MY170153A - Curable resin composition and semiconductor device using same - Google Patents

Curable resin composition and semiconductor device using same

Info

Publication number
MY170153A
MY170153A MYPI2015700025A MYPI2015700025A MY170153A MY 170153 A MY170153 A MY 170153A MY PI2015700025 A MYPI2015700025 A MY PI2015700025A MY PI2015700025 A MYPI2015700025 A MY PI2015700025A MY 170153 A MY170153 A MY 170153A
Authority
MY
Malaysia
Prior art keywords
resin composition
curable resin
silsesquioxane
semiconductor device
polyorganosiloxane
Prior art date
Application number
MYPI2015700025A
Inventor
Yasunobu Nakagawa
Ryo Itaya
Original Assignee
Daicel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Corp filed Critical Daicel Corp
Publication of MY170153A publication Critical patent/MY170153A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098—Metal salts of carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/008—Additives improving gas barrier properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34924—Triazines containing cyanurate groups; Tautomers thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/549—Silicon-containing compounds containing silicon in a ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • C08L2203/162—Applications used for films sealable films
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

Provided are a curable resin composition, as well as a cured product, an encapsulant, and a semiconductor device using the curable resin composition. The curable resin composition has transparency, heat resistance, and flexibility, exhibits barrier properties against both hydrogen sulfide (H2S) and sulfur oxide (SOx) gases, and is useful for semiconductor element (particularly, optical semiconductor element) encapsulation. The curable resin composition includes a polyorganosiloxane (A), a silsesquioxane (B), an isocyanurate compound (C), and a zinc compound (E) The polyorganosiloxane (A) is approximately devoid of aryl. The silsesquioxane (B) includes a ladder-like silsesquioxane. The zinc compound (E) is contained in a content from 0.01 part by weight to less than 0.1 part by weight per 100 parts by weight of the total amount of the polyorganosiloxane (A) and the silsesquioxane (B). The cured product, encapsulant, and semiconductor device are prepared from or with the curable resin composition.
MYPI2015700025A 2013-08-01 2014-07-04 Curable resin composition and semiconductor device using same MY170153A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013160291 2013-08-01

Publications (1)

Publication Number Publication Date
MY170153A true MY170153A (en) 2019-07-09

Family

ID=52431540

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015700025A MY170153A (en) 2013-08-01 2014-07-04 Curable resin composition and semiconductor device using same

Country Status (6)

Country Link
JP (1) JP5736524B1 (en)
KR (1) KR101545471B1 (en)
CN (1) CN104583326B (en)
MY (1) MY170153A (en)
TW (1) TWI510556B (en)
WO (1) WO2015016000A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101711320B1 (en) * 2013-02-14 2017-02-28 주식회사 다이셀 Curable resin composition and cured product thereof, encapsulant, and semiconductor device
KR20170016432A (en) * 2014-06-06 2017-02-13 주식회사 다이셀 Curable resin composition, cured product, sealing material, and semiconductor device
JP2016216642A (en) * 2015-05-22 2016-12-22 株式会社ダイセル Curable resin composition, cured article thereof, encapsulation agent and semiconductor device
JP2017002172A (en) * 2015-06-09 2017-01-05 株式会社ダイセル Curable resin composition providing high hardness polysiloxane cured article and cured article thereof
JP2017075216A (en) * 2015-10-13 2017-04-20 株式会社ダイセル Curable resin composition, cured product of the same, and semiconductor device
JP6567693B2 (en) * 2016-01-15 2019-08-28 ペルノックス株式会社 Condensation reaction type silicone composition and cured product
KR20180113602A (en) 2016-02-22 2018-10-16 주식회사 다이셀 Curable resin composition, cured product thereof, and semiconductor device
CN109563347A (en) * 2016-08-19 2019-04-02 道康宁东丽株式会社 For protecting the organopolysiloxane composition of the room-temperature-curable of electrical/electronic components
CN110177841A (en) * 2017-01-16 2019-08-27 株式会社大赛璐 Hardening resin composition, its solidfied material and semiconductor device
JP7390962B2 (en) * 2020-04-14 2023-12-04 信越化学工業株式会社 Curable organosilicon resin composition

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011022947A (en) * 2009-07-18 2011-02-03 Ati:Kk Pattern recognition device
KR20120114237A (en) * 2009-11-30 2012-10-16 닛뽄 가야쿠 가부시키가이샤 Curable resin composition and cured product thereof
JP5300148B2 (en) * 2009-11-30 2013-09-25 日本化薬株式会社 Epoxy resin composition, curable resin composition
JP4788837B2 (en) * 2010-01-26 2011-10-05 横浜ゴム株式会社 Silicone resin composition and method for using the same, silicone resin, silicone resin-containing structure, and optical semiconductor element sealing body
TWI504681B (en) * 2010-03-08 2015-10-21 Lintec Corp A hardening composition, a hardened product, and a hardening composition
JP5784618B2 (en) * 2010-09-22 2015-09-24 株式会社カネカ Modified polyhedral polysiloxane, polyhedral polysiloxane composition, cured product, and optical semiconductor device
WO2012063822A1 (en) * 2010-11-10 2012-05-18 横浜ゴム株式会社 Thermosetting silicone resin composition, and silicone resin-containing structure and optical semiconductor element encapsulant obtained using same
JP5045862B2 (en) * 2010-11-18 2012-10-10 横浜ゴム株式会社 Thermosetting silicone resin composition, silicone resin-containing structure, sealed optical semiconductor element, and silanol condensation catalyst
JP2012111875A (en) * 2010-11-25 2012-06-14 Daicel Corp Curable resin composition and cured article
JP2012162666A (en) * 2011-02-08 2012-08-30 Kaneka Corp Polysiloxane-based composition of polyhedral structure
JP2012201706A (en) * 2011-03-23 2012-10-22 Kaneka Corp Polysiloxane-based composition
JP5880556B2 (en) * 2011-07-04 2016-03-09 Jnc株式会社 Compound containing organopolysiloxane or silsesquioxane skeleton having isocyanur skeleton, epoxy group and SiH group, and thermosetting resin composition, cured product, and optical semiconductor encapsulant containing the compound as an adhesion-imparting material
WO2013094625A1 (en) * 2011-12-22 2013-06-27 株式会社ダイセル Curable resin composition and curable product thereof
WO2013176238A1 (en) * 2012-05-25 2013-11-28 株式会社ダイセル Curable resin composition, and cured product, sealing agent, and optical semiconductor device using same
JP5778875B2 (en) * 2013-01-09 2015-09-16 株式会社ダイセル Curable resin composition and cured product thereof

Also Published As

Publication number Publication date
TWI510556B (en) 2015-12-01
JP5736524B1 (en) 2015-06-17
WO2015016000A9 (en) 2015-03-12
JPWO2015016000A1 (en) 2017-03-02
CN104583326A (en) 2015-04-29
TW201506089A (en) 2015-02-16
WO2015016000A1 (en) 2015-02-05
KR20150028368A (en) 2015-03-13
KR101545471B1 (en) 2015-08-18
CN104583326B (en) 2016-03-02

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