JP7390962B2 - Curable organosilicon resin composition - Google Patents
Curable organosilicon resin composition Download PDFInfo
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- JP7390962B2 JP7390962B2 JP2020072522A JP2020072522A JP7390962B2 JP 7390962 B2 JP7390962 B2 JP 7390962B2 JP 2020072522 A JP2020072522 A JP 2020072522A JP 2020072522 A JP2020072522 A JP 2020072522A JP 7390962 B2 JP7390962 B2 JP 7390962B2
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- 239000011342 resin composition Substances 0.000 title claims description 45
- 125000004432 carbon atom Chemical group C* 0.000 claims description 92
- 125000003342 alkenyl group Chemical group 0.000 claims description 56
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 43
- -1 isocyanurate compound Chemical class 0.000 claims description 38
- 229920001296 polysiloxane Polymers 0.000 claims description 38
- 125000000217 alkyl group Chemical group 0.000 claims description 33
- 239000000203 mixture Substances 0.000 claims description 33
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 27
- 239000004065 semiconductor Substances 0.000 claims description 27
- 125000003118 aryl group Chemical group 0.000 claims description 22
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 20
- 125000003545 alkoxy group Chemical group 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 150000003961 organosilicon compounds Chemical class 0.000 claims description 16
- 125000001424 substituent group Chemical group 0.000 claims description 15
- 229910004283 SiO 4 Inorganic materials 0.000 claims description 14
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 11
- 239000003054 catalyst Substances 0.000 claims description 9
- 230000007797 corrosion Effects 0.000 claims description 9
- 238000005260 corrosion Methods 0.000 claims description 9
- 239000003112 inhibitor Substances 0.000 claims description 9
- 238000002834 transmittance Methods 0.000 claims description 9
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 8
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 5
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 3
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 claims description 3
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 3
- 239000000391 magnesium silicate Substances 0.000 claims description 3
- 229910052919 magnesium silicate Inorganic materials 0.000 claims description 3
- 235000019792 magnesium silicate Nutrition 0.000 claims description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 claims description 3
- 229960001763 zinc sulfate Drugs 0.000 claims description 3
- 229910000368 zinc sulfate Inorganic materials 0.000 claims description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 2
- 239000000049 pigment Substances 0.000 claims 1
- 239000000047 product Substances 0.000 description 31
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 19
- 239000000463 material Substances 0.000 description 18
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 18
- 238000001723 curing Methods 0.000 description 13
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 13
- 238000005486 sulfidation Methods 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 9
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 8
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 7
- 125000004122 cyclic group Chemical group 0.000 description 7
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 7
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 7
- 125000006038 hexenyl group Chemical group 0.000 description 7
- 125000004365 octenyl group Chemical group C(=CCCCCCC)* 0.000 description 7
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- 229910052697 platinum Inorganic materials 0.000 description 6
- 239000012463 white pigment Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 5
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 125000000555 isopropenyl group Chemical group [H]\C([H])=C(\*)C([H])([H])[H] 0.000 description 5
- 230000007774 longterm Effects 0.000 description 5
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 5
- 125000004344 phenylpropyl group Chemical group 0.000 description 5
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 5
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 5
- 238000005987 sulfurization reaction Methods 0.000 description 5
- 125000003944 tolyl group Chemical group 0.000 description 5
- 125000005023 xylyl group Chemical group 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 125000003710 aryl alkyl group Chemical group 0.000 description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 4
- 229920001843 polymethylhydrosiloxane Polymers 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000000753 cycloalkyl group Chemical group 0.000 description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 239000011253 protective coating Substances 0.000 description 3
- 238000009877 rendering Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 2
- 125000004975 3-butenyl group Chemical group C(CC=C)* 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 2
- 229910052788 barium Inorganic materials 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 125000005388 dimethylhydrogensiloxy group Chemical group 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000002096 quantum dot Substances 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 1
- 125000000027 (C1-C10) alkoxy group Chemical group 0.000 description 1
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 description 1
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 description 1
- RWXZXCZBMQPOBF-UHFFFAOYSA-N 5-methyl-1H-benzimidazole Chemical compound CC1=CC=C2N=CNC2=C1 RWXZXCZBMQPOBF-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 125000006374 C2-C10 alkenyl group Chemical group 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000005046 Chlorosilane Substances 0.000 description 1
- 238000005481 NMR spectroscopy Methods 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 230000006750 UV protection Effects 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000013006 addition curing Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 238000006356 dehydrogenation reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- WMVRXDZNYVJBAH-UHFFFAOYSA-N dioxoiron Chemical compound O=[Fe]=O WMVRXDZNYVJBAH-UHFFFAOYSA-N 0.000 description 1
- YADSGOSSYOOKMP-UHFFFAOYSA-N dioxolead Chemical compound O=[Pb]=O YADSGOSSYOOKMP-UHFFFAOYSA-N 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
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- 239000003365 glass fiber Substances 0.000 description 1
- 150000008282 halocarbons Chemical group 0.000 description 1
- 125000003707 hexyloxy group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])O* 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 238000006459 hydrosilylation reaction Methods 0.000 description 1
- NYMPGSQKHIOWIO-UHFFFAOYSA-N hydroxy(diphenyl)silicon Chemical compound C=1C=CC=CC=1[Si](O)C1=CC=CC=C1 NYMPGSQKHIOWIO-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 1
- 125000002510 isobutoxy group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])O* 0.000 description 1
- 125000003253 isopropoxy group Chemical group [H]C([H])([H])C([H])(O*)C([H])([H])[H] 0.000 description 1
- 239000003446 ligand Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 125000006606 n-butoxy group Chemical group 0.000 description 1
- 125000003506 n-propoxy group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])O* 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- NDLPOXTZKUMGOV-UHFFFAOYSA-N oxo(oxoferriooxy)iron hydrate Chemical compound O.O=[Fe]O[Fe]=O NDLPOXTZKUMGOV-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 125000004115 pentoxy group Chemical group [*]OC([H])([H])C([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- PARWUHTVGZSQPD-UHFFFAOYSA-N phenylsilane Chemical compound [SiH3]C1=CC=CC=C1 PARWUHTVGZSQPD-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 125000000725 trifluoropropyl group Chemical group [H]C([H])(*)C([H])([H])C(F)(F)F 0.000 description 1
- 239000005051 trimethylchlorosilane Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Description
本発明は、硬化性有機ケイ素樹脂組成物及び半導体装置に関する。 The present invention relates to a curable organosilicon resin composition and a semiconductor device.
近年、光半導体装置は、屋外照明または車載用照明等のＬＥＤ照明として使用されている。そのような光半導体装置の封止材には、一般的にシリコーン樹脂などのガス又は水分の透過性が高い樹脂が使用されている。そのため、屋外などの過酷な環境下においては、光半導体装置の電極または反射層として使用されている銀めっき層が、硫黄系のガス又は水分によって腐食し、輝度が大きく低下するという問題がある。 In recent years, optical semiconductor devices have been used as LED lighting such as outdoor lighting or vehicle lighting. Resins with high gas or moisture permeability, such as silicone resins, are generally used as encapsulants for such optical semiconductor devices. Therefore, under harsh environments such as outdoors, the silver plating layer used as the electrode or reflective layer of the optical semiconductor device is corroded by sulfur-based gas or moisture, causing a problem in that the brightness is significantly reduced.
この対策として、フェニル基等の芳香族系置換基の導入による高屈折率化及びガスバリア性の向上が検討されているが（特許文献１－２）、芳香族系置換基を導入すると、耐熱性が悪化するといった問題がある。 As a countermeasure to this problem, increasing the refractive index and improving gas barrier properties by introducing aromatic substituents such as phenyl groups has been studied (Patent Documents 1-2); There is a problem that it gets worse.
また、金属を腐食させないための腐食防止剤としては、たとえばベンゾトリアゾールや５－メチルベンズイミダゾールといったＮ含有芳香族炭化水素類の化合物、または亜鉛等の金属錯体が知られており、これらの腐食防止剤添加による試みも検討されている。しかしながら、腐食防止剤、金属配位子の変色により、樹脂の耐熱性が大きく低下するという問題がある（特許文献３）。 In addition, as corrosion inhibitors to prevent metals from corroding, compounds of N-containing aromatic hydrocarbons such as benzotriazole and 5-methylbenzimidazole, or metal complexes such as zinc are known. Attempts by adding agents are also being considered. However, there is a problem in that the heat resistance of the resin is significantly reduced due to discoloration of the corrosion inhibitor and metal ligand (Patent Document 3).
本発明は、上記問題に鑑みてなされたものであり、耐熱性・耐硫化性に優れたシリル化イソシアヌレート化合物含有硬化性有機ケイ素樹脂組成物及び半導体装置を提供することを目的とする。 The present invention has been made in view of the above problems, and an object of the present invention is to provide a curable organosilicon resin composition containing a silylated isocyanurate compound and a semiconductor device having excellent heat resistance and sulfidation resistance.
本発明は、上記目的を達成するためになされたものであり、
（Ａ）１分子中に少なくとも２個のアルケニル基を有する有機ケイ素化合物、
（Ｂ）１分子中に少なくとも２個のケイ素原子に結合した水素原子を有する有機ケイ素化合物：前記（Ａ）成分のアルケニル基１ｍｏｌに対して、前記（Ｂ）成分のＳｉＨ基が０．１～４．０ｍｏｌとなる量、
（Ｃ）白金族金属系触媒、
（Ｄ）金属腐食防止剤として、下記一般式（１）で示されるシリル化イソシアヌレート化合物、
を含むものである硬化性有機ケイ素樹脂組成物を提供する。
(A) an organosilicon compound having at least two alkenyl groups in one molecule;
(B) An organosilicon compound having at least two hydrogen atoms bonded to silicon atoms in one molecule: 0.1 to 0.1 to 0.1 to 0.1 to 0.1 to 0.1 to 1 mol of the SiH group of the component (B) per 1 mol of the alkenyl group of the component (A). Amount that becomes 4.0 mol,
(C) platinum group metal catalyst,
(D) A silylated isocyanurate compound represented by the following general formula (1) as a metal corrosion inhibitor,
A curable organosilicon resin composition is provided.
このようなシリル化イソシアヌレート化合物を添加剤として含む付加反応硬化型シリコーン組成物によれば、耐熱性、耐硫化性に優れた硬化物を与えることができる。 An addition reaction-curable silicone composition containing such a silylated isocyanurate compound as an additive can provide a cured product with excellent heat resistance and sulfidation resistance.
このとき、前記（Ａ）成分が、
（Ａ１）ＳｉＯ４／２単位、もしくはＲ４ＳｉＯ３／２単位の少なくともいずれかを含み（Ｒ４は炭素数１～１０のアルキル基、炭素数２～１０のアルケニル基、または炭素数６～１０のアリール基である。）、
１分子中に少なくとも２個のケイ素原子に結合したアルケニル基を有するレジン状のオルガノポリシロキサンであることが好ましい。
At this time, the component (A) is
(A1) Contains at least either SiO 4/2 units or R 4 SiO 3/2 units (R 4 is an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, or an alkenyl group having 6 to 10 carbon atoms) 10 aryl groups),
A resin-like organopolysiloxane having at least two silicon-bonded alkenyl groups in one molecule is preferred.
またこのとき、前記（Ａ１）成分が、
０～６０ｍｏｌ％のＳｉＯ４／２単位、
０～９０ｍｏｌ％のＲ４ＳｉＯ３／２単位、
０～５０ｍｏｌ％の（Ｒ４）２ＳｉＯ２／２単位及び、
１０～５０ｍｏｌ％の（Ｒ４）３ＳｉＯ１／２単位からなり、
前記ＳｉＯ４／２単位と前記Ｒ４ＳｉＯ３／２単位の和が５０ｍｏｌ％以上であるオルガノポリシロキサンであって、
前記オルガノポリシロキサンの重量平均分子量が１，０００～５，０００であり、
１分子中に少なくとも２個のケイ素原子に結合したアルケニル基を有し、
前記オルガノポリシロキサンは、前記ＳｉＯ４／２単位、前記Ｒ４ＳｉＯ３／２単位、前記（Ｒ４）２ＳｉＯ２／２単位及び前記（Ｒ４）３ＳｉＯ１／２単位に由来する、縮合せずに一部残存するケイ素原子に結合した水酸基及びアルコキシ基を有し、
前記水酸基の量が０．００１～１．０ｍｏｌ／１００ｇであり、
炭素数が１～１０のケイ素原子に結合した前記アルコキシ基の量が１．０ｍｏｌ／１００ｇ以下であるレジン状のオルガノポリシロキサンであることが好ましい。
Moreover, at this time, the component (A1) is
0 to 60 mol% SiO 4/2 units,
0 to 90 mol% R 4 SiO 3/2 units,
0 to 50 mol% of (R 4 ) 2 SiO 2/2 units and
Consisting of 10 to 50 mol% of (R 4 ) 3 SiO 1/2 units,
An organopolysiloxane in which the sum of the SiO 4/2 units and the R 4 SiO 3/2 units is 50 mol% or more,
The organopolysiloxane has a weight average molecular weight of 1,000 to 5,000,
having at least two silicon-bonded alkenyl groups in one molecule,
The organopolysiloxane is a condensed polysiloxane derived from the SiO 4/2 unit, the R 4 SiO 3/2 unit, the (R 4 ) 2 SiO 2/2 unit, and the (R 4 ) 3 SiO 1/2 unit. It has a hydroxyl group and an alkoxy group bonded to some remaining silicon atoms,
The amount of the hydroxyl group is 0.001 to 1.0 mol/100 g,
Preferably, it is a resin-like organopolysiloxane in which the amount of the alkoxy group bonded to a silicon atom having 1 to 10 carbon atoms is 1.0 mol/100 g or less.
