MY157548A - Curing resin composition and semiconductor device employing same - Google Patents

Curing resin composition and semiconductor device employing same

Info

Publication number
MY157548A
MY157548A MYPI2015703879A MYPI2015703879A MY157548A MY 157548 A MY157548 A MY 157548A MY PI2015703879 A MYPI2015703879 A MY PI2015703879A MY PI2015703879 A MYPI2015703879 A MY PI2015703879A MY 157548 A MY157548 A MY 157548A
Authority
MY
Malaysia
Prior art keywords
resin composition
curable resin
semiconductor device
polyorganosiloxane
curing resin
Prior art date
Application number
MYPI2015703879A
Other languages
English (en)
Inventor
Yabuno Shinya
Itaya Ryo
Original Assignee
Daicel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Corp filed Critical Daicel Corp
Publication of MY157548A publication Critical patent/MY157548A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/10—Block or graft copolymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098—Metal salts of carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34924—Triazines containing cyanurate groups; Tautomers thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
MYPI2015703879A 2013-08-06 2014-07-04 Curing resin composition and semiconductor device employing same MY157548A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013163577 2013-08-06

Publications (1)

Publication Number Publication Date
MY157548A true MY157548A (en) 2016-06-16

Family

ID=52461106

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015703879A MY157548A (en) 2013-08-06 2014-07-04 Curing resin composition and semiconductor device employing same

Country Status (6)

Country Link
JP (1) JP5830201B2 (zh)
KR (1) KR101631048B1 (zh)
CN (1) CN105209549B (zh)
MY (1) MY157548A (zh)
TW (1) TWI546339B (zh)
WO (1) WO2015019767A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2985317A1 (en) 2013-02-14 2016-02-17 Daicel Corporation Curable resin composition and cured product thereof, encapsulant, and semiconductor device
KR20170016432A (ko) * 2014-06-06 2017-02-13 주식회사 다이셀 경화성 수지 조성물, 경화물, 밀봉재 및 반도체 장치
JP2016216642A (ja) * 2015-05-22 2016-12-22 株式会社ダイセル 硬化性樹脂組成物及びその硬化物、封止剤、並びに半導体装置
JP2017002172A (ja) * 2015-06-09 2017-01-05 株式会社ダイセル 高硬度ポリシロキサン硬化物を与える硬化性樹脂組成物及びその硬化物
US9912311B2 (en) 2015-07-22 2018-03-06 Samsung Electronics Co., Ltd Multimode reconfigurable amplifier and analog filter including the same
JPWO2017119363A1 (ja) * 2016-01-08 2018-11-01 株式会社ダイセル 硬化性シリコーン樹脂組成物及びその硬化物、並びに光半導体装置
KR20180128921A (ko) * 2016-03-30 2018-12-04 히타치가세이가부시끼가이샤 열경화성 수지 조성물, 광 반도체 소자 탑재용 기판 및 그의 제조 방법 및 광 반도체 장치
JP7265356B2 (ja) 2016-05-03 2023-04-26 ダウ シリコーンズ コーポレーション シルセスキオキサン樹脂及びオキサアミン組成物
US10947384B2 (en) * 2016-09-07 2021-03-16 Daicel Corporation Curable resin composition, cured product thereof, and semiconductor device
CN113574117B (zh) * 2019-03-26 2023-09-12 琳得科株式会社 固化性组合物、固化物和固化性组合物的使用方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4275889B2 (ja) 2001-02-09 2009-06-10 株式会社カネカ 発光ダイオード及びその製造方法
JP2006206721A (ja) 2005-01-27 2006-08-10 Kansai Electric Power Co Inc:The 高耐熱合成高分子化合物及びこれで被覆した高耐電圧半導体装置
JP4826160B2 (ja) 2005-07-28 2011-11-30 ナガセケムテックス株式会社 光素子封止用樹脂組成物
JP5300148B2 (ja) * 2009-11-30 2013-09-25 日本化薬株式会社 エポキシ樹脂組成物、硬化性樹脂組成物
KR20120114237A (ko) * 2009-11-30 2012-10-16 닛뽄 가야쿠 가부시키가이샤 경화성 수지 조성물 및 그 경화물
JP4788837B2 (ja) * 2010-01-26 2011-10-05 横浜ゴム株式会社 シリコーン樹脂組成物およびその使用方法、シリコーン樹脂、シリコーン樹脂含有構造体、ならびに光半導体素子封止体
JP2011159912A (ja) * 2010-02-03 2011-08-18 Sekisui Chem Co Ltd 光半導体素子用封止剤及び光半導体装置
TWI504681B (zh) * 2010-03-08 2015-10-21 Lintec Corp A hardening composition, a hardened product, and a hardening composition
EP2620441B1 (en) * 2010-09-22 2018-10-31 Kaneka Corporation Modified product of polyhedral structure polysiloxane, polyhedral structure polysiloxane composition, cured product, and optical semiconductor device
JP5045861B2 (ja) * 2010-11-10 2012-10-10 横浜ゴム株式会社 熱硬化型シリコーン樹脂組成物、ならびに、これを用いて得られるシリコーン樹脂含有構造体および光半導体素子封止体
CN103221486B (zh) * 2010-11-18 2015-10-14 横滨橡胶株式会社 热固化型有机硅树脂组合物、含有有机硅树脂的结构体、光半导体元件密封体及硅烷醇缩合催化剂
JP2012111875A (ja) * 2010-11-25 2012-06-14 Daicel Corp 硬化性樹脂組成物及び硬化物
JP2012162666A (ja) * 2011-02-08 2012-08-30 Kaneka Corp 多面体構造ポリシロキサン系組成物
JP2012201706A (ja) * 2011-03-23 2012-10-22 Kaneka Corp ポリシロキサン系組成物
KR101867459B1 (ko) * 2011-07-04 2018-06-14 제이엔씨 주식회사 이소시아눌 골격, 에폭시기 및 SiH기를 가지는 오르가노 폴리실록산 또는 실세스퀴옥산 골격을 포함하는 화합물 및 상기 화합물을 밀착 부여재로서 포함하는 열경화성 수지 조성물, 경화물, 및 광 반도체용 봉지재
MY153873A (en) * 2011-12-22 2015-04-01 Daicel Corp Curable resin composition and cured product thereof
KR101545111B1 (ko) * 2012-05-25 2015-08-17 주식회사 다이셀 경화성 수지 조성물 및 그의 경화물, 밀봉제, 및 광반도체 장치
WO2014109349A1 (ja) * 2013-01-09 2014-07-17 株式会社ダイセル 硬化性樹脂組成物及びその硬化物

Also Published As

Publication number Publication date
TW201506087A (zh) 2015-02-16
KR20150135531A (ko) 2015-12-02
JPWO2015019767A1 (ja) 2017-03-02
WO2015019767A1 (ja) 2015-02-12
JP5830201B2 (ja) 2015-12-09
CN105209549B (zh) 2016-10-26
TWI546339B (zh) 2016-08-21
KR101631048B1 (ko) 2016-06-15
CN105209549A (zh) 2015-12-30

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