t)代表摩擦能。
把上面提到的文献中所说明的蠕动模型做为基础，可以导出摩擦能Q(t)和信号S(t)、A1(t)、A3(t)之间的关系。摩擦能Q(t)可粗略地表示为：
Q(t)＝k*[S2(t)*(h-1(t)-1)]                      (2)
其中变量h(t)代表一个依赖于关系式a3(t)＝A3(t)/A1(t)的变量并且k是一个常数。对于h(t)已找到关系式
h ( t ) = b 1 * a 3 3 ( t ) + b 2 * a 3 2 ( t ) + b 3 * a 3 ( t ) + b 0 - - - ( 3 )
其中b1＝1.4587、b2＝-2.1090、b3＝-2.4655以及b0＝1.0006。
为了按照式(1)计算摩擦能Wn，m，现在必须确定时间点ta和tb。如已提到那样，从物理观点来看当传感器的信号在时刻t2达到局部极小值M2时出现连接发展过程。从而可以把时刻t2选为时间点ta。出于类似原因，信号A3(t)几乎为不变的时刻被选为时间点tb。在图6的例子中，该时间点和时刻t3重点。或者，可以把其上信号A3(t)小于预定数量的A3(t)的最大值A3max，例如，在A3(t)＜0.5*A3max或在A3(t)＜0.25*A3max，的时间点用作为时间点tb。
可能发生不出现局部极大值M1和局部极小值M2，而是只存在信号S(t)的增加上的改变。但是这些改变是足够显著的，从而在这种情况下，代替在另外的情况下会出现局部最大值M1的时间点t1可以确定一个其处相当陡变增加的信号S(t)变成较平直的等效时间点t10，同样可以确定一个其处相当陡变增加的信号S(t)变成更陡的等效时间点t20来代替在另外的情况下会出现局部最小值M2的时间点t2。接着可以把时间点t10选为时间点ta。
在这种方式下，从式(1)、(2)和(3)，可以为每次接合操作确定一个用下标n和m表征的量Gn，m，该量Gn，m通过式(2)中出现的仍然未知的常数k和摩擦能Wn，m耦合：
Gn，m＝Wn，m/k                            (4)
从h*k个摩擦能Wn，m现在可以确定出整数下标n1和m1，其中和这二个下标对应的接合操作的量Gn1，m1为最大。从而下标n1和m1表示在哪些接合参数下达到最大的摩擦能。备择地，还可以利用标准数学方法以便确定覆盖量Gn，m的多项式函数的全局最大值来进行评定，其中下标n1和m1可以会是非整数的数。在这种情况下可以随后通过内插确定接合力FB以及超声换能器的参数P的对应最优值。
但是，最好以这样的方式确定这些最优的接合参数，即，即使由于不可避免的容限实际的接合参数偏离它们的设定值时仍可以在生产中产生具有所需质量的接合连接。从而，对于接合参数，首先确定其中的各个值Gn，m大于预先确定的最小值Go的参数范围H。然后，在该参数范围H内，把那些对和容限相关的偏差给出最大可能的鲁棒性的值选为最优接合参数组。
现在便利从这些值Gn，m确定对应的剪切力，或者若需要确定剪切强度，剪切强度是按每单位接触面积上的剪切力定义的。剪切力和剪切强度是通常为球形接头连接采纳的品质参数。在假定相应的接触面9上剪切掉其上所接合的球形接头所需的剪切力Fs正比于接合处理期间输出的摩擦能的假定下，即在假定Fs＝α*W为正确下，其中变量α是一个常数并且变量W代表和剪切力Fs对应的摩擦能，利用这个方法从而可以得到那些得到最大剪切力的接合参数。
在已经确定各个最优接合参数后，接着可以通过剪切试验检查按这些最优接合参数接合的接头球是否真地达到对应的接合工艺所需要的剪切强度。另外，可以通过剪切试验确定常数α。一旦知道该常数α，则可以通过以后的优化处理不仅确定那些产生最大剪切力的接合参数并且还可以为接合参数组确定一个其中可达到预定剪切力的参数范围。从而，还可以为量G以及对应的接合力FB、超声波变量和若需要该至少另一个的接合参数的值确定一个其中量G满足预定准则的范围。
当确定了这些最优接合参数后，还可以从该传感器传送的信号推导出接合操作所需的施加超声波的时间长度。一旦达到时刻tb就可立即停止提供超声波。其中可按上面所述确定tb。
区间[t2，t3]中的摩擦能Q(t)的另一种表达式是：
