ATE147672T1 - Steuerungssystem - Google Patents

Steuerungssystem

Info

Publication number
ATE147672T1
ATE147672T1 AT92309080T AT92309080T ATE147672T1 AT E147672 T1 ATE147672 T1 AT E147672T1 AT 92309080 T AT92309080 T AT 92309080T AT 92309080 T AT92309080 T AT 92309080T AT E147672 T1 ATE147672 T1 AT E147672T1
Authority
AT
Austria
Prior art keywords
wire
bonding
deformation
electrical
electronic component
Prior art date
Application number
AT92309080T
Other languages
English (en)
Inventor
Farhad Farassat
Original Assignee
F&K Delvotec Bondtechnik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26299771&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE147672(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from GB919123047A external-priority patent/GB9123047D0/en
Priority claimed from GB9219029A external-priority patent/GB2270868B/en
Application filed by F&K Delvotec Bondtechnik Gmbh filed Critical F&K Delvotec Bondtechnik Gmbh
Application granted granted Critical
Publication of ATE147672T1 publication Critical patent/ATE147672T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00 relating to investigating the properties, e.g. the weldability, of materials
    • B23K31/125—Weld quality monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Quality & Reliability (AREA)
  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Iron Core Of Rotating Electric Machines (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
AT92309080T 1991-10-30 1992-10-05 Steuerungssystem ATE147672T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB919123047A GB9123047D0 (en) 1991-10-30 1991-10-30 Control system
GB9219029A GB2270868B (en) 1992-09-08 1992-09-08 Control system

Publications (1)

Publication Number Publication Date
ATE147672T1 true ATE147672T1 (de) 1997-02-15

Family

ID=26299771

Family Applications (1)

Application Number Title Priority Date Filing Date
AT92309080T ATE147672T1 (de) 1991-10-30 1992-10-05 Steuerungssystem

Country Status (6)