このようにすれば、組成物が脆くなる恐れがなく、また流動しなくなる恐れがない。また、ケイ素原子に結合した水酸基の量が０．００１ｍｏｌ／１００ｇ以上であれば、十分な接着性を確保でき、１．０ｍｏｌ／１００ｇ以下であれば保存安定性の低下や表面タックを起こさない。また、アルコキシ基の量が１．０ｍｏｌ／１００ｇ以下であれば、硬化時に副生成物のアルコールガスが発生しづらく、硬化物にボイドが残る恐れもない。 In this way, there is no risk that the composition will become brittle or stop flowing. Furthermore, if the amount of hydroxyl groups bonded to silicon atoms is 0.001 mol/100 g or more, sufficient adhesion can be ensured, and if it is 1.0 mol/100 g or less, storage stability will not deteriorate or surface tack will not occur. Furthermore, if the amount of alkoxy groups is 1.0 mol/100 g or less, alcohol gas as a by-product is less likely to be generated during curing, and there is no fear that voids will remain in the cured product.
このとき、前記（Ａ）成分は、前記（Ａ１）成分に加えて更に、
（Ａ２）１分子中に２個以上の炭素数２～１０のケイ素原子結合アルケニル基を有し、
ＪＩＳ Ｋ ７１１７－１：１９９９記載の方法で測定した、２５℃での粘度が１０～１００，０００ｍＰａ・ｓである直鎖状または分岐鎖状のオルガノポリシロキサンを含むことが好ましい。
At this time, the component (A) includes, in addition to the component (A1),
(A2) having two or more silicon-bonded alkenyl groups having 2 to 10 carbon atoms in one molecule;
It is preferable to include a linear or branched organopolysiloxane having a viscosity of 10 to 100,000 mPa·s at 25° C. as measured by the method described in JIS K 7117-1:1999.
このようにすれば、用途に合わせて粘度及び硬度を調製することができる。また、粘度が１０ｍＰａ・ｓ以上であれば、組成物が脆くなる恐れがよりなく、１００，０００ｍＰａ・ｓ以下であれば、作業性が悪くなる恐れがよりない。 In this way, the viscosity and hardness can be adjusted according to the application. Further, if the viscosity is 10 mPa·s or more, there is less risk that the composition will become brittle, and if the viscosity is 100,000 mPa·s or less, there is less risk that workability will deteriorate.
このとき、前記（Ａ１）成分と前記（Ａ２）成分の配合量が、前記（Ａ１）及び前記（Ａ２）成分の合計量を１００質量％とした時、前記（Ａ１）成分が５～１００質量％であることが好ましい。 At this time, the blending amount of the (A1) component and the (A2) component is 5 to 100% by mass when the total amount of the (A1) and (A2) components is 100% by mass. % is preferable.
このようにすれば、諸特性が向上し、取り扱い性に優れる。 In this way, various properties are improved and the handleability is excellent.
さらに（Ｅ）成分として下記一般式（４）で示される環状シロキサンを含有し、前記一般式（４）で示される環状シロキサンは、前記（Ａ）成分及び前記（Ｂ）成分の合計質量に対して、０．１～３０質量％であって、
前記硬化性有機ケイ素樹脂組成物中の全アルケニル基１ｍｏｌあたり、前記硬化性有機ケイ素樹脂組成物中の全ヒドロシリル基の量が０．１～４．０ｍｏｌとなる量を含有することが好ましい。
It is preferable to contain an amount such that the total amount of hydrosilyl groups in the curable organosilicon resin composition is 0.1 to 4.0 mol per mol of all alkenyl groups in the curable organosilicon resin composition.
このように、（Ｅ）成分を添加することによって粘度、硬化性及び硬化特性の調整効果を付与することができる。 In this way, by adding component (E), it is possible to impart the effect of adjusting the viscosity, curability, and curing properties.
このとき本発明の組成物は、酸化チタン、酸化亜鉛、酸化ジルコニウム、炭酸カルシウム、酸化マグネシウム、水酸化アルミニウム、炭酸バリウム、ケイ酸マグネシウム、硫酸亜鉛、硫酸バリウムから選ばれる少なくとも１種の無機白色顔料を含むことが好ましい。 At this time, the composition of the present invention contains at least one inorganic white pigment selected from titanium oxide, zinc oxide, zirconium oxide, calcium carbonate, magnesium oxide, aluminum hydroxide, barium carbonate, magnesium silicate, zinc sulfate, and barium sulfate. It is preferable to include.
本発明の硬化性有機ケイ素樹脂組成物は耐候性、透明性に優れるため、上記の化合物を好適に用いることができる。 Since the curable organosilicon resin composition of the present invention has excellent weather resistance and transparency, the above-mentioned compounds can be suitably used.
また、硬化性有機ケイ素樹脂組成物の硬化物及び半導体素子を備える半導体装置を提供する。 Furthermore, a semiconductor device including a cured product of a curable organosilicon resin composition and a semiconductor element is provided.
本発明の硬化性有機ケイ素樹脂組成物であれば、耐硫化性、機械特性、透明性、耐クラック性、耐熱性に優れた硬化物を与えるため、発光半導体装置のレンズ用素材、保護コート剤、モールド剤等に好適であり、特に青色ＬＥＤや白色ＬＥＤ、紫外ＬＥＤ等のＬＥＤ素子封止用として有用なものである。また、本発明の硬化性有機ケイ素樹脂組成物は耐熱性に優れるため、シリケート系蛍光体や量子ドット蛍光体を添加して波長変換フィルム用素材として使用する際にも、高湿下での長期信頼性が確保でき、耐湿性、長期演色性が良好な発光半導体装置を提供することができる。 The curable organosilicon resin composition of the present invention provides a cured product with excellent sulfidation resistance, mechanical properties, transparency, crack resistance, and heat resistance, so it can be used as a material for lenses of light emitting semiconductor devices, and as a protective coating agent. , a molding agent, etc., and is particularly useful for sealing LED elements such as blue LEDs, white LEDs, and ultraviolet LEDs. In addition, since the curable organosilicon resin composition of the present invention has excellent heat resistance, it can be used as a material for wavelength conversion films by adding silicate-based phosphors or quantum dot phosphors, and can be used for long periods under high humidity. It is possible to provide a light-emitting semiconductor device that can ensure reliability and has good moisture resistance and long-term color rendering properties.
このとき、前記硬化物の厚さが１ｍｍで、波長４５０ｎｍにおける前記硬化物の直達光透過率が７０％以上のものであることが好ましい。 At this time, it is preferable that the thickness of the cured product is 1 mm and the direct light transmittance of the cured product at a wavelength of 450 nm is 70% or more.
このような直達光透過率を有する硬化物を与えるものであれば、透明性に優れるため、ＬＥＤの封止材などの光学用途に特に好適に用いることができる。 A cured product having such direct light transmittance has excellent transparency and can be particularly suitably used for optical applications such as a sealing material for LEDs.
このとき、前記半導体素子が発光素子であることが好ましい。 At this time, it is preferable that the semiconductor element is a light emitting element.
本発明は、発光素子に好適に用いることができる。 INDUSTRIAL APPLICATION This invention can be used suitably for a light emitting element.
以上のように、本発明の硬化性有機ケイ素樹脂組成物によれば、シリル化イソシアヌレート化合物を添加剤として含む付加反応硬化型シリコーン組成物（硬化性有機ケイ素樹脂組成物）は、機械特性、透明性、耐クラック性、耐熱性、耐硫化性に優れた硬化物を与えることができる。また、本発明の硬化性有機ケイ素樹脂組成物の硬化物及び半導体素子を備える半導体装置は、発光半導体装置のレンズ用素材、保護コート剤、モールド剤等に好適であり、また高湿下での長期信頼性が確保でき、耐湿性、長期演色性が良好な発光半導体装置を提供することができる。 As described above, according to the curable organosilicon resin composition of the present invention, the addition reaction curable silicone composition (curable organosilicon resin composition) containing a silylated isocyanurate compound as an additive has mechanical properties, It is possible to provide a cured product with excellent transparency, crack resistance, heat resistance, and sulfidation resistance. Further, the cured product of the curable organosilicon resin composition of the present invention and a semiconductor device comprising a semiconductor element are suitable for lens materials, protective coating agents, molding agents, etc. of light-emitting semiconductor devices, and are suitable for use under high humidity conditions. It is possible to provide a light-emitting semiconductor device that can ensure long-term reliability and has good moisture resistance and long-term color rendering properties.
以下、本発明を詳細に説明するが、本発明はこれらに限定されるものではない。
本発明者は、上記課題を解決すべく鋭意検討した結果、
（Ａ）１分子中に少なくとも２個のアルケニル基を有する有機ケイ素化合物、
（Ｂ）１分子中に少なくとも２個のケイ素原子に結合した水素原子を有する有機ケイ素化合物：前記（Ａ）成分のアルケニル基１ｍｏｌに対して、前記（Ｂ）成分のＳｉＨ基が０．１～４．０ｍｏｌとなる量、
（Ｃ）白金族金属系触媒、
（Ｄ）金属腐食防止剤として、下記一般式（１）で示されるシリル化イソシアヌレート化合物
を含む硬化性有機ケイ素樹脂組成物を使用することで、高い反応抑制効果を示し、高温高湿条件下で安定な硬化性オルガノポリシロキサン樹脂組成物が得られることを見出し、本発明を成すに至った。
Hereinafter, the present invention will be explained in detail, but the present invention is not limited thereto.
As a result of intensive study to solve the above problems, the inventor has found that
(A) an organosilicon compound having at least two alkenyl groups in one molecule;
(B) An organosilicon compound having at least two hydrogen atoms bonded to silicon atoms in one molecule: 0.1 to 0.1 to 0.1 to 0.1 to 0.1 to 0.1 to 1 mol of the SiH group of the component (B) per 1 mol of the alkenyl group of the component (A). Amount that becomes 4.0 mol,
(C) platinum group metal catalyst,
(D) A silylated isocyanurate compound represented by the following general formula (1) as a metal corrosion inhibitor
It has been discovered that a curable organopolysiloxane resin composition that exhibits a high reaction suppression effect and is stable under high temperature and high humidity conditions can be obtained by using a curable organosilicon resin composition containing It's arrived.
［（Ａ）アルケニル基含有有機ケイ素化合物］
本発明の（Ａ）成分であるアルケニル基含有有機ケイ素化合物は、１分子中に少なくとも２個、好ましくは２～５個のアルケニル基を有することを特徴とする。上記アルケニル基はヒドロシリル基と付加反応可能であることが好ましい。
[(A) Alkenyl group-containing organosilicon compound]
The alkenyl group-containing organosilicon compound which is component (A) of the present invention is characterized by having at least 2, preferably 2 to 5 alkenyl groups in one molecule. The alkenyl group is preferably capable of an addition reaction with a hydrosilyl group.
上記（Ａ）成分は、後述する（Ａ２）成分である直鎖状オルガノポリシロキサンまたは分岐鎖状オルガノポリシロキサン、及び後述する（Ａ１）成分であるレジン状（網目鎖状）オルガノポリシロキサンのいずれでも良く、それぞれを単独で用いても２種以上を併用しても良いが、（Ａ１）レジン状（網目鎖状）オルガノポリシロキサンを含むことが好ましい。また（Ａ１）成分及び（Ａ２）成分を共に含むことが更に好ましい。以下それぞれについて詳述する。 The above component (A) may be either a linear organopolysiloxane or a branched organopolysiloxane, which is the component (A2) described below, or a resinous (reticulated chain) organopolysiloxane, which is the component (A1), which will be described later. Although each may be used alone or two or more types may be used in combination, it is preferable to include (A1) resin-like (reticulated chain-like) organopolysiloxane. Moreover, it is more preferable to contain both the component (A1) and the component (A2). Each will be explained in detail below.
