MY151572A - Printable semiconductor structures and related methods of making and assembling - Google Patents
Printable semiconductor structures and related methods of making and assemblingInfo
- Publication number
- MY151572A MY151572A MYPI20062537A MY151572A MY 151572 A MY151572 A MY 151572A MY PI20062537 A MYPI20062537 A MY PI20062537A MY 151572 A MY151572 A MY 151572A
- Authority
- MY
- Malaysia
- Prior art keywords
- making
- present
- printable semiconductor
- compositions
- substrates
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/40—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
- H10D30/47—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having two-dimensional [2D] charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
- H10D30/471—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
- H10D30/472—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having lower bandgap active layer formed on top of wider bandgap layer, e.g. inverted HEMT
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6758—Thin-film transistors [TFT] characterised by the insulating substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/881—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being a two-dimensional material
- H10D62/882—Graphene
Landscapes
- Thin Film Transistor (AREA)
- Electroluminescent Light Sources (AREA)
- Junction Field-Effect Transistors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/145,542 US7557367B2 (en) | 2004-06-04 | 2005-06-02 | Stretchable semiconductor elements and stretchable electrical circuits |
| PCT/US2005/019354 WO2005122285A2 (en) | 2004-06-04 | 2005-06-02 | Methods and devices for fabricating and assembling printable semiconductor elements |
| US11/145,574 US7622367B1 (en) | 2004-06-04 | 2005-06-02 | Methods and devices for fabricating and assembling printable semiconductor elements |
| US79010406P | 2006-04-07 | 2006-04-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY151572A true MY151572A (en) | 2014-06-13 |
Family
ID=38682516
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI20062537 MY151572A (en) | 2005-06-02 | 2006-06-01 | Printable semiconductor structures and related methods of making and assembling |
| MYPI20113695 MY152238A (en) | 2005-06-02 | 2006-06-01 | Printable semiconductor structures and related methods of making and assembling |
| MYPI20062672A MY143492A (en) | 2006-04-07 | 2006-06-08 | A stretchable form of single crystal silicon for high performance electronics on rubber substrates |
| MYPI20094997A MY163588A (en) | 2006-04-07 | 2006-06-08 | A stretchable form of single crystal silicon for high performance electronics on rubber substrates |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI20113695 MY152238A (en) | 2005-06-02 | 2006-06-01 | Printable semiconductor structures and related methods of making and assembling |
| MYPI20062672A MY143492A (en) | 2006-04-07 | 2006-06-08 | A stretchable form of single crystal silicon for high performance electronics on rubber substrates |
| MYPI20094997A MY163588A (en) | 2006-04-07 | 2006-06-08 | A stretchable form of single crystal silicon for high performance electronics on rubber substrates |
Country Status (4)
| Country | Link |
|---|---|
| JP (6) | JP2007281406A (https=) |
| KR (5) | KR20070100617A (https=) |
| MY (4) | MY151572A (https=) |
| TW (7) | TWI533459B (https=) |
