MY132081A - Method and apparatus for surface-grinding of workpiece - Google Patents

Method and apparatus for surface-grinding of workpiece

Info

Publication number
MY132081A
MY132081A MYPI95002433A MYPI9502433A MY132081A MY 132081 A MY132081 A MY 132081A MY PI95002433 A MYPI95002433 A MY PI95002433A MY PI9502433 A MYPI9502433 A MY PI9502433A MY 132081 A MY132081 A MY 132081A
Authority
MY
Malaysia
Prior art keywords
workpiece
grinding
base plate
semiconductor wafer
supporting means
Prior art date
Application number
MYPI95002433A
Other languages
English (en)
Inventor
Sadayuki Ohkuni
Tadahiro Kato
Hideo Kudo
Original Assignee
Shinetsu Handotai Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Kk filed Critical Shinetsu Handotai Kk
Publication of MY132081A publication Critical patent/MY132081A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
MYPI95002433A 1994-08-29 1995-08-18 Method and apparatus for surface-grinding of workpiece MY132081A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6227291A JP3055401B2 (ja) 1994-08-29 1994-08-29 ワークの平面研削方法及び装置

Publications (1)

Publication Number Publication Date
MY132081A true MY132081A (en) 2007-09-28

Family

ID=16858516

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI95002433A MY132081A (en) 1994-08-29 1995-08-18 Method and apparatus for surface-grinding of workpiece

Country Status (5)

Country Link
US (1) US6077149A (de)
EP (1) EP0699504B1 (de)
JP (1) JP3055401B2 (de)
DE (1) DE69518202T2 (de)
MY (1) MY132081A (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3348429B2 (ja) * 1996-12-26 2002-11-20 信越半導体株式会社 薄板ワーク平面研削方法
DE19722679A1 (de) * 1997-05-30 1998-12-03 Wacker Siltronic Halbleitermat Scheibenhalter und Verfahren zur Herstellung einer Halbleiterscheibe
EP1019955A1 (de) * 1997-08-21 2000-07-19 MEMC Electronic Materials, Inc. Verfahren zur verarbeitung von halbleiterwafern
JP3497722B2 (ja) 1998-02-27 2004-02-16 富士通株式会社 半導体装置及びその製造方法及びその搬送トレイ
JP3328193B2 (ja) 1998-07-08 2002-09-24 信越半導体株式会社 半導体ウエーハの製造方法
JP4233651B2 (ja) 1998-10-29 2009-03-04 信越半導体株式会社 シリコン単結晶ウエーハ
US6214704B1 (en) 1998-12-16 2001-04-10 Memc Electronic Materials, Inc. Method of processing semiconductor wafers to build in back surface damage
US6294469B1 (en) 1999-05-21 2001-09-25 Plasmasil, Llc Silicon wafering process flow
US7059942B2 (en) * 2000-09-27 2006-06-13 Strasbaugh Method of backgrinding wafers while leaving backgrinding tape on a chuck
WO2002026441A1 (en) * 2000-09-27 2002-04-04 Strasbaugh, Inc. Tool for applying resilient tape to chuck used for grinding or polishing wafers
US6672943B2 (en) 2001-01-26 2004-01-06 Wafer Solutions, Inc. Eccentric abrasive wheel for wafer processing
US6632012B2 (en) 2001-03-30 2003-10-14 Wafer Solutions, Inc. Mixing manifold for multiple inlet chemistry fluids
US20050221722A1 (en) * 2004-03-31 2005-10-06 Cheong Yew W Wafer grinding using an adhesive gel material
US20050236358A1 (en) * 2004-04-26 2005-10-27 Shen Buswell Micromachining methods and systems
US7541264B2 (en) * 2005-03-01 2009-06-02 Dow Corning Corporation Temporary wafer bonding method for semiconductor processing
JP4663362B2 (ja) * 2005-03-18 2011-04-06 株式会社ディスコ ウエーハの平坦加工方法
JP4728023B2 (ja) * 2005-03-24 2011-07-20 株式会社ディスコ ウェハの製造方法
JP2006269809A (ja) * 2005-03-24 2006-10-05 Disco Abrasive Syst Ltd ウエーハの平坦加工方法
JP2007049008A (ja) * 2005-08-11 2007-02-22 Disco Abrasive Syst Ltd ウェーハの両面研削方法
JP5089370B2 (ja) * 2007-12-21 2012-12-05 株式会社ディスコ 樹脂被覆方法および装置
JP5149020B2 (ja) * 2008-01-23 2013-02-20 株式会社ディスコ ウエーハの研削方法
JP5504412B2 (ja) * 2008-05-09 2014-05-28 株式会社ディスコ ウェーハの製造方法及び製造装置、並びに硬化性樹脂組成物
JP4665179B2 (ja) * 2008-07-01 2011-04-06 防衛省技術研究本部長 冷凍チャック装置
JP2009035481A (ja) * 2008-09-24 2009-02-19 Shin Etsu Handotai Co Ltd シリコン単結晶ウエーハ
JP5320058B2 (ja) * 2008-12-26 2013-10-23 株式会社ディスコ 樹脂被覆方法および樹脂被覆装置
JP5324212B2 (ja) * 2008-12-26 2013-10-23 株式会社ディスコ 樹脂被覆方法および樹脂被覆装置
JP6187579B2 (ja) * 2013-02-19 2017-08-30 株式会社Sumco 半導体ウェーハの加工方法
JP6111893B2 (ja) 2013-06-26 2017-04-12 株式会社Sumco 半導体ウェーハの加工プロセス
JP6167984B2 (ja) * 2014-05-02 2017-07-26 信越半導体株式会社 ウェーハの加工方法
TWI594291B (zh) * 2016-08-17 2017-08-01 鴻創應用科技有限公司 陶瓷晶圓片及其製造方法
JP6960866B2 (ja) * 2018-01-24 2021-11-05 昭和電工株式会社 単結晶４Ｈ−ＳｉＣ成長用種結晶及びその加工方法
DE112018007133T5 (de) * 2018-02-21 2020-11-05 Sumco Corporation Waferproduktionsverfahren
CN110465846A (zh) * 2019-07-25 2019-11-19 江苏吉星新材料有限公司 一种大尺寸蓝宝石衬底晶圆片的面型修复方法
CN110722692B (zh) * 2019-10-12 2021-09-07 江苏澳洋顺昌集成电路股份有限公司 一种控制研磨产品bow值加工的方法
CN110783178B (zh) * 2019-11-01 2022-08-12 广东先导先进材料股份有限公司 一种半导体晶片及其加工方法
CN114670347A (zh) * 2022-03-30 2022-06-28 亚新半导体科技(无锡)有限公司 用于硅盘的加工方法和硅盘加工设备
JP2023172169A (ja) * 2022-05-23 2023-12-06 信越半導体株式会社 研削ウェーハの製造方法及びウェーハの製造方法
WO2024018854A1 (ja) * 2022-07-20 2024-01-25 東京エレクトロン株式会社 基板処理方法、基板処理装置および研削装置