［（Ａ１）レジン状（網目鎖状）オルガノポリシロキサン］
本発明の（Ａ１）成分は、ＳｉＯ４／２単位もしくはＲ４ＳｉＯ３／２単位の少なくともいずれかを含み（Ｒ４は炭素数１～１０のアルキル基、炭素数２～１０のアルケニル基、または炭素数６～１０のアリール基である。）、１分子中に少なくとも２個のケイ素原子に結合したアルケニル基を有するレジン状（網目鎖状）オルガノポリシロキサンは、重量平均分子量（Ｍｗ）が１，０００～５，０００であることが好ましく、より好ましくは１，１００～３，０００である。分子量（Ｍｗ）が１，０００以上であれば、組成物が脆くなる恐れがなく、分子量（Ｍｗ）が５，０００以下であれば組成物の粘度が高くなり流動しなくなる恐れがない。
[(A1) Resin-like (mesh-chain) organopolysiloxane]
Component (A1) of the present invention contains at least either a SiO 4/2 unit or an R 4 SiO 3/2 unit (R 4 is an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, or an aryl group having 6 to 10 carbon atoms), resin-like (reticulated chain) organopolysiloxanes having at least two alkenyl groups bonded to silicon atoms in one molecule have a weight average molecular weight (Mw) of It is preferably 1,000 to 5,000, more preferably 1,100 to 3,000. If the molecular weight (Mw) is 1,000 or more, there is no risk that the composition will become brittle, and if the molecular weight (Mw) is 5,000 or less, there is no risk that the viscosity of the composition will become high and it will not flow.
炭素数１～１０のアルキル基の例としては、メチル基、エチル基、ｎ－プロピル基、イソプロピル基、ｎ－ブチル基、イソブチル基、ｓ－ブチル基、ｔ－ブチル基、ペンチル基、ヘキシル基、ヘプチル基、オクチル基などが挙げられる。また、炭素数２～１０のアルケニル基の例としては、ビニル基、アリル基、３－ブテニル基、ヘキセニル基、シクロヘキセニル基、オクテニル基などが挙げられる。 Examples of alkyl groups having 1 to 10 carbon atoms include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, s-butyl group, t-butyl group, pentyl group, and hexyl group. , heptyl group, octyl group, etc. Further, examples of the alkenyl group having 2 to 10 carbon atoms include vinyl group, allyl group, 3-butenyl group, hexenyl group, cyclohexenyl group, and octenyl group.
炭素数２～１０、好ましくは２～５のアルケニル基の例としては、ビニル基、アリル基、プロペニル基、イソプロペニル基、ブテニル基、ヘキセニル基、シクロヘキセニル基、オクテニル基等が挙げられビニル基が好ましい。上記アルケニル基は、１分子中に少なくとも２個のケイ素原子に結合しており、２～５個が好ましい。 Examples of the alkenyl group having 2 to 10 carbon atoms, preferably 2 to 5 carbon atoms, include vinyl group, allyl group, propenyl group, isopropenyl group, butenyl group, hexenyl group, cyclohexenyl group, octenyl group, etc. Vinyl group is preferred. The above alkenyl group is bonded to at least two silicon atoms in one molecule, preferably 2 to 5 atoms.
炭素数６～１０、好ましくは６～８のアリール基の例としては、フェニル基、トリル基、キシリル基等のアリール基、ベンジル基、フェニルエチル基、フェニルプロピル基等のアラルキル基などが挙げられ、フェニル基が好ましい。前記アリール基は、１分子中に１個以上有することが好ましく、２～１００個がより好ましい。 Examples of the aryl group having 6 to 10 carbon atoms, preferably 6 to 8 carbon atoms, include aryl groups such as phenyl group, tolyl group, and xylyl group, and aralkyl groups such as benzyl group, phenylethyl group, and phenylpropyl group. , phenyl group is preferred. The aryl group preferably has one or more in one molecule, and more preferably 2 to 100.
なお、本発明における重量平均分子量（Ｍｗ）とは、下記条件で測定したゲルパーミエーションクロマトグラフィ（ＧＰＣ）によるポリスチレンを標準物質とした重量平均分子量を指すこととする。 Note that the weight average molecular weight (Mw) in the present invention refers to the weight average molecular weight measured by gel permeation chromatography (GPC) under the following conditions using polystyrene as a standard substance.
［測定条件］
展開溶媒：テトラヒドロフラン（ＴＨＦ）、
流量：０．６ｍＬ／ｍｉｎ、
検出器：示差屈折率検出器（ＲＩ）、
カラム：ＴＳＫ Ｇｕａｒｄｃｏｌｕｍｎ ＳｕｐｅｒＨ－Ｌ、
ＴＳＫｇｅｌ ＳｕｐｅｒＨ４０００（６．０ｍｍＩ．Ｄ．×１５ｃｍ×１）、
ＴＳＫｇｅｌ ＳｕｐｅｒＨ３０００（６．０ｍｍＩ．Ｄ．×１５ｃｍ×１）、
ＴＳＫｇｅｌ ＳｕｐｅｒＨ２０００（６．０ｍｍＩ．Ｄ．×１５ｃｍ×２）、
（いずれも東ソー社製）
カラム温度：４０℃、
試料注入量：２０μＬ（濃度０．５質量％のＴＨＦ溶液）。
[Measurement condition]
Developing solvent: tetrahydrofuran (THF),
Flow rate: 0.6mL/min,
Detector: differential refractive index detector (RI),
Column: TSK Guardcol u mn SuperHL,
TSKgel SuperH4000 (6.0mm I.D. x 15cm x 1),
TSKgel SuperH3000 (6.0mm I.D. x 15cm x 1),
TSKgel SuperH2000 (6.0mm I.D. x 15cm x 2),
(Both manufactured by Tosoh Corporation)
Column temperature: 40℃,
Sample injection volume: 20 μL (THF solution with a concentration of 0.5% by mass).
さらに（Ａ１）成分に含まれるアルケニル基の量は通常、０．０１～０．５ｍｏｌ／１００ｇであり、好ましくは０．０５～０．３ｍｏｌ／１００ｇ、より好ましくは０．１０～０．２５ｍｏｌ／１００ｇである。
ケイ素原子に結合したアルケニル基の量が０．０１ｍｏｌ／１００ｇ以上であれば、組成物が固まるのに十分な架橋点を有し、０．５ｍｏｌ／１００ｇ以下であれば、架橋密度が上がり過ぎて靱性を失ってしまう恐れがないため好ましい。
Furthermore, the amount of alkenyl groups contained in component (A1) is usually 0.01 to 0.5 mol/100g, preferably 0.05 to 0.3 mol/100g, and more preferably 0.10 to 0.25 mol/100g. It is 100g.
If the amount of alkenyl groups bonded to silicon atoms is 0.01 mol/100 g or more, the composition has sufficient crosslinking points to solidify, and if it is 0.5 mol/100 g or less, the crosslink density is too high. This is preferable because there is no risk of losing toughness.
さらに（Ａ１）成分はケイ素原子に結合した水酸基の量が通常、０．００１～１．０ｍｏｌ／１００ｇであることが好ましく、より好ましくは０．００５～０．８ｍｏｌ／１００ｇ、更に好ましくは０．００８～０．６ｍｏｌ／１００ｇである。
ケイ素原子に結合した水酸基の量が０．００１ｍｏｌ／１００ｇ以上であれば、十分な接着性を確保でき、１．０ｍｏｌ／１００ｇ以下であれば保存安定性の低下や表面タックを起こさないため好ましい。
Furthermore, the amount of hydroxyl groups bonded to silicon atoms in component (A1) is usually preferably 0.001 to 1.0 mol/100 g, more preferably 0.005 to 0.8 mol/100 g, and still more preferably 0.001 to 1.0 mol/100 g. 008 to 0.6 mol/100g.
If the amount of hydroxyl groups bonded to silicon atoms is 0.001 mol/100 g or more, sufficient adhesiveness can be ensured, and if it is 1.0 mol/100 g or less, storage stability will not deteriorate or surface tack will occur, which is preferable.
さらに（Ａ１）成分は通常、炭素数１～１０、好ましくは１～５のケイ素原子に結合したアルコキシ基の量が１．０ｍｏｌ／１００ｇ以下であることが好ましく、より好ましくは０．８ｍｏｌ／１００ｇ以下、更に好ましくは０．５ｍｏｌ／１００ｇ以下である。
アルコキシ基の量が１．０ｍｏｌ／１００ｇ以下であれば、硬化時に副生成物のアルコールガスが発生しづらく、硬化物にボイドが残る恐れもない。
Furthermore, the amount of alkoxy groups bonded to silicon atoms having 1 to 10 carbon atoms, preferably 1 to 5 carbon atoms in component (A1) is preferably 1.0 mol/100 g or less, more preferably 0.8 mol/100 g. The amount is more preferably 0.5 mol/100 g or less.
When the amount of alkoxy groups is 1.0 mol/100 g or less, alcohol gas as a by-product is less likely to be generated during curing, and there is no fear that voids will remain in the cured product.
なお、本発明におけるケイ素原子に結合した水酸基量、アルコキシ基量は１Ｈ－ＮＭＲ及び、２９Ｓｉ－ＮＭＲによって測定された値を指すこととする。 Note that the amounts of hydroxyl groups and alkoxy groups bonded to silicon atoms in the present invention refer to values measured by 1 H-NMR and 29 Si-NMR.
なお、上記ケイ素原子に結合した水酸基及びアルコキシ基は、（Ａ１）成分のレジン状オルガノポリシロキサンを製造する際に、後述する各シロキサン単位（Ｑ単位、Ｔ単位、Ｄ単位、Ｍ単位）を得るための材料が縮合せずに一部残存することに由来するものである。 In addition, the hydroxyl group and the alkoxy group bonded to the silicon atom are used to obtain each siloxane unit (Q unit, T unit, D unit, M unit) described later when producing the resinous organopolysiloxane of component (A1). This is due to the fact that some of the material remains without condensation.
さらに、ＳｉＯ４／２単位、もしくはＲ４ＳｉＯ３／２単位（Ｒ４は炭素数１～１０のアルキル基、炭素数２～１０のアルケニル基、または炭素数６～１０のアリール基である。）の少なくともいずれかを含む（Ａ１）成分は、通常０～６０ｍｏｌ％、好ましくは０～５０ｍｏｌ％のＳｉＯ４／２単位（Ｑ単位）、通常０～９０ｍｏｌ％、好ましくは３０～８０ｍｏｌ％のＲ４ＳｉＯ３／２単位（Ｔ単位）、通常０～５０ｍｏｌ％、好ましくは０～２０ｍｏｌ％の（Ｒ４）２ＳｉＯ２／２単位（Ｄ単位）及び通常０～５０ｍｏｌ％、好ましくは１０～３０ｍｏｌ％の（Ｒ４）３ＳｉＯ１／２単位（Ｍ単位）からなるレジン構造のオルガノポリシロキサンであることが好ましく、またＳｉＯ４／２単位とＲ４ＳｉＯ３／２単位の和が５０ｍｏｌ％以上であることが好ましく、６０～９０ｍｏｌ％であることがより好ましい。 Further, SiO 4/2 units or R 4 SiO 3/2 units (R 4 is an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, or an aryl group having 6 to 10 carbon atoms). Component (A1) containing at least one of the following is usually 0 to 60 mol%, preferably 0 to 50 mol% of SiO 4/2 units (Q units), and usually 0 to 90 mol% of R, preferably 30 to 80 mol%. 4 SiO 3/2 units (T units), usually 0 to 50 mol%, preferably 0 to 20 mol% of (R 4 ) 2 SiO 2/2 units (D units) and usually 0 to 50 mol%, preferably 10 to 30 mol% % (R 4 ) 3 SiO 1/2 units (M units), and the sum of SiO 4/2 units and R 4 SiO 3/2 units is 50 mol % or more. It is preferably 60 to 90 mol%, more preferably 60 to 90 mol%.
上記Ｒ４は独立して炭素数１～１０、好ましくは２～５の置換または非置換の１価アルキル基、炭素数２～１０のアルケニル基、または炭素数６～１０好ましくは６～８のアリール基であり、上記（Ａ１）成分のＲ４ＳｉＯ３／２単位（Ｔ単位）に結合した置換基Ｒ４が、少なくとも１つのフェニル基を有し、（Ｒ４）３ＳｉＯ１／２単位（Ｍ単位）に結合した置換基Ｒ４の少なくとも１つが炭素数２～１０のアルケニル基であることが好ましい。 The above R 4 is independently a substituted or unsubstituted monovalent alkyl group having 1 to 10 carbon atoms, preferably 2 to 5 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, or an alkenyl group having 6 to 10 carbon atoms, preferably 6 to 8 carbon atoms. The substituent R 4 which is an aryl group and is bonded to the R 4 SiO 3/2 unit (T unit) of the component (A1) has at least one phenyl group, and the (R 4 ) 3 SiO 1/2 unit It is preferable that at least one of the substituents R 4 bonded to (M unit) is an alkenyl group having 2 to 10 carbon atoms.