Families Citing this family (52)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102683391B (zh) | 2004-06-04 | 2015-11-18 | 伊利诺伊大学评议会 | 用于制造并组装可印刷半导体元件的方法和设备 |
| MY151572A (en) * | 2005-06-02 | 2014-06-13 | Univ Illinois | Printable semiconductor structures and related methods of making and assembling |
| EP2064710A4 (en) * | 2006-09-06 | 2011-05-04 | Univ Illinois | CONTROLLED BUCKET STRUCTURES IN SEMICONDUCTOR CONNECTIONS AND NANOMEMBRANES FOR EXPANDABLE ELECTRONIC ARTICLES |
| KR101519038B1 (ko) * | 2007-01-17 | 2015-05-11 | 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 | 프린팅기반 어셈블리에 의해 제조되는 광학 시스템 |
| CN103872002B (zh) | 2008-03-05 | 2017-03-01 | 伊利诺伊大学评议会 | 可拉伸和可折叠的电子器件 |
| US8134163B2 (en) * | 2008-08-11 | 2012-03-13 | Taiwan Semiconductor Manfacturing Co., Ltd. | Light-emitting diodes on concave texture substrate |
| US8519379B2 (en) * | 2009-12-08 | 2013-08-27 | Zena Technologies, Inc. | Nanowire structured photodiode with a surrounding epitaxially grown P or N layer |
| US8886334B2 (en) | 2008-10-07 | 2014-11-11 | Mc10, Inc. | Systems, methods, and devices using stretchable or flexible electronics for medical applications |
| US8389862B2 (en) | 2008-10-07 | 2013-03-05 | Mc10, Inc. | Extremely stretchable electronics |
| JP2012515436A (ja) * | 2009-01-12 | 2012-07-05 | エムシー10 インコーポレイテッド | 非平面撮像アレイの方法及び応用 |
| KR101048356B1 (ko) * | 2009-06-08 | 2011-07-14 | 서울대학교산학협력단 | 잡아 늘일 수 있는 전자소자들의 금속 연결 구조 및 그 제조방법 |
| US9723122B2 (en) | 2009-10-01 | 2017-08-01 | Mc10, Inc. | Protective cases with integrated electronics |
| JP2011138934A (ja) | 2009-12-28 | 2011-07-14 | Sony Corp | 薄膜トランジスタ、表示装置および電子機器 |
| US8992807B2 (en) | 2010-01-14 | 2015-03-31 | Samsung Techwin Co., Ltd. | Method of manufacturing deformation-capable graphene sheet, deformation-capable graphene sheet, and device using the same |
| WO2012091498A1 (ko) * | 2010-12-31 | 2012-07-05 | 성균관대학교산학협력단 | 그래핀 전극을 포함하는 플렉시블/스트레처블 반도체 소자, 반도체층과 그래핀 전극 사이의 접촉저항 감소 방법, 및 그래핀 인터커넥터 |
| US9159635B2 (en) | 2011-05-27 | 2015-10-13 | Mc10, Inc. | Flexible electronic structure |
| US9171794B2 (en) | 2012-10-09 | 2015-10-27 | Mc10, Inc. | Embedding thin chips in polymer |
| TWI524825B (zh) | 2012-10-29 | 2016-03-01 | 財團法人工業技術研究院 | 碳材導電膜的轉印方法 |
| FR2997554B1 (fr) * | 2012-10-31 | 2016-04-08 | Soitec Silicon On Insulator | Procede de modification d'un etat de contrainte initial d'une couche active vers un etat de contrainte final |
| KR102229373B1 (ko) * | 2013-10-08 | 2021-03-17 | 한양대학교 산학협력단 | 유연소자의 제조방법, 그에 의하여 제조된 유연소자 및 접합소자 |
| KR101447238B1 (ko) * | 2014-06-20 | 2014-10-08 | 한국기계연구원 | 양자점 박막 형성 방법 |
| KR102255198B1 (ko) * | 2014-08-12 | 2021-05-25 | 삼성디스플레이 주식회사 | 스트레처블 기판 및 이를 구비한 유기 발광 표시 장치 |
| KR102416112B1 (ko) * | 2014-10-02 | 2022-07-04 | 삼성전자주식회사 | 스트레처블/폴더블 광전자소자와 그 제조방법 및 광전자소자를 포함하는 장치 |
| US10299379B2 (en) | 2014-11-27 | 2019-05-21 | Panasonic Intellectual Property Management Co., Ltd. | Sheet-shaped stretchable structure, and resin composition for stretchable resin sheet and stretchable resin sheet used for the structure |
| JP6369788B2 (ja) | 2014-11-27 | 2018-08-08 | パナソニックIpマネジメント株式会社 | エレクトロニクス用構造体 |
| KR101630817B1 (ko) | 2014-12-10 | 2016-06-15 | 한국과학기술연구원 | 굴곡진 금속 나노와이어 네트워크, 이를 포함하는 신축성 투명전극 및 이의 제조방법 |
| US10297575B2 (en) * | 2016-05-06 | 2019-05-21 | Amkor Technology, Inc. | Semiconductor device utilizing an adhesive to attach an upper package to a lower die |