Q(t)＝4*f*Fx(t)*[Ao-kS*Fx(t)]                  (5)
其中f代表超声波的频率，Ao为球形接头(球)下面的自由振荡的振幅，Fx为施加在相应接触点上的剪切力，而ks为一个表示该“毛细管-金球-接触区”系统的刚性的常数，其中该系统的刚性和ks成反比。
在假定传感器信号S(t)正比于剪切力Fx(t)下，即
S(t)＝Fx(t)/s0                                    (6)
其中变量So是一个常数，式(1)中给出的摩擦能Q(t)可表达成
Q(t)＝q1*S(t)+q2*S2(t)                          (7)
其中q1和q2是常数并且为：
q1＝4*f*A0*s0                                   (8)
q2＝-4*f*kS*s0 2                                 (9)
可以通过利用一个剪切试验设备的标定，即把该剪切试验设备测到的剪切力和同时由该传感器传送的信号进行比较，在剪切下一个接合在该传感器的接触区上的球形接头下确定常数So。例如可以利用一个测量毛细管的自由振荡未梢的振幅的振动计粗略地确定球形接头下方的自由振荡的振幅Ao。
从测到的信号S(t)的形状确定常数ks。剪切力Fx(t)和接合力Fn是按下式耦合的：
Fx(t)＝μ(t)*Fn                                 (10)
其中μ(t)代表摩擦系数。随着球形接头和接触区之间的连接强度的增加，摩擦系数μ(t)加大。在通过局部最小值M2之后连接的发展速度，即摩擦系数μ(t)的变化率，正比于摩擦能的似乎合理的假定下：
dμ(t)/dt＝kB*Q(t)                               (11)，
其中变量kB代表比例常数，从式(6)到(11)可以得到传感器信号S(t)的一个微分方程，该微分方程具有解析解：
S c ( t ) = c 1 * e c 1 t c 1 S ( t 2 ) - c 2 * e c 1 t - - - ( 12 ) ,
其中常数C1和C2为：
c1＝4*f*A0*Fn*kB                               (13)
c2＝-4*f*kS*s0*Fn*kB                         (14)
通过在区间[t2，t3]或一个较小的区间[t2，t3-r*(t3-t2)]，其中r为0和1之间的一个系数，用式(12)给出的函数Sc(t)拟合传感器信号S(t)，可以得到常数kB和kS。以这种方式，根据式(1)和(7)-(9)可以从传感器信号S(t)确定出作为一个绝对值变量的摩擦能。
即使当利用该第二个方案为了确定摩擦能Wn，m只需要传感器信号Uout(t)的包络线S(t)时，但对于确定标志式(1)的积分终点的时间tb利用第一谐波的包络线A1(t)和/或第三谐波的包络线A3(t)仍是有好处的。
例2
在这个例子中，把球形接头和接触区之间的摩擦系数μ(t)上的相对改变Δμ用作为特征量Gn，m。和第一个例子中相同的传感器充当传感器。摩擦系数μ(t)通过下面的关系式和传感器的输出信号Uout(t)的包络线S(t)耦合：
S(t)＝μ(t)*Fn/s0                               (15)
其中S0代表一个常数而Fn为实际接合力。从包络线S(t)按如下计算量Gn，m：
G n , m = Δμ n , m = 2 M 3 M 1 + M 2 - - - ( 16 )
其中M1代表包络线S(t)的第一局部最大值，M2代表S(t)的第一局部最小值，而M3代表S(t)的全局最大值(参见图6)，如果不出现局部最大值M1和局部最小值M2，则用每次曲线S(t)的斜率急剧改变处的那些值来替代它们，如在第一例中已对此作出解释那样。
替代地，还可以利用下面的关系式描述摩擦系数μ(t)的相对改变Δμ： G n , m = Δμ n , m = M 3 M 1 - - - ( 17 )
G n , m = Δμ n , m = M 3 M 2 - - - ( 18 )