Ｍ単位、Ｄ単位、Ｔ単位中のＲ４は具体的には、メチル基、エチル基、プロピル基、ブチル基等の低級アルキル基；シクロヘキシル基等のシクロアルキル基；フェニル基、トリル基、キシリル基等のアリール基；ベンジル基、フェニルエチル基、フェニルプロピル基等のアラルキル基；ビニル基、アリル基、プロペニル基、イソプロペニル基、ブテニル基、ヘキセニル基、シクロヘキセニル基、オクテニル基等のアルケニル基；及びこれらの基の水素原子の一部又は全部をフッ素、臭素、塩素等のハロゲン原子やシアノ基等で置換した基、例えばクロロメチル基、シアノエチル基、３，３，３－トリフルオロプロピル基等が挙げられる。中でも、メチル基、フェニル基、ビニル基が好ましい。 Specifically, R 4 in the M unit, D unit, and T unit is a lower alkyl group such as a methyl group, an ethyl group, a propyl group, or a butyl group; a cycloalkyl group such as a cyclohexyl group; a phenyl group, a tolyl group, or a xylyl group. Aryl groups such as benzyl groups, phenylethyl groups, phenylpropyl groups; alkenyl groups such as vinyl groups, allyl groups, propenyl groups, isopropenyl groups, butenyl groups, hexenyl groups, cyclohexenyl groups, octenyl groups, etc. ; and groups in which some or all of the hydrogen atoms of these groups are substituted with halogen atoms such as fluorine, bromine, chlorine, or cyano groups, such as chloromethyl group, cyanoethyl group, 3,3,3-trifluoropropyl group etc. Among these, methyl group, phenyl group, and vinyl group are preferred.
ＳｉＯ４／２単位（Ｑ単位）を得るための材料としては、例えば、ケイ酸ソーダ、テトラアルコキシシラン、またはその縮合反応物等を例示できるが、これらに限定されない。 Examples of materials for obtaining SiO 4/2 units (Q units) include, but are not limited to, sodium silicate, tetraalkoxysilane, and condensation products thereof.
Ｒ４ＳｉＯ３／２単位（Ｔ単位）を得るための材料としては、例えば、下記構造式で表されるオルガノトリクロロシラン、オルガノトリアルコキシシラン等の有機ケイ素化合物、又はこれらの縮合反応物等を例示できるが、これらに限定されない。 As the material for obtaining the R 4 SiO 3/2 unit (T unit), for example, an organosilicon compound such as organotrichlorosilane or organotrialkoxysilane represented by the following structural formula, or a condensation reaction product thereof, etc. Examples include, but are not limited to.
（Ｒ４）２ＳｉＯ２／２単位（Ｄ単位）を得るための材料としては、例えば、下記構造式で表されるジオルガノジクロロシラン、ジオルガノジアルコキシシラン等の有機ケイ素化合物等を例示できるが、これらに限定されない。 Examples of the material for obtaining the (R 4 ) 2 SiO 2/2 unit (D unit) include organosilicon compounds such as diorganodichlorosilane and diorganodialkoxysilane represented by the following structural formula. However, it is not limited to these.
（Ｒ４）３ＳｉＯ１／２単位（Ｍ単位）を得るための材料としては、例えば、下記構造式で表されるトリオルガノクロロシラン、トリオルガノアルコキシシラン、ヘキサオルガノジシロキサン等の有機ケイ素化合物等を例示できるが、これらに限定されない。 Examples of materials for obtaining (R 4 ) 3 SiO 1/2 units (M units) include organosilicon compounds such as triorganochlorosilane, triorganoalkoxysilane, and hexaorganodisiloxane represented by the following structural formula. Examples include, but are not limited to.
［（Ａ２）直鎖状または分岐鎖状オルガノポリシロキサン］
（Ａ２）成分である直鎖状または分岐鎖状のオルガノポリシロキサンは、１分子中に２個以上のケイ素原子に結合した炭素数２～１０のアルケニル基を有し、ＪＩＳ Ｋ ７１１７－１：１９９９記載の方法で測定した２５℃での粘度が１０～１００，０００ｍＰａ・ｓである直鎖状または分岐鎖状のオルガノポリシロキサンである。
本発明の硬化性有機ケイ素樹脂組成物に（Ａ２）成分を添加することにより、用途に合わせて粘度及び硬度を調製することができる。
[(A2) Linear or branched organopolysiloxane]
The linear or branched organopolysiloxane that is component (A2) has an alkenyl group having 2 to 10 carbon atoms bonded to two or more silicon atoms in one molecule, and conforms to JIS K 7117-1: It is a linear or branched organopolysiloxane having a viscosity of 10 to 100,000 mPa·s at 25° C. as measured by the method described in 1999.
By adding component (A2) to the curable organosilicon resin composition of the present invention, the viscosity and hardness can be adjusted according to the intended use.
炭素数２～１０、好ましくは２～５のアルケニル基の例としては、ビニル基、アリル基、プロペニル基、イソプロペニル基、ブテニル基、ヘキセニル基、シクロヘキセニル基、オクテニル基等が挙げられビニル基が好ましい。上記アルケニル基は、１分子中に２個以上有することが好ましく、２～５個がより好ましい。 Examples of the alkenyl group having 2 to 10 carbon atoms, preferably 2 to 5 carbon atoms, include vinyl group, allyl group, propenyl group, isopropenyl group, butenyl group, hexenyl group, cyclohexenyl group, octenyl group, etc. Vinyl group is preferred. The alkenyl group preferably has two or more in one molecule, more preferably 2 to 5.
上記オルガノポリシロキサンはＪＩＳ Ｋ ７１１７－１：１９９９記載の方法で測定した２５℃での粘度が１０～１００，０００ｍＰａ・ｓであることが好ましく、より好ましくは１００～５０，０００ｍＰａ・ｓ、さらに好ましくは１，０００～３０，０００ｍＰａ・ｓである。
粘度が１０ｍＰａ・ｓ以上であれば、組成物が脆くなる恐れがなく、１００，０００ｍＰａ・ｓ以下であれば、作業性が悪くなる恐れがない。
The organopolysiloxane preferably has a viscosity of 10 to 100,000 mPa·s, more preferably 100 to 50,000 mPa·s, even more preferably is 1,000 to 30,000 mPa·s.
If the viscosity is 10 mPa·s or more, there is no risk that the composition will become brittle, and if the viscosity is 100,000 mPa·s or less, there is no risk that workability will deteriorate.
上記オルガノポリシロキサンとして具体的には、以下のものを例示できるが、これらだけに限定されるものではない。 Specific examples of the above organopolysiloxane include, but are not limited to, the following.
このとき、（Ａ２）成分の添加量としては、（Ａ１）成分及び（Ａ２）成分の合計量を１００質量％とした時に０～９５質量％が好ましく、５～９０質量％がより好ましい。即ち、（Ａ１）成分が５～１００質量％が好ましく、より好ましくは１０～９５質量％である。このようにすれば、取り扱い性に優れる。 At this time, the amount of component (A2) added is preferably 0 to 95% by mass, more preferably 5 to 90% by mass, when the total amount of components (A1) and (A2) is 100% by mass. That is, the content of component (A1) is preferably 5 to 100% by mass, more preferably 10 to 95% by mass. In this way, it is easy to handle.
［（Ｂ）ヒドロシリル基含有有機ケイ素化合物］
（Ｂ）成分は、１分子中に少なくとも２個、好ましくは２～５個のケイ素原子に結合した水素原子（ヒドロシリル基）を有する有機ケイ素化合物であり、（Ａ）成分含有のアルケニル基１ｍｏｌに対して、（Ｂ）成分のＳｉＨ基が０．１～４．０ｍｏｌ、好ましくは０．５～２．０ｍｏｌ、さらに好ましくは０．７～１．５ｍｏｌとなる量を有する有機ケイ素化合物である。
[(B) Hydrosilyl group-containing organosilicon compound]
Component (B) is an organosilicon compound having at least 2, preferably 2 to 5 silicon-bonded hydrogen atoms (hydrosilyl groups) in one molecule, and 1 mol of alkenyl groups containing component (A) On the other hand, component (B) is an organosilicon compound having an amount of SiH groups of 0.1 to 4.0 mol, preferably 0.5 to 2.0 mol, more preferably 0.7 to 1.5 mol.
上記（Ｂ）成分は、１分子中に少なくとも２個以上のケイ素原子に結合する水素原子を有するオルガノハイドロジェンポリシロキサンである。好ましくは、１個以上のケイ素に結合したアリール基を有するオルガノハイドロジェンポリシロキサンより選択される。また上記（Ｂ）成分は、下記平均組成式（５）で示される。 The component (B) is an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in one molecule. Preferably it is selected from organohydrogenpolysiloxanes having one or more silicon-bonded aryl groups. Further, the above component (B) is represented by the following average compositional formula (5).
Ｒ６としては、例えば、具体的には、メチル基、エチル基、プロピル基、ブチル基、ペンチル基等の飽和脂肪族炭化水素基、シクロペンチル基、シクロヘキシル基等の飽和環式炭化水素基、フェニル基、トリル基、キシリル基等のアリール基、ベンジル基、フェニルエチル基、フェニルプロピル基等のアラルキル基などの芳香族炭化水素基、これらの基の炭素原子に結合する水素原子の一部又は全部をフッ素、臭素、塩素等のハロゲン原子で置換したもの、例えば、トリフルオロプロピル基、クロロプロピル基等のハロゲン化炭化水素基などが挙げられる。これらの中では、炭素数１～５のメチル基、エチル基、プロピル基等の飽和炭化水素基、並びにフェニル基が好ましい。 Examples of R 6 include, for example, saturated aliphatic hydrocarbon groups such as methyl, ethyl, propyl, butyl, and pentyl; saturated cyclic hydrocarbon groups such as cyclopentyl and cyclohexyl; and phenyl. aryl groups such as tolyl group, xylyl group, aromatic hydrocarbon groups such as aralkyl groups such as benzyl group, phenylethyl group, phenylpropyl group, and some or all of the hydrogen atoms bonded to the carbon atoms of these groups. Examples include those substituted with a halogen atom such as fluorine, bromine, or chlorine, such as a halogenated hydrocarbon group such as a trifluoropropyl group or a chloropropyl group. Among these, saturated hydrocarbon groups having 1 to 5 carbon atoms such as methyl, ethyl, and propyl groups, and phenyl groups are preferred.
上記（Ｂ）成分のオルガノハイドロジェンポリシロキサンは、ケイ素原子に結合した水素原子（ヒドロシリル基）を少なくとも２個（通常、２～２００個）、好ましくは３個以上（通常、３～１００個）含有する。（Ｂ）成分は、（Ａ）成分と反応し、架橋剤として作用する。 The organohydrogenpolysiloxane of component (B) has at least 2 (usually 2 to 200), preferably 3 or more (usually 3 to 100) hydrogen atoms bonded to silicon atoms. contains. Component (B) reacts with component (A) and acts as a crosslinking agent.
上記（Ｂ）成分の分子構造は特に制限されず、例えば、線状、環状、分岐状、三次元網目状（レジン状）等の、いずれの分子構造でも（Ｂ）成分として使用することができる。
上記（Ｂ）成分が線状構造を有する場合、ヒドロシリル基は、分子鎖末端および分子鎖側鎖のどちらか一方でのみケイ素原子に結合していても、その両方でケイ素原子に結合していてもよい。また、１分子中のケイ素原子の数（または重合度）が、通常、２～２００個、好ましくは３～１００個程度であり、室温（２５℃）において液状又は固体状であるオルガノハイドロジェンポリシロキサンが使用できる。
The molecular structure of the above component (B) is not particularly limited, and any molecular structure such as linear, cyclic, branched, three-dimensional network (resin-like), etc. can be used as component (B). .
When the above component (B) has a linear structure, the hydrosilyl group may be bonded to the silicon atom only at either the end of the molecular chain or the side chain of the molecular chain, or at both. Good too. Furthermore, the number of silicon atoms (or degree of polymerization) in one molecule is usually about 2 to 200, preferably about 3 to 100, and the organohydrogen polyester is in a liquid or solid state at room temperature (25°C). Siloxane can be used.