| KR102250527B1 (ko) * | 2016-12-08 | 2021-05-10 | 고려대학교 산학협력단 | 가변 칼라 필터 필름 및 변형률 측정 장치 |
| US11612054B2 (en) | 2017-10-12 | 2023-03-21 | Dai Nippon Printing Co., Ltd. | Wiring board and method for manufacturing wiring board |
| JP6582155B2 (ja) | 2017-10-12 | 2019-09-25 | 大日本印刷株式会社 | 配線基板及び配線基板の製造方法 |
| CN111165077B (zh) | 2017-10-12 | 2023-05-16 | 大日本印刷株式会社 | 配线基板和配线基板的制造方法 |
| WO2019093069A1 (ja) | 2017-11-07 | 2019-05-16 | 大日本印刷株式会社 | 伸縮性回路基板および物品 |
| KR102027115B1 (ko) * | 2017-11-28 | 2019-10-01 | 고려대학교 세종산학협력단 | 유기광전소자 및 이의 제조방법 |
| KR102100550B1 (ko) * | 2018-01-29 | 2020-04-13 | 충북대학교 산학협력단 | 구리 전극 제작 방법 및 구리 전극 제작 시스템 |
| KR102119009B1 (ko) * | 2018-03-08 | 2020-06-04 | 포항공과대학교 산학협력단 | 신축성 기판의 제조방법 및 그를 포함하는 신축성 전자기기의 제조방법 |
| KR102119023B1 (ko) * | 2018-04-23 | 2020-06-04 | 포항공과대학교 산학협력단 | 2종 이상의 올리고머를 이용한 신축성 기판의 제조방법 및 그를 포함하는 신축성 전자기기의 제조방법 |
| KR102554461B1 (ko) * | 2018-07-26 | 2023-07-10 | 엘지디스플레이 주식회사 | 스트레쳐블 표시 장치 |
| KR102172349B1 (ko) * | 2018-09-14 | 2020-10-30 | 포항공과대학교 산학협력단 | 신축성 기판의 제조방법 및 그를 포함하는 신축성 전자기기의 제조방법 |
| KR102779787B1 (ko) | 2018-10-31 | 2025-03-12 | 다이니폰 인사츠 가부시키가이샤 | 배선 기판 및 배선 기판의 제조 방법 |
| EP3876682A4 (en) | 2018-10-31 | 2022-12-07 | Dai Nippon Printing Co., Ltd. | CIRCUIT BOARD AND PROCESS OF MAKING THE CIRCUIT BOARD |
| KR102678182B1 (ko) | 2018-11-16 | 2024-06-26 | 다이니폰 인사츠 가부시키가이샤 | 배선 기판 및 배선 기판의 제조 방법 |
| US11395404B2 (en) | 2018-11-16 | 2022-07-19 | Dai Nippon Printing Co., Ltd. | Wiring board and method for manufacturing the wiring board |
| JP7249512B2 (ja) * | 2018-11-30 | 2023-03-31 | 大日本印刷株式会社 | 配線基板及び配線基板の製造方法 |
| WO2020189790A1 (ja) | 2019-03-20 | 2020-09-24 | 大日本印刷株式会社 | 配線基板及び配線基板の製造方法 |
| CN111554638B (zh) * | 2020-04-16 | 2023-09-08 | 上海交通大学 | 用于可拉伸电子装置的基底及其制备方法 |
| US11699677B2 (en) * | 2020-06-30 | 2023-07-11 | Openlight Photonics, Inc. | Die-to-wafer bonding utilizing micro-transfer printing |
| CN111952322B (zh) * | 2020-08-14 | 2022-06-03 | 电子科技大学 | 一种具有周期可调屈曲结构的柔性半导体薄膜及制备方法 |
| CN114258185A (zh) * | 2020-09-24 | 2022-03-29 | 北京梦之墨科技有限公司 | 一种电子器件及其制备方法 |
| CN112366250B (zh) * | 2020-11-17 | 2022-11-15 | 佛山市国星半导体技术有限公司 | 一种GaN基紫外探测器及其制作方法 |
| KR102412729B1 (ko) | 2021-01-18 | 2022-06-23 | 연세대학교 산학협력단 | 신축성 디스플레이 장치 |
| WO2025187670A1 (ja) * | 2024-03-04 | 2025-09-12 | 国立大学法人大阪大学 | 薄膜デバイスおよび薄膜デバイスの製造方法 |
| KR102916893B1 (ko) * | 2024-03-15 | 2026-01-30 | 영남대학교 산학협력단 | 신축성 디스플레이를 위한 오리가미 구조 기반 선택적 원격 에피택시 방법 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100616479B1 (ko) * | 1996-10-17 | 2006-08-28 | 세이코 엡슨 가부시키가이샤 | 반도체 장치 및 그 제조방법, 회로기판 및 플렉시블 기판 |
| US6787052B1 (en) * | 2000-06-19 | 2004-09-07 | Vladimir Vaganov | Method for fabricating microstructures with deep anisotropic etching of thick silicon wafers |
| US6566273B2 (en) * | 2001-06-27 | 2003-05-20 | Infineon Technologies Ag | Etch selectivity inversion for etching along crystallographic directions in silicon |
| JP2005524239A (ja) * | 2002-04-29 | 2005-08-11 | シリコン・パイプ・インコーポレーテッド | ダイレクト・コネクト形信号システム |
| JP2004071874A (ja) * | 2002-08-07 | 2004-03-04 | Sharp Corp | 半導体装置製造方法および半導体装置 |
| US7491892B2 (en) * | 2003-03-28 | 2009-02-17 | Princeton University | Stretchable and elastic interconnects |
| EP1700161B1 (en) * | 2003-12-01 | 2018-01-24 | The Board of Trustees of the University of Illinois | Methods and devices for fabricating three-dimensional nanoscale structures |