Country Link
US (1) US5314105A (de)
EP (1) EP0540189B1 (de)
JP (1) JP3276421B2 (de)
KR (1) KR930009007A (de)
AT (1) ATE147672T1 (de)
DE (1) DE69216761T2 (de)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5595330A (en) * 1994-08-24 1997-01-21 Verity Instruments, Inc. Power supply
JP3207685B2 (ja) * 1994-09-27 2001-09-10 東芝マイクロエレクトロニクス株式会社 半導体装置の組み立て方法とその装置
DE19512820B4 (de) * 1995-04-05 2005-11-03 Branson Ultraschall Niederlassung Der Emerson Technologies Gmbh & Co Verfahren und Vorrichtung zum Einstellen der Arbeitsfrequenz eines Orbitalvibrationsschweißsystems
US5824998A (en) * 1995-12-20 1998-10-20 Pulsar Welding Ltd. Joining or welding of metal objects by a pulsed magnetic force
JPH1027996A (ja) * 1996-07-10 1998-01-27 Matsushita Electric Ind Co Ltd 電子部品装着装置
US5894981A (en) * 1996-11-27 1999-04-20 Orthodyne Electronics Corporation Integrated pull tester with an ultrasonic wire bonder
EP0857535B1 (de) * 1997-02-06 2003-06-25 F & K Delvotec Bondtechnik GmbH Verbindungskopf für eine Drahtverbindungsvorrichtung
EP0864392B1 (de) * 1997-03-13 2001-08-16 F & K Delvotec Bondtechnik GmbH Bondkopf
AU1660199A (en) 1997-10-13 1999-05-03 Hesse & Knipps Gmbh Quality control method
JPH11330134A (ja) * 1998-05-12 1999-11-30 Hitachi Ltd ワイヤボンディング方法およびその装置並びに半導体装置
US6237833B1 (en) * 1998-06-15 2001-05-29 Rohm Co., Ltd. Method of checking wirebond condition
US6190497B1 (en) 1999-04-23 2001-02-20 The Hong Kong Polytechnic University Ultrasonic transducer
US6206275B1 (en) 1999-10-13 2001-03-27 F & K Delvotec Bondtechnik Gmbh Deep access, close proximity, fine pitch bonding of large wire
WO2004073914A1 (en) * 1999-11-10 2004-09-02 Asm Technology Singapore Pte Ltd. Force sensing apparatus
US6286747B1 (en) 2000-03-24 2001-09-11 Hong Kong Polytechnic University Ultrasonic transducer
DE10110048A1 (de) * 2001-03-02 2002-09-05 Bosch Gmbh Robert Verfahren zum Prüfen von durch Ultraschall-Drahtbonden hergestellten Verbindungen
JP4202617B2 (ja) 2001-03-16 2008-12-24 矢崎総業株式会社 被覆電線の超音波接合方法およびその方法を用いた超音波接合装置
US6644533B2 (en) 2001-07-03 2003-11-11 Asm Technology Singapore Pte. Ltd. Force sensing apparatus
ATE338603T1 (de) 2001-11-07 2006-09-15 F & K Delvotec Bondtech Gmbh Prüfverfahren für bondverbindungen und drahtbonder
KR20030066344A (ko) 2002-02-01 2003-08-09 에섹 트레이딩 에스에이 와이어본더로 접합시에 최적의 접합 파라미터들을결정하기 위한 방법
EP1343201A1 (de) 2002-03-08 2003-09-10 F & K Delvotec Bondtechnik GmbH "Verfahren und Anordnung zur Herstellung und Qualitätsprüfung einer Drahtbondverbindung"
DE102004022509A1 (de) * 2004-01-07 2005-08-25 Stapla Ultraschall-Technik Gmbh Verfahren zum Abquetschen und Abdichten eines Rohres
EP1625911B1 (de) * 2004-08-11 2007-10-10 F&K Delvotec Bondtechnik GmbH Drahtbonder mit einer Kamera, einer Bildverarbeitungseinrichtung, Speichermittel und Vergleichermittel und Verfahren zum Betrieb eines solchen
US20060163315A1 (en) * 2005-01-27 2006-07-27 Delsman Mark A Ribbon bonding tool and process
DE102005012992B4 (de) * 2005-03-21 2014-01-02 Infineon Technologies Ag Verfahren, Bondeinrichtung und System zum Bonden eines Halbleiterelementes
JP4989492B2 (ja) * 2005-06-13 2012-08-01 パナソニック株式会社 半導体素子接合装置及びこれを用いた半導体素子接合方法
US7845542B2 (en) * 2005-09-22 2010-12-07 Palomar Technologies, Inc. Monitoring deformation and time to logically constrain a bonding process
DE102006020417B4 (de) * 2006-04-26 2008-10-02 Herrmann Ultraschalltechnik Gmbh & Co. Kg Vorrichtung zum Bearbeiten von Werkstücken mittels Ultraschall
US7612773B2 (en) 2006-05-22 2009-11-03 Magnin Paul A Apparatus and method for rendering for display forward-looking image data
JP4679454B2 (ja) * 2006-07-13 2011-04-27 株式会社新川 ワイヤボンディング装置
US20080287801A1 (en) 2006-08-14 2008-11-20 Novelis, Inc. Imaging device, imaging system, and methods of imaging
EP1897648B1 (de) 2006-09-05 2010-06-30 Technische Universität Berlin Verfahren und Vorrichtung zur Regelung der Herstellung von Drahtbondverbindungen
US8302840B2 (en) * 2007-05-16 2012-11-06 Kulicke And Soffa Industries, Inc. Closed loop wire bonding methods and bonding force calibration
DE102007054626A1 (de) 2007-11-12 2009-05-14 Hesse & Knipps Gmbh Verfahren und Vorrichtung zum Ultraschallbonden
US8875580B2 (en) * 2011-12-13 2014-11-04 The United States Of America As Represented By The Adminstrator Of The National Aeronautics And Space Adminstration Method and apparatus to detect wire pathologies near crimped connector
JP5899907B2 (ja) * 2011-12-26 2016-04-06 富士電機株式会社 ワイヤボンディング用のウェッジツール、ボンディング装置、ワイヤボンディング方法、および半導体装置の製造方法
CN103367186B (zh) * 2012-03-28 2015-12-02 西安永电电气有限责任公司 Igbt芯片键合方法
DE102012106491A1 (de) 2012-07-18 2014-01-23 Herrmann Ultraschalltechnik Gmbh & Co. Kg Verfahren zur Steuerung eines Ultraschallbearbeitungsprozesses
DE102017101736A1 (de) * 2017-01-30 2018-08-02 F&K Delvotec Bondtechnik Gmbh Verfahren zur Herstellung von Drahtbondverbindungen und Anordnung zur Durchführung des Verfahrens
KR102242248B1 (ko) * 2017-05-02 2021-04-20 주식회사 엘지화학 이차전지의 용접 검사장치 및 검사방법