上記平均組成式（５）で表されるオルガノハイドロジェンポリシロキサンの具体例としては、トリス（ハイドロジェンジメチルシロキシ）フェニルシラン、両末端トリメチルシロキシ基封鎖メチルハイドロジェンシロキサン・ジフェニルシロキサン共重合体、両末端トリメチルシロキシ基封鎖メチルハイドロジェンシロキサン・ジフェニルシロキサン・ジメチルシロキサン共重合体、両末端トリメチルシロキシ基封鎖メチルハイドロジェンシロキサン・メチルフェニルシロキサン・ジメチルシロキサン共重合体、両末端ジメチルハイドロジェンシロキシ基封鎖メチルハイドロジェンシロキサン・ジメチルシロキサン・ジフェニルシロキサン共重合体、両末端ジメチルハイドロジェンシロキシ基封鎖メチルハイドロジェンシロキサン・ジメチルシロキサン・メチルフェニルシロキサン共重合体、（ＣＨ３）２ＨＳｉＯ１／２単位とＳｉＯ４／２単位と（Ｃ６Ｈ５）３ＳｉＯ１／２単位とからなる共重合体などが挙げられる。
また、下記構造で示されるオルガノハイドロジェンポリシロキサンも用いることができるが、これらだけに限定されるものではない。
Specific examples of the organohydrogenpolysiloxane represented by the above average compositional formula (5) include tris(hydrogendimethylsiloxy)phenylsilane, a methylhydrogensiloxane/diphenylsiloxane copolymer blocked with trimethylsiloxy groups at both ends, Methylhydrogensiloxane/diphenylsiloxane/dimethylsiloxane copolymer with terminal trimethylsiloxy groups blocked, Methylhydrogensiloxane/methylphenylsiloxane/dimethylsiloxane copolymer with both terminals blocked with trimethylsiloxy groups, Methylhydro with both ends blocked with dimethylhydrogensiloxy groups Gensiloxane/dimethylsiloxane/diphenylsiloxane copolymer, methylhydrogensiloxane/dimethylsiloxane/methylphenylsiloxane copolymer endblocked with dimethylhydrogensiloxy groups at both ends, (CH 3 ) 2 HSiO 1/2 unit and SiO 4/2 Examples include copolymers consisting of units and (C 6 H 5 ) 3 SiO 1/2 units.
Furthermore, organohydrogenpolysiloxanes shown by the following structures can also be used, but are not limited to these.
（Ｂ）成分の添加量は、有機ケイ素樹脂組成物中のケイ素原子に結合したアルケニル基１ｍｏｌ当たり、（Ｂ）成分中のヒドロシリル基の量が０．１～４．０ｍｏｌ、好ましくは０．５～３．０ｍｏｌ、より好ましくは０．８～２．０ｍｏｌとなる量である。
（Ｂ）成分の添加量が、（Ｂ）成分中のヒドロシリル基の量が０．１ｍｏｌより少なくなる量であると、本発明の組成物の硬化反応が進行せず、シリコーン硬化物を得ることが困難である。また得られる硬化物も架橋密度が低くなりすぎ、機械強度が不足し、耐熱性が悪影響を受ける。一方、添加量が上記ヒドロシリル基の量が４．０ｍｏｌより多くなる量であると、未反応のヒドロシリル基が硬化物中に多数残存するために、物性の経時変化の発現や硬化物の耐熱性の低下などを引き起こす。更に、硬化物中に脱水素反応による発泡が生じる原因となる。
The amount of component (B) added is 0.1 to 4.0 mol, preferably 0.5 mol of hydrosilyl group in component (B) per mol of alkenyl group bonded to silicon atom in the organosilicon resin composition. The amount is 3.0 mol, more preferably 0.8 to 2.0 mol.
If the amount of component (B) added is such that the amount of hydrosilyl groups in component (B) is less than 0.1 mol, the curing reaction of the composition of the present invention will not proceed and a cured silicone product will not be obtained. is difficult. Moreover, the crosslinking density of the obtained cured product is too low, the mechanical strength is insufficient, and the heat resistance is adversely affected. On the other hand, if the amount added is more than 4.0 mol, a large number of unreacted hydrosilyl groups will remain in the cured product, resulting in changes in physical properties over time and heat resistance of the cured product. This causes a decrease in Furthermore, it causes foaming to occur in the cured product due to dehydrogenation reaction.
［（Ｃ）白金族金属系触媒］
本発明の（Ｃ）成分の白金族金属系触媒は、本発明の組成物の付加硬化反応を生じさせるため配合されるものであり、白金系、パラジウム系、ロジウム系のものがある。白金族金属系触媒としてはヒドロシリル化反応を促進するものとして従来公知であるいずれのものも使用することができる。コスト等を考慮して、白金、白金黒、塩化白金酸などの白金系のもの、例えば、Ｈ２ＰｔＣｌ６・ｐ’Ｈ２Ｏ，Ｋ２ＰｔＣｌ６，ＫＨＰｔＣｌ６・ｐ’Ｈ２Ｏ，Ｋ２ＰｔＣｌ４，Ｋ２ＰｔＣｌ４・ｐ’Ｈ２Ｏ，ＰｔＯ２・ｐ’Ｈ２Ｏ，ＰｔＣｌ４・ｐ’Ｈ２Ｏ，ＰｔＣｌ２，Ｈ２ＰｔＣｌ４・ｐ’Ｈ２Ｏ（ここで、ｐ’は正の整数）等や、これらと、オレフィン等の炭化水素、アルコール又はビニル基含有オルガノポリシロキサンとの錯体等を例示することができる。これらの触媒は１種単独でも、２種以上の組み合わせでも使用することができる。
[(C) Platinum group metal catalyst]
The platinum group metal catalyst as component (C) of the present invention is blended to cause an addition curing reaction of the composition of the present invention, and includes platinum-based, palladium-based, and rhodium-based catalysts. As the platinum group metal catalyst, any conventionally known catalyst that promotes the hydrosilylation reaction can be used. Considering cost etc., platinum-based materials such as platinum, platinum black, and chloroplatinic acid, such as H 2 PtCl 6 .p'H 2 O, K 2 PtCl 6 , KHPtCl 6 .p'H 2 O, K 2 PtCl 4 , K 2 PtCl 4 · p'H 2 O, PtO 2 · p'H 2 O, PtCl 4 · p'H 2 O, PtCl 2 , H 2 PtCl 4 · p'H 2 O (here, p' is a positive integer), and complexes of these with hydrocarbons such as olefins, alcohols, or vinyl group-containing organopolysiloxanes. These catalysts can be used alone or in combination of two or more.
（Ｃ）成分の配合量は、硬化のための有効量でよく、通常、上記（Ａ）成分及び上記（Ｂ）成分の合計量に対して白金族金属として質量換算で０．１～５００ｐｐｍ、特に好ましくは０．５～１００ｐｐｍの範囲である。 The amount of component (C) may be an effective amount for curing, and is usually 0.1 to 500 ppm in terms of mass as platinum group metal based on the total amount of component (A) and component (B). Particularly preferred is a range of 0.5 to 100 ppm.
［（Ｄ）金属腐食防止剤］
本発明の（Ｄ）成分の金属腐食防止剤は、下記一般式（１）で示されるシリル化イソシアヌレート化合物である。
[(D) Metal corrosion inhibitor]
The metal corrosion inhibitor as component (D) of the present invention is a silylated isocyanurate compound represented by the following general formula (1).
ここで上記Ｒにおける炭素数１～１０のアルキル基の例としては、メチル基、エチル基、ｎ－プロピル基、イソプロピル基、ｎ－ブチル基、イソブチル基、ｓ－ブチル基、ｔ－ブチル基、ペンチル基、ヘキシル基、ヘプチル基、オクチル基などが挙げられる。また、炭素数２～１０のアルケニル基の例としては、ビニル基、アリル基、３－ブテニル基、ヘキセニル基、シクロヘキセニル基、オクテニル基などが挙げられる。
Ｒとしては、上記一般式（１）中の少なくとも１つが上記一般式（２－ｂ）であることを特徴とし、残りのＲが、水素原子、メチル基、アリル基、上記一般式（２－ａ）または上記一般式（２－ｂ）である。より好ましくは、残りのＲが上記一般式（２－ａ）または上記一般式（２－ｂ）である。
Here, examples of the alkyl group having 1 to 10 carbon atoms in R include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, s-butyl group, t-butyl group, Examples include pentyl group, hexyl group, heptyl group, and octyl group. Further, examples of the alkenyl group having 2 to 10 carbon atoms include vinyl group, allyl group, 3-butenyl group, hexenyl group, cyclohexenyl group, and octenyl group.
R is characterized in that at least one of the above general formulas (1) is the above general formula (2-b), and the remaining R is a hydrogen atom, a methyl group, an allyl group, or the above general formula (2-b). a) or the above general formula (2-b). More preferably, the remaining R is the above general formula (2-a) or the above general formula (2-b).
上記一般式（２－ａ）及び（２－ｂ）中のＲ１は、それぞれ水素原子または炭素数１～８のアルキル基である。具体的には、メチル基、エチル基、プロピル基、ブチル基等の低級アルキル基；シクロヘキシル基等のシクロアルキル基等が挙げられる。中でも、水素原子、またはメチル基が好ましい。 R 1 in the above general formulas (2-a) and (2-b) is a hydrogen atom or an alkyl group having 1 to 8 carbon atoms, respectively. Specifically, lower alkyl groups such as methyl group, ethyl group, propyl group, butyl group; cycloalkyl groups such as cyclohexyl group, etc. can be mentioned. Among these, a hydrogen atom or a methyl group is preferred.
また、上記一般式（２－ａ）および（２－ｂ）中のＲ２は、互いに独立に、水素原子、炭素数１～１０のアルキル基、および上記一般式（３）で示される基のいずれかから選ばれる基である。また、Ｒ２における炭素数１～１０のアルキル基の例としては、上記Ｒで例示したものと同じものを挙げることができる。Ｒ２としては、上記一般式（２－ｂ）中の少なくとも１つが、上記式（３）で示される基であることを特徴とし、残りのＲ２が水素原子、メチル基、または上記式（３）で示される基が好ましい。 In addition, R 2 in the above general formulas (2-a) and (2-b) each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, and a group represented by the above general formula (3). It is a group selected from either. Furthermore, examples of the alkyl group having 1 to 10 carbon atoms in R 2 include the same ones as exemplified for R above. R 2 is characterized in that at least one of the above general formulas (2-b) is a group represented by the above formula (3), and the remaining R 2 is a hydrogen atom, a methyl group, or a group represented by the above formula ( Groups represented by 3) are preferred.
上記一般式（３）中、Ｒ３は互いに独立に、水素原子、炭素数１～１０のアルキル基、炭素数１～１０のアルコキシ基、炭素数２～１０のアルケニル基、または炭素数６～１０のアリール基のいずれかから選ばれる置換基を示す。 In the above general formula (3), R 3 is independently a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, or an alkenyl group having 6 to 10 carbon atoms. A substituent selected from any of the 10 aryl groups is shown.
ここで炭素数１～１０のアルキル基の例としては、上記Ｒで例示したものと同じものを挙げることができる。また、炭素数１～１０のアルコキシ基の例としては、メトキシ基、エトキシ基、ｎ－プロポキシ基、イソプロポキシ基、ｎ－ブトキシ基、イソブトキシ基、ｓ－ブトキシ基、ｔ－ブトキシ基、ペントキシ基、ヘキソキシ基、ヘプトキシ基、オクトキシ基などが挙げられる。また、炭素数２～１０のアルケニル基の例としては、ビニル基、アリル基、プロペニル基、イソプロペニル基、ブテニル基、ヘキセニル基、シクロヘキセニル基、オクテニル基等が挙げられる。さらに、炭素数６～１０のアリール基の例としては、フェニル基、トリル基、キシリル基等のアリール基やベンジル基、フェニルエチル基、フェニルプロピル基等のアラルキル基などが挙げられる。これらの中でもメチル基、フェニル基、ビニル基が好ましい。 Examples of the alkyl group having 1 to 10 carbon atoms include those exemplified for R above. Examples of alkoxy groups having 1 to 10 carbon atoms include methoxy group, ethoxy group, n-propoxy group, isopropoxy group, n-butoxy group, isobutoxy group, s-butoxy group, t-butoxy group, and pentoxy group. , hexoxy group, heptoxy group, octoxy group, etc. Examples of alkenyl groups having 2 to 10 carbon atoms include vinyl, allyl, propenyl, isopropenyl, butenyl, hexenyl, cyclohexenyl, octenyl, and the like. Furthermore, examples of aryl groups having 6 to 10 carbon atoms include aryl groups such as phenyl, tolyl and xylyl groups, and aralkyl groups such as benzyl, phenylethyl and phenylpropyl groups. Among these, methyl group, phenyl group, and vinyl group are preferred.