Gn，m＝Δμn，m＝(M3-M1)*s0/Fn                    (19)
例3
在接合操作期间传感器信号S(t)达到的最大值M3也适用于用来确定这些最优接合参数：
Gn，m＝max(Sn，m(t))＝M3                              (1)
根据式(10)和(16)，值M3和最大剪切力相对应。
为了按照第一例确定摩擦能Wn，m，还可以用一个外部传感器，尤其是一个根据激光多普勒振动学进行表面振荡的不接触测量的振动计16，代替依据图1的传感器。一种适用的振动计例如是由Polytec公司出售的。图8示意地示出这种振动计的使用。振动计16的测量头17发射激光束18，该激光束最好按直角照射到基片20上所安装的半导体芯片21的侧表面19上，在该侧表面上激光束反射并且再次照射到振动计16的测量头17上。激光束18最好照射在侧表面19的上缘附近。其上发生接合的接触区安排在侧面19附近，从而从毛细管传到半导体芯片的振动使侧面19振动。振动计16和根据图1的传感器一样传送一个品质相同的信号，从而可以按和例1相同的方式进行评定。
振动计的优点在于可以为任何半导体芯片，尤其是不带有集成式传感器的芯片，确定最优接合参数。振动计因此还可以用于生产过程中的连续监视并且引线接合器可以设置成当测到的量G低于预定的最小值时报警。
另外，有可能把压电传感器安装在该角状物上，尤其在利用其把该角状物固定到引线接合器的接合头上的安装凸缘区中，其中必须把该传感器设计成传送和切向力Fx相关的信号。

Claims (10)

1.一种用于确定接合处理中使用的引线接合器的接合力FB、超声波变量P和任选的至少另一个的接合参数的最优接合参数的方法，其特征在于以下步骤：
a)进行数次接合操作，以把形成为球形的引线头接合到一个连接点上，其中每次在预定范围内按离散步长改变接合力FB和超声波变量P并且如果需要改变该至少另一个的接合参数，其中在接合过程期间，对每次接合操作利用一个传感器产生一个和施加到相应连接点上的剪切力成比例的电信号，
b)对每次接合操作，从该由传感器在接合操作期间传送的电信号确定一个量G，
c)确定量G的最大值以及接合力FB、超声波变量P并且若需要该至少另一个的接合参数的对应值作为最优接合参数，或者确定量G的全局最大值并确定接合力FB、超声波变量P和若需要该至少另一个的接合参数的对应值作为最优接合参数，或者对量G确定一个其中量G满足预定准则的范围H并且确定接合力FB、超声波变量P和若需要该至少另一个的接合参数处于该范围H内的一个值作为最优接合参数。
2.依据权利要求1的方法，其特征在于，对于每次接合操作，在半导体芯片(21)的一个接触区(9)中发生接合，并且该传感器是一个集成在该半导体芯片(21)中的压阻传感器。
3.依据权利要求1的方法，其特征在于，从该传感器传送的信号中得出摩擦能Q(t)，并且该量G对应于接合操作期间输出的摩擦能。
4.依据权利要求2的方法，其特征在于，从该传感器传送的信号中得出摩擦能Q(t)，并且该量G对应于接合操作期间输出的摩擦能。
5.依据权利要求1的方法，其特征在于，对于每次接合操作，在半导体芯片(21)的一个接触区(9)中发生接合，并且在步骤b)中该量G被确定为接合操作期间产生的电信号的最大值。
6.依据权利要求1的方法，其特征在于，对于每次接合操作，把球形接头接合到半导体芯片(21)的接触区(9)上，并且球形接头和接触区之间的摩擦系数从传导器发送的信号中导出，在步骤b)中确定的量G对应于接合操作期间出现的摩擦系数μ(t)的一个相对改变Δμ。
7.依据权利要求1的方法，其特征在于，向半导体芯片(21)的侧面(19)发送激光束(18)的振动计(16)充当该传感器。
8.依据权利要求3的方法，其特征在于，向半导体芯片(21)的侧面(19)发送激光束(18)的振动计(16)充当该传感器。
9.依据权利要求4的方法，其特征在于，向半导体芯片(21)的侧面(19)发送激光束(18)的振动计(16)充当该传感器。
10.依据权利要求6的方法，其特征在于，向半导体芯片(21)的侧面(19)发送激光束(18)的振动计(16)充当该传感器。
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