| US7566640B2 (en) * | 2003-12-15 | 2009-07-28 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing thin film integrated circuit device, noncontact thin film integrated circuit device and method for manufacturing the same, and idtag and coin including the noncontact thin film integrated circuit device |
| JP5110766B2 (ja) * | 2003-12-15 | 2012-12-26 | 株式会社半導体エネルギー研究所 | 薄膜集積回路装置の作製方法及び非接触型薄膜集積回路装置の作製方法 |
| JP4841807B2 (ja) * | 2004-02-27 | 2011-12-21 | 株式会社半導体エネルギー研究所 | 薄膜集積回路及び薄型半導体装置 |
| US7195733B2 (en) * | 2004-04-27 | 2007-03-27 | The Board Of Trustees Of The University Of Illinois | Composite patterning devices for soft lithography |
| CN102683391B (zh) * | 2004-06-04 | 2015-11-18 | 伊利诺伊大学评议会 | 用于制造并组装可印刷半导体元件的方法和设备 |
| MY151572A (en) * | 2005-06-02 | 2014-06-13 | Univ Illinois | Printable semiconductor structures and related methods of making and assembling |
-
2006
- 2006-06-01 MY MYPI20062537 patent/MY151572A/en unknown
- 2006-06-01 MY MYPI20113695 patent/MY152238A/en unknown
- 2006-06-01 TW TW102142517A patent/TWI533459B/zh active
- 2006-06-01 TW TW095119520A patent/TWI427802B/zh active
- 2006-06-08 MY MYPI20062672A patent/MY143492A/en unknown
- 2006-06-08 MY MYPI20094997A patent/MY163588A/en unknown
- 2006-06-14 TW TW095121212A patent/TWI336491B/zh active
- 2006-06-14 TW TW099127004A patent/TWI489523B/zh active
- 2006-06-14 KR KR1020060053675A patent/KR20070100617A/ko not_active Ceased
- 2006-06-14 TW TW105135576A patent/TW201717261A/zh unknown
- 2006-06-14 JP JP2006165159A patent/JP2007281406A/ja active Pending
- 2006-06-14 TW TW100139527A patent/TWI466488B/zh active
- 2006-06-14 TW TW104103340A patent/TWI570776B/zh active
-
2013
- 2013-08-16 JP JP2013169101A patent/JP5851457B2/ja active Active
- 2013-10-31 KR KR1020130131753A patent/KR20130133733A/ko not_active Ceased
-
2014
- 2014-07-29 KR KR1020140096828A patent/KR20140107158A/ko not_active Ceased
-
2015
- 2015-03-02 JP JP2015040251A patent/JP6140207B2/ja active Active
- 2015-03-24 KR KR20150040631A patent/KR20150044865A/ko not_active Ceased
-
2016
- 2016-09-08 JP JP2016175541A patent/JP6377689B2/ja active Active
- 2016-11-28 JP JP2016230221A patent/JP6574157B2/ja active Active
-
2017
- 2017-06-26 KR KR1020170080342A patent/KR20170077097A/ko not_active Ceased
-
2018
- 2018-07-09 JP JP2018130156A patent/JP2019004151A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014017495A (ja) | 2014-01-30 |
| KR20140107158A (ko) | 2014-09-04 |
| JP2007281406A (ja) | 2007-10-25 |
| TW201519287A (zh) | 2015-05-16 |
| TW201042951A (en) | 2010-12-01 |
| TW201428984A (zh) | 2014-07-16 |
| JP5851457B2 (ja) | 2016-02-03 |
| JP2017038064A (ja) | 2017-02-16 |
| JP6377689B2 (ja) | 2018-08-22 |
| MY163588A (en) | 2017-09-29 |
| JP6574157B2 (ja) | 2019-09-11 |
| MY152238A (en) | 2014-09-15 |
| TWI466488B (zh) | 2014-12-21 |
| JP2015133510A (ja) | 2015-07-23 |
| TWI336491B (en) | 2011-01-21 |
| TWI533459B (zh) | 2016-05-11 |
| TW201717261A (zh) | 2017-05-16 |
| KR20150044865A (ko) | 2015-04-27 |
| TWI427802B (zh) | 2014-02-21 |
| KR20130133733A (ko) | 2013-12-09 |
| JP6140207B2 (ja) | 2017-05-31 |
| TWI489523B (zh) | 2015-06-21 |
| TW201216641A (en) | 2012-04-16 |
| JP2017103459A (ja) | 2017-06-08 |
| MY143492A (en) | 2011-05-31 |
| KR20070100617A (ko) | 2007-10-11 |
| JP2019004151A (ja) | 2019-01-10 |
| TW200739681A (en) | 2007-10-16 |
| TWI570776B (zh) | 2017-02-11 |
| TW200721517A (en) | 2007-06-01 |
| KR20170077097A (ko) | 2017-07-05 |
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