上記一般式（２－ａ）および（２－ｂ）においてｑはそれぞれ１～１０の整数であり、好ましくは１～８の整数であり、より好ましくは１～５の整数である。 In the above general formulas (2-a) and (2-b), q is each an integer of 1 to 10, preferably an integer of 1 to 8, more preferably an integer of 1 to 5.
上記一般式（１）で表されるシリル化イソシアヌレート化合物としては、例えば、下記式で表される化合物があげられる。 Examples of the silylated isocyanurate compound represented by the above general formula (1) include compounds represented by the following formula.
［シリル化変性イソシアヌレート化合物の製造方法］
本発明のシリル化変性イソシアヌレート化合物は、例えば、トリグリシジルイソシアヌレートとクロロシランおよびアルコキシシランとを加水分解反応させることにより製造することができる。加水分解反応の条件は、適宜調整されればよい。例えば、エポキシ基とトリメチルクロロシランとの反応比はｍｏｌ比で１：１である。
[Method for producing silylated modified isocyanurate compound]
The silylated modified isocyanurate compound of the present invention can be produced, for example, by subjecting triglycidyl isocyanurate to a hydrolysis reaction with chlorosilane and alkoxysilane. The conditions for the hydrolysis reaction may be adjusted as appropriate. For example, the reaction ratio of epoxy groups and trimethylchlorosilane is 1:1 in molar ratio.
上記シリル化イソシアヌレート化合物は、金属の腐食防止剤として優れた効果を発揮することができる。該シリル化イソシアヌレート化合物を腐食防止剤として使用する際には、樹脂組成物に対して０．００１～５質量％、好ましくは０．０１～３質量％となる量で添加すればよい。 The above-mentioned silylated isocyanurate compound can exhibit excellent effects as a corrosion inhibitor for metals. When the silylated isocyanurate compound is used as a corrosion inhibitor, it may be added in an amount of 0.001 to 5% by mass, preferably 0.01 to 3% by mass, based on the resin composition.
本発明の硬化性有機ケイ素樹脂組成物は上記（Ａ）～（Ｄ）成分に加えて、下記（Ｅ）、（Ｆ）成分を加えることができる。 In addition to the above-mentioned components (A) to (D), the following components (E) and (F) can be added to the curable organosilicon resin composition of the present invention.
［（Ｅ）環状ポリシロキサン］
（Ｅ）成分は、下記一般式（４）で示される環状ポリシロキサンである。この環状ポリシロキサンは、本発明の組成物に添加することによって粘度、硬化性及び硬化特性の調整効果を付与するものである。
[(E) Cyclic polysiloxane]
Component (E) is a cyclic polysiloxane represented by the following general formula (4). When added to the composition of the present invention, this cyclic polysiloxane imparts the effect of adjusting viscosity, curability, and curing properties.
上記Ｒ５の炭素数１～１０、好ましくは１～５のアルキル基の例としては、メチル基、エチル基、プロピル基、ブチル基、ペンチル基などが挙げられ、炭素数２～１０、好ましくは２～１０のアルケニル基の例としては、ビニル基、アリル基、プロペニル基、イソプロペニル基、ブテニル基、ヘキセニル基、シクロヘキセニル基、オクテニル基等が挙げられ、炭素数６～１０、好ましくは６～８の芳香族炭化水素基の例としては、フェニル基、トリル基、キシリル基等のアリール基、ベンジル基、フェニルエチル基、フェニルプロピル基等のアラルキル基などが挙げられる。Ｒ５としては、中でも水素原子、ビニル基、メチル基、フェニル基が好ましいが、水素原子とビニル基は１分子中に同時に存在しない。 Examples of the alkyl group having 1 to 10 carbon atoms, preferably 1 to 5 carbon atoms, for R 5 above include methyl group, ethyl group, propyl group, butyl group, pentyl group, etc., and preferably having 2 to 10 carbon atoms. Examples of the alkenyl group having 2 to 10 carbon atoms include vinyl group, allyl group, propenyl group, isopropenyl group, butenyl group, hexenyl group, cyclohexenyl group, octenyl group, etc., and has 6 to 10 carbon atoms, preferably 6 carbon atoms. Examples of aromatic hydrocarbon groups of ~8 include aryl groups such as phenyl, tolyl and xylyl groups, and aralkyl groups such as benzyl, phenylethyl and phenylpropyl groups. Among R 5 , a hydrogen atom, a vinyl group, a methyl group, and a phenyl group are preferable, but a hydrogen atom and a vinyl group do not exist simultaneously in one molecule.
環状ポリシロキサンの添加量としては、上記（Ａ）成分及び上記（Ｂ）成分の合計質量に対し、０．１～３０質量％であることが好ましく、０．２～２０質量％であることがより好ましい。さらに、上記（Ｅ）成分が、アルケニル基及び／またはケイ素原子に直結する水素原子を有する場合は、本発明の組成物中の全アルケニル基１ｍｏｌあたり、上記組成物中の全ヒドロシリル基の量が０．１～４．０ｍｏｌ、好ましくは０．５～２．０ｍｏｌとなる量であることを同時に満たすのが好ましい。 The amount of cyclic polysiloxane added is preferably 0.1 to 30% by mass, and preferably 0.2 to 20% by mass, based on the total mass of component (A) and component (B). More preferred. Furthermore, when the above component (E) has an alkenyl group and/or a hydrogen atom directly bonded to a silicon atom, the amount of all hydrosilyl groups in the composition per 1 mol of all alkenyl groups in the composition of the present invention is It is preferable to simultaneously satisfy the following conditions: 0.1 to 4.0 mol, preferably 0.5 to 2.0 mol.
上記一般式（４）で表される環状オルガノポリシロキサンの具体例としては、下記構造で示される環状ポリシロキサンを用いることができるが、これらだけに限定されるものではない。 As specific examples of the cyclic organopolysiloxane represented by the above general formula (4), cyclic polysiloxanes shown by the following structures can be used, but are not limited to these.
［（Ｆ）蛍光体、白色顔料］
また、本発明の硬化性有機ケイ素樹脂組成物には、更に（Ｆ）蛍光体、白色顔料を配合してもよい。本発明の硬化性有機ケイ素樹脂組成物は耐候性に優れるため、蛍光体を含有する場合であっても、従来のような蛍光特性の著しい低下が起こる恐れがない。
蛍光体、白色顔料の添加量としては、（Ａ）成分と（Ｂ）成分の合計１００質量部に対し、０～５００質量部が好ましく、０～３００質量部がより好ましい。
[(F) Phosphor, white pigment]
Furthermore, the curable organosilicon resin composition of the present invention may further contain (F) a phosphor and a white pigment. Since the curable organosilicon resin composition of the present invention has excellent weather resistance, even when it contains a phosphor, there is no risk of significant deterioration in fluorescence properties as in the case of conventional compositions.
The amount of the phosphor and white pigment added is preferably 0 to 500 parts by weight, more preferably 0 to 300 parts by weight, based on the total of 100 parts by weight of components (A) and (B).
このとき、白色顔料としては、酸化チタン、酸化亜鉛、酸化ジルコニウム、炭酸カルシウム、酸化マグネシウム、水酸化アルミニウム、炭酸バリウム、ケイ酸マグネシウム、硫酸亜鉛、硫酸バリウムから選ばれる少なくとも１種の無機白色顔料を含むことが好ましい。これらを、上記の（Ａ）～（Ｄ）成分の合計１００質量部当たり６００質量部以下（例えば０～６００質量部、通常、１～６００質量部、好ましくは１０～４００質量部）の量で適宜配合することができる。 At this time, as the white pigment, at least one inorganic white pigment selected from titanium oxide, zinc oxide, zirconium oxide, calcium carbonate, magnesium oxide, aluminum hydroxide, barium carbonate, magnesium silicate, zinc sulfate, and barium sulfate is used. It is preferable to include. These are added in an amount of 600 parts by mass or less (for example, 0 to 600 parts by mass, usually 1 to 600 parts by mass, preferably 10 to 400 parts by mass) per 100 parts by mass of the above components (A) to (D). They can be blended as appropriate.
［（Ｇ）その他］
その他の添加剤としては、例えば、シリカ、グラスファイバー、ヒュームドシリカ等の補強性無機充填材、炭酸カルシウム、ケイ酸カルシウム、二酸化チタン、酸化第二鉄、カーボンブラック、セリウム脂肪酸塩、バリウム脂肪酸塩、セリウムアルコキシド、バリウムアルコキシド等の非補強性無機充填材、二酸化ケイ素（シリカ：ＳｉＯ２）、酸化アルミニウム（アルミナ：Ａｌ２Ｏ３）、酸化鉄（ＦｅＯ２）、四酸化三鉄（Ｆｅ３Ｏ４）、酸化鉛（ＰｂＯ２）、酸化すず（ＳｎＯ２）、酸化セリウム（Ｃｅ２Ｏ３、ＣｅＯ２）、酸化カルシウム（ＣａＯ）、四酸化三マンガン（Ｍｎ３Ｏ４）、酸化バリウム（ＢａＯ）などのナノフィラーが挙げられ、これらを、上記の（Ａ）～（Ｄ）成分の合計１００質量部当たり６００質量部以下（例えば０～６００質量部、通常、１～６００質量部、好ましくは１０～４００質量部）の量で適宜配合することができる。
[(G) Others]
Examples of other additives include reinforcing inorganic fillers such as silica, glass fiber, and fumed silica, calcium carbonate, calcium silicate, titanium dioxide, ferric oxide, carbon black, cerium fatty acid salts, and barium fatty acid salts. , non-reinforcing inorganic fillers such as cerium alkoxide, barium alkoxide, silicon dioxide (SiO 2 ), aluminum oxide (alumina: Al 2 O 3 ), iron oxide (FeO 2 ), triiron tetroxide (Fe 3 O 4 ), lead oxide (PbO 2 ), tin oxide (SnO 2 ), cerium oxide (Ce 2 O 3 , CeO 2 ), calcium oxide (CaO), trimanganese tetroxide (Mn 3 O 4 ), barium oxide (BaO ) and the like, and these are added to 600 parts by mass or less (for example 0 to 600 parts by mass, usually 1 to 600 parts by mass, preferably 1 to 600 parts by mass, preferably 10 to 400 parts by mass).
本発明の硬化性有機ケイ素樹脂組成物は、用途に応じて所定の基材に塗布した後、硬化させることができる。硬化条件は、常温（２５℃）でも十分に硬化するが、必要に応じて加熱して硬化してもよい。加熱する場合の温度は、例えば、６０～２００℃とすることができる。 The curable organosilicon resin composition of the present invention can be applied to a predetermined base material and then cured depending on the intended use. Although the curing conditions are sufficient at room temperature (25° C.), it may be cured by heating if necessary. The temperature when heating can be, for example, 60 to 200°C.
また、本発明の硬化性有機ケイ素樹脂組成物は、厚さ１ｍｍで加熱硬化、即ち硬化物の厚さが１ｍｍで、ＪＩＳ Ｋ ７３６１－１によって測定した波長４００～８００ｎｍ、特には波長４５０ｎｍにおける光透過率が７０％以上、好ましくは８０％以上の硬化物を与えるものであることが好ましい。なお、光透過率の測定には、例えば日立製分光光度計Ｕ－４１００を用いることができる。 Further, the curable organosilicon resin composition of the present invention is heat-cured to a thickness of 1 mm, that is, the cured product has a thickness of 1 mm, and is resistant to light at a wavelength of 400 to 800 nm, particularly at a wavelength of 450 nm, as measured according to JIS K 7361-1. It is preferable that the cured product has a transmittance of 70% or more, preferably 80% or more. Note that, for example, a spectrophotometer U-4100 manufactured by Hitachi may be used to measure the light transmittance.
また、本発明の硬化性有機ケイ素樹脂組成物を加熱硬化して、ＪＩＳ Ｋ ７１４２：２０１４ Ａ法によって測定した５８９ｎｍにおける２３℃での屈折率が１．４３～１．５７の範囲にあるような硬化物を与えるものであることが好ましい。 Further, the curable organosilicon resin composition of the present invention can be heat-cured to produce a material whose refractive index at 23° C. at 589 nm measured by JIS K 7142:2014 A method is in the range of 1.43 to 1.57. It is preferable that it gives a cured product.
このような直達光透過率や屈折率を有する硬化物を与えるものであれば、透明性に優れるため、ＬＥＤの封止材などの光学用途に特に好適に用いることができる。 A cured product having such direct light transmittance and refractive index has excellent transparency and can be particularly suitably used for optical applications such as LED sealants.
