KR930009007A - 제어시스템 - Google Patents

제어시스템 Download PDF

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Publication number
KR930009007A
KR930009007A KR1019920020040A KR920020040A KR930009007A KR 930009007 A KR930009007 A KR 930009007A KR 1019920020040 A KR1019920020040 A KR 1019920020040A KR 920020040 A KR920020040 A KR 920020040A KR 930009007 A KR930009007 A KR 930009007A
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South Korea
Prior art keywords
wire
bonding
contact surface
ultrasonic energy
supplied
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Application number
KR1019920020040A
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English (en)
Inventor
화라삿트 화아라트
Original Assignee
제이 다블류 랜덜
엠하아트 인코포레이팃드
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Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26299771&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR930009007(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from GB919123047A external-priority patent/GB9123047D0/en
Priority claimed from GB9219029A external-priority patent/GB2270868B/en
Application filed by 제이 다블류 랜덜, 엠하아트 인코포레이팃드 filed Critical 제이 다블류 랜덜
Publication of KR930009007A publication Critical patent/KR930009007A/ko

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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
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  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

전기 또는 전자부품의 접촉표면에 대하여 와이어를 가압하도록 배열되어 초음파변환기(6)에 장착된 본딩공구에 초음파에너지를 공급하고 와이어(8)의 변형을 조정하는 것으로 이루어지는 전기 또는 전자부품의 접촉 표면에 와이어를 접합하기 위한 와이어 본딩공정, 초음파에너지의 레벨과 공급시간과 경우에 따라서 접합력의 크기가 본딩공정중에 폐루프시스템에서 와이어의 변형에 따라 연속적으로 제어된다.

Description

제어시스템
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 25미크론의 두께를 갖는 알루미늄 본딩와이어에 대하여 와이어변형과 일정 접합중량에 따라 제어된 초음파에너지를 사용한 시간에 대하여 와이어 변형을 나타내는 그래프.
제3도는 250미크론의 두께를 갖는 알루미늄 와이어에 대하여 와이어 변형과 일정 접합중량에 따라 제어된 초음파 에너지를 사용한 시간에 대한 와이어 변형을 나타내는 그래프.
제4도는 25미크론의 두께를 갖는 알루미늄 본딩와이어에 대하여 와이어 변형에 따라 제어된 초음파에너지와 접합중량을 사용한 시간에 대한 와이어변형을 나타내는 그래프.
제5도는 250미크론의 두께를 갖는 알루미늄 와이어에 대하여 시간에 대한 와이어변형을 초음파에너지와 접합중량을 사용한 시간에 대한 와이어변형을 나타내는 그래프.
제6도는 와이어본딩 공정중의 세개의 단계를 나타내는 그래프.
제7도는 자동와이어 본딩장치의 두가지 다른 구체예의 블록다이아그램.

Claims (8)