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US4009539A (en) * 1975-06-16 1977-03-01 Spitfire Tool & Machine Co., Inc. Lapping machine with vacuum workholder
US4316757A (en) * 1980-03-03 1982-02-23 Monsanto Company Method and apparatus for wax mounting of thin wafers for polishing
JPS5996912A (ja) * 1982-11-26 1984-06-04 株式会社東芝 セラミツク製品の製造法
JPS60103651U (ja) * 1983-12-19 1985-07-15 シチズン時計株式会社 真空吸着台
JPS60109859U (ja) * 1983-12-28 1985-07-25 株式会社　デイスコ 半導体ウエ−ハ表面研削装置
EP0272531B1 (de) * 1986-12-08 1991-07-31 Sumitomo Electric Industries Limited Flächenschleifmaschine
FR2613263B1 (fr) * 1987-03-30 1991-01-18 Essilor Int Procede et appareil pour fixer un bloc metallique sur une face d'une lentille ophtalmique, par surmoulage de metal en fusion
JPS63272461A (ja) * 1987-04-27 1988-11-09 Hitachi Cable Ltd 半導体ウエハの研磨方法
DE3804873A1 (de) * 1988-02-17 1989-08-31 Mueller Georg Nuernberg Verfahren und vorrichtung zum zerteilen von halbleiter-barren in halbleiter-ronden mit zumindest einer planen oberflaeche
JPH02124243A (ja) * 1988-07-27 1990-05-11 Nippon Alum Mfg Co Ltd ワークの加工方法と凍結保持装置
US5004512A (en) * 1989-08-21 1991-04-02 Frank Fodera Method of making a stone veneer panel
JPH03108332A (ja) * 1989-09-21 1991-05-08 Naoetsu Denshi Kogyo Kk 半導体ウエハの鏡面加工方法
JPH05305561A (ja) * 1992-05-01 1993-11-19 Sumitomo Electric Ind Ltd 窒化ケイ素系セラミックスの研削加工方法及びその加工製品
US5256599A (en) * 1992-06-01 1993-10-26 Motorola, Inc. Semiconductor wafer wax mounting and thinning process
JP2839801B2 (ja) * 1992-09-18 1998-12-16 三菱マテリアル株式会社 ウェーハの製造方法
JP2513426B2 (ja) * 1993-09-20 1996-07-03 日本電気株式会社 ウェ―ハ研磨装置

Also Published As

Publication number Publication date
US6077149A (en) 2000-06-20
JP3055401B2 (ja) 2000-06-26
DE69518202D1 (de) 2000-09-07
EP0699504A1 (de) 1996-03-06
DE69518202T2 (de) 2001-02-08
EP0699504B1 (de) 2000-08-02
JPH0866850A (ja) 1996-03-12

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