このような本発明の硬化性有機ケイ素樹脂組成物であれば、機械特性、透明性、耐クラック性、耐熱性、耐硫化性に優れた硬化物を与えるものとなる。 The curable organosilicon resin composition of the present invention provides a cured product with excellent mechanical properties, transparency, crack resistance, heat resistance, and sulfidation resistance.
＜半導体装置＞
また、本発明では、上述の本発明の硬化性有機ケイ素樹脂組成物の硬化物で半導体素子が封止された半導体装置を提供する。
<Semiconductor device>
The present invention also provides a semiconductor device in which a semiconductor element is sealed with a cured product of the curable organosilicon resin composition of the present invention described above.
上述のように、本発明の硬化性有機ケイ素樹脂組成物は、透明性や耐熱性に優れた硬化物を与えるため、発光半導体装置のレンズ用素材、保護コート剤、モールド剤等に好適であり、特に青色ＬＥＤや白色ＬＥＤ、紫外ＬＥＤ等のＬＥＤ素子封止用として有用なものである。また、本発明の硬化性有機ケイ素樹脂組成物は耐熱性に優れるため、シリケート系蛍光体や量子ドット蛍光体を添加して波長変換フィルム用素材として使用する際にも、高湿下での長期信頼性が確保でき、耐湿性、長期演色性が良好な発光半導体装置を提供することができる。以上のように、上記半導体素子を発光素子とすることが好ましい。 As mentioned above, the curable organosilicon resin composition of the present invention provides a cured product with excellent transparency and heat resistance, so it is suitable for lens materials, protective coating agents, molding agents, etc. of light-emitting semiconductor devices. It is particularly useful for sealing LED elements such as blue LEDs, white LEDs, and ultraviolet LEDs. In addition, since the curable organosilicon resin composition of the present invention has excellent heat resistance, it can be used as a material for wavelength conversion films by adding silicate-based phosphors or quantum dot phosphors, and can be used for long periods under high humidity. It is possible to provide a light-emitting semiconductor device that can ensure reliability and has good moisture resistance and long-term color rendering properties. As described above, it is preferable that the semiconductor element is a light emitting element.
本発明の硬化性有機ケイ素樹脂組成物でＬＥＤ等の発光半導体素子を封止する場合は、例えば熱可塑性樹脂からなるプレモールドパッケージに搭載されたＬＥＤ素子上に本発明の硬化性有機ケイ素樹脂組成物を塗布し、ＬＥＤ素子上で組成物を硬化させることにより、ＬＥＤ素子を硬化性有機ケイ素樹脂組成物の硬化物で封止することができる。また、組成物をトルエンやキシレン、ＰＧＭＥＡ等の有機溶媒に溶解させて調製したワニスの状態で、ＬＥＤ素子上に塗布することができる。 When sealing a light emitting semiconductor element such as an LED with the curable organosilicon resin composition of the present invention, for example, the curable organosilicon resin composition of the present invention is placed on the LED element mounted on a pre-molded package made of a thermoplastic resin. The LED element can be sealed with the cured product of the curable organosilicon resin composition by applying a compound and curing the composition on the LED element. Further, the composition can be applied onto the LED element in the form of a varnish prepared by dissolving the composition in an organic solvent such as toluene, xylene, or PGMEA.
本発明の硬化性有機ケイ素樹脂組成物は、その優れた耐熱性、耐硫化性、耐紫外線性、透明性、耐クラック性、長期信頼性等の特性から、ディスプレイ材料、光記録媒体材料、光学機器材料、光部品材料、光ファイバー材料、光・電子機能有機材料、半導体集積回路周辺材料等の光学用途に最適な素材である。 The curable organosilicon resin composition of the present invention has excellent properties such as heat resistance, sulfidation resistance, ultraviolet resistance, transparency, crack resistance, and long-term reliability. It is an ideal material for optical applications such as equipment materials, optical component materials, optical fiber materials, optical and electronic functional organic materials, and peripheral materials for semiconductor integrated circuits.
以下、実施例、及び比較例を示し、本発明を具体的に説明するが、本発明はこれらに制限されるものではない。なお、部は質量部を示し、Ｍｅはメチル基、Ｖｉはビニル基、Ｐｈはフェニル基を示す。 EXAMPLES Hereinafter, the present invention will be specifically explained with reference to Examples and Comparative Examples, but the present invention is not limited thereto. In addition, parts represent parts by mass, Me represents a methyl group, Vi represents a vinyl group, and Ph represents a phenyl group.
実施例１～３及び比較例１～４として、後に詳述する組成物を調整した。調整した組成物、及びその硬化物の物性を下記の方法で測定した。その結果を表２に示す。 Compositions described in detail later were prepared as Examples 1 to 3 and Comparative Examples 1 to 4. The physical properties of the prepared composition and its cured product were measured by the following methods. The results are shown in Table 2.
［物性評価］
（１）性状
硬化前の各組成物の流動性を確認した。１００ｍｌのガラス瓶に５０ｇの組成物を加え、ガラスビンを横に倒して２５℃で１０分間静置した。その間に樹脂が流れ出せば液状であると判断した。
[Evaluation of the physical properties]
(1) Properties The fluidity of each composition before curing was confirmed. 50 g of the composition was added to a 100 ml glass bottle, and the glass bottle was turned sideways and allowed to stand at 25° C. for 10 minutes. If the resin flowed out during that time, it was determined that it was in a liquid state.
（２）粘度
２５℃における硬化前の各組成物の粘度をＪＩＳ Ｋ ７１１７－１：１９９９記載の方法で測定した。
(2) Viscosity The viscosity of each composition before curing at 25°C was measured by the method described in JIS K 7117-1:1999.
（３）屈折率
硬化前の各組成物の屈折率はＡＴＡＧＯ製デジタル屈折計ＲＸ－９０００αを用いて波長５８９ｎｍの光の屈折率を２５℃で測定した。
(3) Refractive index The refractive index of each composition before curing was determined by measuring the refractive index of light at a wavelength of 589 nm at 25° C. using a digital refractometer RX-9000α manufactured by ATAGO.
（４）硬さ（タイプＤ）
各組成物を１５０℃×４時間で硬化して得られた硬化物の硬さを、ＪＩＳ Ｋ ６２４９：２００３に準拠して、デュロメータ タイプＤ硬度計を用いて測定した。
(4) Hardness (type D)
The hardness of the cured product obtained by curing each composition at 150° C. for 4 hours was measured using a durometer type D hardness meter in accordance with JIS K 6249:2003.
（５）切断時伸び及び引張強さ
各組成物を１５０℃×４時間で硬化して得られた硬化物の切断時伸び及び引張強さを、ＪＩＳ Ｋ ６２４９：２００３に準拠して測定した。
(5) Elongation at break and tensile strength The elongation at break and tensile strength of the cured products obtained by curing each composition at 150° C. for 4 hours were measured in accordance with JIS K 6249:2003.
（６）耐熱性
各シリコーン樹脂組成物を、１５０℃で４時間加熱成型して硬化物（１０ｍｍ×１５ｍｍ×１ｍｍｔ）を得た。これら硬化物の耐熱性試験を２００℃の条件下で１００時間行った。耐熱性試験後の硬化物の外観と４５０ｎｍでの光透過率の値について、初期（試験前）の外観及び光透過率と比較し、耐熱性を評価した。
耐熱性試験には、株式会社平山製作所製の不飽和型高加速寿命試験装置（装置名：ＨＡＳＴＥＳＴ ＰＣ－２４２ＨＳＲ２）を用いた。
また、光透過率は、株式会社日立ハイテクノロジーズ製の分光光度計（装置名：Ｕ－４１００）を用いて測定した。
(6) Heat resistance Each silicone resin composition was heat-molded at 150° C. for 4 hours to obtain a cured product (10 mm x 15 mm x 1 mm). A heat resistance test of these cured products was conducted at 200° C. for 100 hours. The appearance and light transmittance of the cured product after the heat resistance test were compared with the initial appearance and light transmittance (before the test) to evaluate heat resistance.
For the heat resistance test, an unsaturated highly accelerated life test device (device name: HASTEST PC-242HSR2) manufactured by Hirayama Seisakusho Co., Ltd. was used.
Further, the light transmittance was measured using a spectrophotometer (device name: U-4100) manufactured by Hitachi High-Technologies Corporation.
（７）耐硫化性
１ｃｍ２の銀メッキ板を実施例１～３及び比較例１～４で調製した有機ケイ素樹脂組成物を用いて厚さ０．６ｍｍで封止し、１５０℃で４時間硬化させて得たサンプルを、硫黄粉末３ｇと共に密封容器に入れ８０℃の恒温槽に５０時間放置したのち、エス・デイ・ジー（株）製Ｘ－ｒｉｔｅ８２００を使用して銀メッキ板の４５０ｎｍでの初期光反射率を測定した。初期の反射率はいずれも９０％であった。下記式によって耐硫化性を計算し、以下の基準に従い判定した。
耐硫化性（％）＝（（硫化試験後の反射率［％］）／（初期反射率［％］））×１００
（判定基準）
○：耐硫化性が９０％以上、
△：耐硫化性が８５％以上９０％未満、
×：耐硫化性が８５％未満。
(7) Sulfidation resistance A 1 cm 2 silver plated plate was sealed with a thickness of 0.6 mm using the organosilicon resin composition prepared in Examples 1 to 3 and Comparative Examples 1 to 4, and heated at 150°C for 4 hours. The cured sample was placed in a sealed container with 3 g of sulfur powder and left in a constant temperature bath at 80°C for 50 hours. The initial light reflectance was measured. The initial reflectance was 90% in all cases. Sulfidation resistance was calculated using the following formula and judged according to the following criteria.
Sulfurization resistance (%) = ((Reflectance after sulfurization test [%]) / (Initial reflectance [%])) × 100
(Judgment criteria)
○: Sulfurization resistance is 90% or more,
△: Sulfurization resistance is 85% or more and less than 90%,
×: Sulfurization resistance is less than 85%.
（実施例１）
（Ａ１）成分として、ＰｈＳｉＯ３／２単位７５ｍｏｌ％、ＶｉＰｈＭｅＳｉＯ１／２単位２５ｍｏｌ％からなる分岐鎖状のフェニルメチルポリシロキサン（Ｍｗ＝２，５００、ケイ素原子に結合した水酸基量０．０４ｍｏｌ／１００ｇ、ケイ素原子に結合したアルコキシ基量０．０６ｍｏｌ／１００ｇ）を３０部、
（Ｂ）成分として、（Ａ）及び（Ｄ）成分中のケイ素原子結合ビニル基の合計個数に対する（Ｂ）成分中のケイ素原子結合水素原子の合計個数の比（以下、ＳｉＨ／ＳｉＶｉ比と表す場合がある。）が１．０となる量の、下記式（６）で示されるオルガノハイドロジェンポリシロキサン、
（Ｃ）成分として塩化白金酸のオクチルアルコール変性溶液（白金元素含有率：１質量％）０．０１部、
（Ｄ）成分として下記式（７）を０．０５部加え、よく撹拌して、硬化性有機ケイ素樹脂組成物を調製した。表１に以上を示す。
(Example 1)
Component (A1) is a branched phenylmethylpolysiloxane (Mw=2,500, amount of hydroxyl groups bonded to silicon atoms 0.04 mol/100 g) consisting of 75 mol% of PhSiO 3/2 units and 25 mol% of ViPhMeSiO 1/2 units. , 30 parts of alkoxy groups bonded to silicon atoms (0.06 mol/100 g),
As component (B), the ratio of the total number of silicon-bonded hydrogen atoms in component (B) to the total number of silicon-bonded vinyl groups in components (A) and (D) (hereinafter referred to as SiH/SiVi ratio) organohydrogenpolysiloxane represented by the following formula (6) in an amount such that 1.0 (in some cases) is 1.0,
0.01 part of an octyl alcohol modified solution of chloroplatinic acid (platinum element content: 1% by mass) as component (C),
0.05 part of the following formula (7) was added as component (D) and thoroughly stirred to prepare a curable organosilicon resin composition. Table 1 shows the above.
（実施例２）
（Ａ１）成分として、実施例１で用いたオルガノポリシロキサンを３０部、
（Ｂ）成分として、上記式（６）で示されるオルガノハイドロジェンポリシロキサン；（Ａ）及び（Ｄ）成分中のケイ素原子結合ビニル基の合計個数に対する（Ｂ）成分中のケイ素原子結合水素原子の合計個数の比（以下、ＳｉＨ／ＳｉＶｉ比と表す場合がある。）が１．０となる量、
（Ｃ）成分として塩化白金酸のオクチルアルコール変性溶液（白金元素含有率：１質量％）０．０１部、
（Ｄ）成分として、下記式（８）を０．０１部、
ならびに、（Ｅ）成分として、下記式（９）で示される有機ケイ素化合物２部を加え、よく撹拌して、シリコーンゴム組成物を調製した。表１に以上を併せて示す。
(Example 2)
As component (A1), 30 parts of the organopolysiloxane used in Example 1,
Organohydrogenpolysiloxane represented by the above formula (6) as component (B); silicon-bonded hydrogen atoms in component (B) relative to the total number of silicon-bonded vinyl groups in components (A) and (D); The amount such that the ratio of the total number of (hereinafter sometimes referred to as SiH/SiVi ratio) is 1.0,
0.01 part of an octyl alcohol modified solution of chloroplatinic acid (platinum element content: 1% by mass) as component (C),
As component (D), 0.01 part of the following formula (8),
Further, as component (E), 2 parts of an organosilicon compound represented by the following formula (9) were added and thoroughly stirred to prepare a silicone rubber composition. Table 1 also shows the above.