  1. 전기 또는 전자부품(10)의 접촉표면에 와이어(8)를 접합하기 위하여 와이어를 전기 또는 전자부품의 접촉표면에 대하여 가압하도록 배열되어 초음파 변환기(6)에 장착된 접합공구(2)에 초음파에너지를 공급하고 와이어(8)의 변형을 조정하는 것으로 이루어지는 와이어 본딩공정을 수행하기 위한 방법에 있어서, 초음파에너지의 공급레벨과 시간이 본딩공정중에 와이어(8)의 변형에 따라서 연속적으로 제어되는 것을 특징으로 하는 방법.
  2. 제1항에 있어서, 상기 와이어(8)은 100미크론 이하의 두께를 가지며, 상기 공정은 2단계 공정으로 실시되는데 제1단계에서는 와이어(8)의 표면과 그 와이어표면이 접합되는 접촉표면(10)을 청소하기 위하여 초음파에너지가 공급되며, 제2단계에서는 와이어(8)과 접촉표면(10) 사이에 웰드를 형성하기 위하여 초음파에너지가 공급되는 것을 특징으로 하는 방법.
  3. 제1항에 있어서, 상기 와이어(8)은 100미크론 이하의 두께를 가지며, 상기 공정은 3단계공정으로 실시되는데 제1단계에서는 와이어(8)의 포면과 그 와이어 표면이 접합되는 접촉표면(10)을 청소하기 위하여 초음파에너지가 공급되며, 제2단계에서는 와이어(8)과 접촉표면(10) 사이에 웰드를 형성하기 위하여 초음파에너지가 공급되며, 제3단계에서는 와이어(8)과 접촉표면사이의 접합이 고온에서 템퍼링되는 것을 특징으로 하는 방법.
  4. 전기 또는 전자부품(10)의 접촉표면에 와이어(8)를 접합하기 위하여 와이어를 전기 또는 전자부품의 접촉표면에 대하여 가압하도록 배열되어 초음파 변환기(6)에 장착된 접합공구(2)에 초음파에너지를 공급하고 와이어(8)의 변형을 조정하는 것으로 이루어지는 와이어 본딩공정을 수행하기 위한 방법에 있어서, 초음파에너지의 공급레벨과 시간과 접합력의 크기가 본딩공정중에 와이어(8)의 변형에 따라서 연속적으로 제어되는 것을 특징으로 하는 방법.
  5. 제4항에 있어서, 상기 와이어(8)은 100미크론 이하의 두께를 가지며, 상기 공정은 2단계 공정으로 실시되는데 제1단계에서는 와이어(8)의 표면과 그 와이어 표면이 접합되는 접촉표면(10)을 청소하기 위하여 초음파에너지가 공급되며, 제2단계에서는 와이어(8)과 접촉표면(10) 사이에 웰드를 형성하기 위하여 초음파에너지가 공급되는 것을 특징으로 하는 방법.
  6. 제4항에 있어서, 상기 와이어(8)은 100미크론 이하의 두께를 가지며, 상기 공정은 3단계공정으로 실시되는데 제1단계에서는 와이어(8)의 표면과 그 와이어 표면이 접합되는 접촉표면(10)을 청소하기 위하여 초음파에너지가 공급되며, 제2단계에서는 와이어(8)과 접촉표면(10) 사이에 웰드를 형성하기 위하여 초음파에너지가 공급되며, 제3단계에서는 와이어(8)과 접촉표면 사이의 접합이 고온에서 템퍼링하는 것을 특징으로 하는 방법.
  7. 초음파 변환기(6)에 장착된 본딩공구(2)와, 기계의 작동중에 적절한 와이어공급부로 부터 당겨지는 알루미늄와이어(8)을 전기 또는 전자부품(10)의 접촉표면에 대하여 가압하도록 배열된 상기 본딩공구(2)의 본딩팁과 본딩공정중에 본딩웨지의 위치의 변화를 결정하기 위한 센서(12)로 이루어진 본딩헤드로 구성되는 자동와이어 본딩장치에 있어서, 상기 자동와이어 본딩장치는 그밖에도 본딩공정중에 웨지(2)의 위치변화를 결정하기 위한 센서(12)의 출력에 따라 초음파 변환기(6)에 공급되는 에너지와 접합력의 크기를 제어하기 위한 수단(706)으로 구성되는 것을 특징으로 하는 자동와이어 본딩장치.
  8. 초음파 변환기(6)에 장착된 본딩공구(2)와, 기계의 작동중에 적절한 와이어공급부로 부터 당겨지는 알루미늄와이어(8)을 전기 또는 전자부품(10)의 접촉표면에 대하여 가압하도록 배열된 상기 본딩공구(2)의 본딩팁과 본딩공정중에 본딩웨지의 위치의 변화를 결정하기 위한 센서(12)로 이루어진 본딩헤드로 구성되는 자동와이어 본딩장치에 있어서, 상기 자동와이어 본딩장치는 그밖에도 본딩공정중에 웨지(2)의 위치변화를 결정하기 위한 센서(12)의 출력에 따라 초음파 변환기(6)에 공급되는 에너지와 접합력의 크기를 제어하기 위한 수단(706)으로 구성되는 것을 특징으로 하는 자동와이어 본딩장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920020040A 1991-10-30 1992-10-29 제어시스템 KR930009007A (ko)

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GB9123047.4 1991-10-30
GB919123047A GB9123047D0 (en) 1991-10-30 1991-10-30 Control system
GB9219029.7 1992-09-08
GB9219029A GB2270868B (en) 1992-09-08 1992-09-08 Control system

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US5314105A (en) 1994-05-24
EP0540189A2 (en) 1993-05-05
EP0540189A3 (en) 1993-08-18
EP0540189B1 (en) 1997-01-15
DE69216761T2 (de) 1997-07-03
DE69216761D1 (de) 1997-02-27
JP3276421B2 (ja) 2002-04-22
ATE147672T1 (de) 1997-02-15

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