MX354715B - Dispositivo de deteccion de defectos y sistema de produccion. - Google Patents

Dispositivo de deteccion de defectos y sistema de produccion.

Info

Publication number
MX354715B
MX354715B MX2017000069A MX2017000069A MX354715B MX 354715 B MX354715 B MX 354715B MX 2017000069 A MX2017000069 A MX 2017000069A MX 2017000069 A MX2017000069 A MX 2017000069A MX 354715 B MX354715 B MX 354715B
Authority
MX
Mexico
Prior art keywords
detection device
defect detection
image
ratio
defect
Prior art date
Application number
MX2017000069A
Other languages
English (en)
Other versions
MX2017000069A (es
Inventor
Noshi Yoshitsugu
SHIBAYAMA Hirohisa
Shiotani Eiji
Sakurai Satoru
Sugiyama Kiyokazu
Shimizu Akira
Terada Daisuke
Utsumi Yoshito
Original Assignee
Nissan Motor
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Motor filed Critical Nissan Motor
Publication of MX2017000069A publication Critical patent/MX2017000069A/es
Publication of MX354715B publication Critical patent/MX354715B/es

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/06—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00 specially designed for treating the inside of hollow bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
    • B05B9/01—Spray pistols, discharge devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/24—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B33/00—Honing machines or devices; Accessories therefor
    • B24B33/02—Honing machines or devices; Accessories therefor designed for working internal surfaces of revolution, e.g. of cylindrical or conical shapes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/22—Measuring arrangements characterised by the use of optical techniques for measuring depth
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/954—Inspecting the inner surface of hollow bodies, e.g. bores
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/50—Depth or shape recovery
    • G06T7/507—Depth or shape recovery from shading
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/60—Analysis of geometric attributes
    • G06T7/62—Analysis of geometric attributes of area, perimeter, diameter or volume
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/954—Inspecting the inner surface of hollow bodies, e.g. bores
    • G01N2021/9548—Scanning the interior of a cylinder
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/10—Scanning
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/12—Circuits of general importance; Signal processing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Abstract

Se proporciona un dispositivo (1) de detección de defectos capaz de medir el volumen de los defectos superficiales. El dispositivo (1) de detección de defectos incluye: un dispositivo (3) de formación de imágenes configurado para formar imágenes de una imagen de un objeto de inspección; una unidad (11) de procesamiento de binarización configurada para someter la imagen al primer y segundo procesamiento de binarización mediante el uso de diferentes primer y segundo umbrales de binarización, a fin de calcular primer y segundo tamaños para un defecto idéntico en la imagen; una unidad (12) de cálculo de relación configurada para calcular una primera relación del segundo tamaño al primer tamaño; y una unidad (13) de determinación de profundidad configurada para determinar una profundidad del defecto dependiendo de la primera relación.
MX2017000069A 2014-07-08 2014-07-08 Dispositivo de deteccion de defectos y sistema de produccion. MX354715B (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2014/068193 WO2016006039A1 (ja) 2014-07-08 2014-07-08 欠陥検査装置及び生産システム

Publications (2)

Publication Number Publication Date
MX2017000069A MX2017000069A (es) 2017-04-27
MX354715B true MX354715B (es) 2018-03-16

Family

ID=55063715

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2017000069A MX354715B (es) 2014-07-08 2014-07-08 Dispositivo de deteccion de defectos y sistema de produccion.

Country Status (8)

Country Link
US (2) US9805457B2 (es)
EP (1) EP3168569B1 (es)
JP (1) JP6288272B2 (es)
KR (1) KR101730787B1 (es)
CN (1) CN106471333B (es)
ES (1) ES2705076T3 (es)
MX (1) MX354715B (es)
WO (1) WO2016006039A1 (es)

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PL3486638T3 (pl) * 2016-07-12 2024-03-04 Yoshino Gypsum Co., Ltd. Sposób kontroli, sposób kontroli i raportowania, sposób wytwarzania, w tym sposób kontroli, urządzenie kontrolujące i urządzenie wytwarzające
US10562244B2 (en) * 2017-01-23 2020-02-18 The Boeing Company Systems and methods for forming a composite part based on volume
CN106996749A (zh) * 2017-03-31 2017-08-01 西安理工大学 管内周向环形窄沟槽几何参数检测装置及检测方法
HUE042725T2 (hu) * 2017-05-18 2019-07-29 Grob Gmbh & Co Kg Eljárás és készülék bevont felületek minõségének vizsgálatára
CN108961252B (zh) * 2018-07-27 2021-06-08 Oppo（重庆）智能科技有限公司 检测logo粘贴不良的方法、电子装置及计算机可读存储介质
CN109283182A (zh) * 2018-08-03 2019-01-29 江苏理工学院 一种电池焊点缺陷的检测方法、装置及系统
JP2020038085A (ja) * 2018-09-03 2020-03-12 Juki株式会社 検査装置
CN110148106B (zh) * 2019-01-18 2023-06-27 华晨宝马汽车有限公司 一种利用深度学习模型检测物体表面缺陷的系统及方法
US11176660B2 (en) * 2019-07-25 2021-11-16 Caterpillar Inc. Sorting pistons with flaws
CN112388391B (zh) * 2020-11-09 2022-08-23 上海圣之尧智能科技有限公司 一种车削刀具置换方法
CN114392875A (zh) * 2021-12-15 2022-04-26 邳州通达化工机械有限公司 一种避免安全隐患的化工设备搪瓷层紧急修补装置
CN114459362B (zh) * 2021-12-31 2024-03-26 深圳市瑞图生物技术有限公司 一种测量装置及其测量方法
CN114952456A (zh) * 2022-07-28 2022-08-30 常州市旭泉精密电机有限公司 电机轴磨削加工用智能化自动校测装置
CN116571410B (zh) * 2023-07-14 2023-09-26 杭州百子尖科技股份有限公司 基于机器视觉的缺陷区域修复方法、装置、设备以及介质

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Also Published As

Publication number Publication date
US10339645B2 (en) 2019-07-02
CN106471333A (zh) 2017-03-01
US20170161886A1 (en) 2017-06-08
EP3168569A1 (en) 2017-05-17
KR20170012377A (ko) 2017-02-02
KR101730787B1 (ko) 2017-04-27
EP3168569A4 (en) 2017-11-22
EP3168569B1 (en) 2018-10-24
CN106471333B (zh) 2018-01-23
WO2016006039A1 (ja) 2016-01-14
US20180025486A1 (en) 2018-01-25
ES2705076T3 (es) 2019-03-21
JP6288272B2 (ja) 2018-03-07
MX2017000069A (es) 2017-04-27
US9805457B2 (en) 2017-10-31
JPWO2016006039A1 (ja) 2017-04-27

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