（実施例３）
（Ａ１）成分として、ＳｉＯ４／２単位５５ｍｏｌ％、ＶｉＭｅＳｉＯ２／２単位７ｍｏｌ％、Ｍｅ３ＳｉＯ１／２単位３８ｍｏｌ％からなる分岐鎖状のメチルポリシロキサン（Ｍｗ＝５，６００、ケイ素原子に結合した水酸基量、０．２ｍｏｌ／１００ｇ、ケイ素原子に結合したアルコキシ基量０．０２ｍｏｌ／１００ｇ）３０部、
（Ａ２）成分として、下記式（１０）を５０部、
（Ｂ）成分として、（Ａ）及び（Ｄ）成分中のケイ素原子結合ビニル基の合計個数に対する（Ｂ）成分中のケイ素原子結合水素原子の合計個数の比（以下、ＳｉＨ／ＳｉＶｉ比と表す場合がある。）が１．０となる量の、下記式（１１）で示されるオルガノハイドロジェンポリシロキサン、
（Ｃ）成分として塩化白金酸のオクチルアルコール変性溶液（白金元素含有率：１質量％）０．０１部、
（Ｄ）成分として、下記式（１２）を０．０１部、
ならびに、（Ｅ）成分として、上記記式（９）で示される有機ケイ素化合物１部を加え、よく撹拌して、シリコーンゴム組成物を調製した。
(Example 3)
As component ( A1 ), a branched methylpolysiloxane (Mw=5,600, silicon atom Amount of bonded hydroxyl groups, 0.2 mol/100 g, amount of alkoxy groups bonded to silicon atoms, 0.02 mol/100 g) 30 parts,
As component (A2), 50 parts of the following formula (10),
As component (B), the ratio of the total number of silicon-bonded hydrogen atoms in component (B) to the total number of silicon-bonded vinyl groups in components (A) and (D) (hereinafter referred to as SiH/SiVi ratio) organohydrogenpolysiloxane represented by the following formula (11) in an amount such that 1.0 (in some cases) is 1.0,
0.01 part of an octyl alcohol modified solution of chloroplatinic acid (platinum element content: 1% by mass) as component (C),
As component (D), 0.01 part of the following formula (12),
Further, as component (E), 1 part of an organosilicon compound represented by the above formula (9) was added and thoroughly stirred to prepare a silicone rubber composition.
（比較例１）
実施例１で用いた（Ｄ）成分を添加しなかったこと以外は、実施例１と同様にして組成物を調製した。
(Comparative example 1)
A composition was prepared in the same manner as in Example 1, except that component (D) used in Example 1 was not added.
（比較例２）
実施例１で用いた（Ｄ）成分の代わりに、トリアリルイソシアヌレート（三菱ケミカル株式会社製）０．０５部を用いたこと以外は、実施例１と同様にして組成物を調製した。
(Comparative example 2)
A composition was prepared in the same manner as in Example 1, except that 0.05 part of triallylisocyanurate (manufactured by Mitsubishi Chemical Corporation) was used instead of component (D) used in Example 1.
（比較例３）
実施例１で用いた（Ｄ）成分の代わりに、トリグリシジルイソシアヌレート（日産化学株式会社製）０．０５部を用いたこと以外は、実施例１と同様にして組成物を調製した。
(Comparative example 3)
A composition was prepared in the same manner as in Example 1, except that 0.05 part of triglycidyl isocyanurate (manufactured by Nissan Chemical Co., Ltd.) was used instead of component (D) used in Example 1.
（比較例４）
実施例１で用いた（Ｄ）成分の代わりに、モノアリルジグリシジルイソシアヌレート（四国化成株式会社製）０．０５部を用いたこと以外は、実施例１と同様にして組成物を調製した。
(Comparative example 4)
A composition was prepared in the same manner as in Example 1 , except that 0.05 part of monoallyl diglycidyl isocyanurate (manufactured by Shikoku Kasei Co., Ltd.) was used instead of component (D) used in Example 1. .
表２に示されるように、（Ｄ）成分が添加されていない比較例１では、耐硫化性が悪化した。更に、（Ｄ）成分としてシリル基を含有しないイソシアヌレート誘導体を添加した比較例２～４では、耐熱性が悪化し耐硫化性の向上も確認されなかった。 As shown in Table 2, in Comparative Example 1 in which component (D) was not added, sulfidation resistance deteriorated. Furthermore, in Comparative Examples 2 to 4 in which an isocyanurate derivative containing no silyl group was added as component (D), heat resistance deteriorated and no improvement in sulfidation resistance was observed.
一方、表２に示されるように、（Ｄ）成分として本発明のシリル化イソシアヌレート化合物を使用した実施例１～３では、透明で、十分な硬さ、切断時伸び、及び引張強さと耐熱性および耐ＨＡＳＴ性に優れた硬化物が得られた。
以上のように、本発明の硬化性有機ケイ素樹脂組成物であれば、優れた耐熱性および耐硫化性を発揮する硬化物を与えることができる。
On the other hand, as shown in Table 2, Examples 1 to 3 using the silylated isocyanurate compound of the present invention as component (D) were transparent, had sufficient hardness, elongation at break, tensile strength, and heat resistance. A cured product with excellent properties and HAST resistance was obtained.
As described above, the curable organosilicon resin composition of the present invention can provide a cured product exhibiting excellent heat resistance and sulfidation resistance.
なお、本発明は、上記実施形態に限定されるものではない。上記実施形態は例示であり、本発明の特許請求の範囲に記載された技術的思想と実質的に同一な構成を有し、同様な作用効果を奏するものは、いかなるものであっても本発明の技術的範囲に包含される。 Note that the present invention is not limited to the above embodiments. The above-mentioned embodiments are illustrative, and any embodiment that has substantially the same configuration as the technical idea stated in the claims of the present invention and has similar effects is the present invention. covered within the technical scope of.
Claims (9)
（Ｂ）１分子中に少なくとも２個のケイ素原子に結合した水素原子を有する有機ケイ素化合物：前記（Ａ）成分のアルケニル基１ｍｏｌに対して、前記（Ｂ）成分のＳｉＨ基が０．１～４．０ｍｏｌとなる量、
（Ｃ）白金族金属系触媒、
（Ｄ）金属腐食防止剤として、下記一般式（１）で示されるシリル化イソシアヌレート化合物、
を含み、前記（Ａ）成分が、
（Ａ１）ＳｉＯ４／２単位、もしくはＲ４ＳｉＯ３／２単位の少なくともいずれかを含み（Ｒ４は炭素数１～１０のアルキル基、炭素数２～１０のアルケニル基、または炭素数６～１０のアリール基である。）、
１分子中に少なくとも２個のケイ素原子に結合したアルケニル基を有するレジン状のオルガノポリシロキサンであることを特徴とする硬化性有機ケイ素樹脂組成物。
(B) An organosilicon compound having at least two hydrogen atoms bonded to silicon atoms in one molecule: 0.1 to 0.1 to 0.1 to 0.1 to 0.1 to 0.1 to 1 mol of the SiH group of the component (B) per 1 mol of the alkenyl group of the component (A). Amount that becomes 4.0 mol,
(C) platinum group metal catalyst,
(D) A silylated isocyanurate compound represented by the following general formula (1) as a metal corrosion inhibitor,
and the component (A) is
(A1) Contains at least either SiO 4/2 units or R 4 SiO 3/2 units (R 4 is an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, or an alkenyl group having 6 to 10 carbon atoms) 10 aryl groups),
A curable organosilicon resin composition comprising a resinous organopolysiloxane having at least two silicon-bonded alkenyl groups in one molecule.
０～６０ｍｏｌ％のＳｉＯ４／２単位、
０～９０ｍｏｌ％のＲ４ＳｉＯ３／２単位、
０～５０ｍｏｌ％の（Ｒ４）２ＳｉＯ２／２単位及び、
１０～５０ｍｏｌ％の（Ｒ４）３ＳｉＯ１／２単位からなり、
前記ＳｉＯ４／２単位と前記Ｒ４ＳｉＯ３／２単位の和が５０ｍｏｌ％以上であるオルガノポリシロキサンであって、
前記オルガノポリシロキサンの重量平均分子量が１，０００～５，０００であり、
１分子中に少なくとも２個のケイ素原子に結合したアルケニル基を有し、
前記オルガノポリシロキサンは、前記ＳｉＯ４／２単位、前記Ｒ４ＳｉＯ３／２単位、前記（Ｒ４）２ＳｉＯ２／２単位及び前記（Ｒ４）３ＳｉＯ１／２単位に由来する、縮合せずに一部残存するケイ素原子に結合した水酸基及びアルコキシ基を有し、
前記水酸基の量が０．００１～１．０ｍｏｌ／１００ｇであり、
炭素数が１～１０のケイ素原子に結合した前記アルコキシ基の量が１．０ｍｏｌ／１００ｇ以下であるレジン状のオルガノポリシロキサンであることを特徴とする請求項１に記載の硬化性有機ケイ素樹脂組成物。 The component (A1) is
0 to 60 mol% SiO 4/2 units,
0 to 90 mol% R 4 SiO 3/2 units,
0 to 50 mol% of (R 4 ) 2 SiO 2/2 units and
Consisting of 10 to 50 mol% of (R 4 ) 3 SiO 1/2 units,
An organopolysiloxane in which the sum of the SiO 4/2 units and the R 4 SiO 3/2 units is 50 mol% or more,
The organopolysiloxane has a weight average molecular weight of 1,000 to 5,000,
having at least two silicon-bonded alkenyl groups in one molecule,
The organopolysiloxane is a condensed polysiloxane derived from the SiO 4/2 unit, the R 4 SiO 3/2 unit, the (R 4 ) 2 SiO 2/2 unit, and the (R 4 ) 3 SiO 1/2 unit. It has a hydroxyl group and an alkoxy group bonded to some remaining silicon atoms,
The amount of the hydroxyl group is 0.001 to 1.0 mol/100 g,
The curable organosilicon resin according to claim 1, which is a resin-like organopolysiloxane in which the amount of the alkoxy group bonded to a silicon atom having 1 to 10 carbon atoms is 1.0 mol/100 g or less. Composition.
（Ａ２）１分子中に２個以上の炭素数２～１０のケイ素原子に結合したアルケニル基を有し、
ＪＩＳ Ｋ ７１１７－１：１９９９記載の方法で測定した、２５℃での粘度が１０～１００，０００ｍＰａ・ｓである直鎖状または分岐鎖状のオルガノポリシロキサンを含むことを特徴とする請求項１または請求項２に記載の硬化性有機ケイ素樹脂組成物。 In addition to the component (A1), the component (A) further comprises:
(A2) has two or more alkenyl groups bonded to silicon atoms having 2 to 10 carbon atoms in one molecule,
Claim 1 characterized in that it contains a linear or branched organopolysiloxane having a viscosity of 10 to 100,000 mPa·s at 25°C as measured by the method described in JIS K 7117-1:1999. Or the curable organosilicon resin composition according to claim 2.
前記（Ａ１）成分が５質量％以上１００質量％未満であることを特徴とする請求項３に記載の硬化性有機ケイ素樹脂組成物。 When the blending amount of the (A1) component and the (A2) component is the total amount of the (A1) and (A2) components, 100% by mass,
The curable organosilicon resin composition according to claim 3, wherein the component (A1) is 5 % by mass or more and less than 100% by mass.
前記硬化性有機ケイ素樹脂組成物中の全アルケニル基１ｍｏｌあたり、前記硬化性有機ケイ素樹脂組成物中の全ヒドロシリル基の量が０．１～４．０ｍｏｌとなる量を含有する、請求項１～４のいずれか一項に記載の硬化性有機ケイ素樹脂組成物。
Claims 1 to 3 contain an amount such that the amount of total hydrosilyl groups in the curable organosilicon resin composition is 0.1 to 4.0 mol per mol of all alkenyl groups in the curable organosilicon resin composition. 4. The curable organosilicon resin composition according to any one of 4.
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