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4047657A (en) * 1976-11-01 1977-09-13 Branson Ultrasonics Corporation Method and apparatus for joining metal workpieces using high frequency vibratory energy
US4606490A (en) * 1982-08-24 1986-08-19 Asm Assembly Automation Limited Apparatus and method for automatic evaluation of a bond created by an ultrasonic transducer
JPS5950536A (ja) * 1982-09-16 1984-03-23 Toshiba Corp ワイヤボンデイング装置
US4555052A (en) * 1983-02-28 1985-11-26 Fairchild Camera & Instrument Corporation Lead wire bond attempt detection
US4496095A (en) * 1983-04-12 1985-01-29 Fairchild Industries, Inc. Progressive ultrasonic welding system
US4696425A (en) * 1984-07-17 1987-09-29 Texas Instruments Incorporated Programmable ultrasonic power supply
DE3667930D1 (de) * 1985-07-12 1990-02-08 Siemens Ag Verfahren zum regeln des prozessverlaufes und zur qualitaetskontrolle beim ultraschallschweissen von werkstuecken.
JPS62150838A (ja) * 1985-12-25 1987-07-04 Hitachi Ltd 検出方法および装置
US4824005A (en) * 1986-08-13 1989-04-25 Orthodyne Electronics Corporation Dual mode ultrasonic generator in a wire bonding apparatus
DE3701652A1 (de) * 1987-01-21 1988-08-04 Siemens Ag Ueberwachung von bondparametern waehrend des bondvorganges
JP2558673B2 (ja) * 1987-01-29 1996-11-27 株式会社東芝 ワイヤボンデイング装置
US4808948A (en) * 1987-09-28 1989-02-28 Kulicke And Soffa Indusries, Inc. Automatic tuning system for ultrasonic generators
GB8826488D0 (en) * 1988-11-11 1988-12-14 Emhart Deutschland Quality control for wire bonding
JP2736914B2 (ja) * 1989-03-06 1998-04-08 株式会社新川 ワイヤボンデイング方法
JP2708222B2 (ja) * 1989-03-31 1998-02-04 株式会社東芝 ボンディング装置
US5192015A (en) * 1991-11-20 1993-03-09 Santa Barbara Research Center Method for wire bonding
US5213249A (en) * 1992-05-29 1993-05-25 International Business Machines Corporation Ultrasonic adhesion/dehesion monitoring apparatus with power feedback measuring means

Also Published As

Publication number Publication date
JP3276421B2 (ja) 2002-04-22
EP0540189B1 (de) 1997-01-15
JPH05218147A (ja) 1993-08-27
DE69216761D1 (de) 1997-02-27
EP0540189A3 (en) 1993-08-18
US5314105A (en) 1994-05-24
DE69216761T2 (de) 1997-07-03
KR930009007A (ko) 1993-05-22
EP0540189A2 (de) 1993-05-05

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee