MX342116B - Lamina de aleacion de cobre para materiales de terminales y conectores y metodo para producir lamina de aleacion de cobre para materiales de terminales y conectores. - Google Patents
Lamina de aleacion de cobre para materiales de terminales y conectores y metodo para producir lamina de aleacion de cobre para materiales de terminales y conectores.Info
- Publication number
- MX342116B MX342116B MX2014012441A MX2014012441A MX342116B MX 342116 B MX342116 B MX 342116B MX 2014012441 A MX2014012441 A MX 2014012441A MX 2014012441 A MX2014012441 A MX 2014012441A MX 342116 B MX342116 B MX 342116B
- Authority
- MX
- Mexico
- Prior art keywords
- terminal
- alloy plate
- mass
- copper
- connector material
- Prior art date
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title abstract 3
- 239000000463 material Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000002245 particle Substances 0.000 abstract 5
- 239000002244 precipitate Substances 0.000 abstract 3
- 238000005452 bending Methods 0.000 abstract 2
- 239000013078 crystal Substances 0.000 abstract 1
- 239000012535 impurity Substances 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2013/051602 WO2014115307A1 (ja) | 2013-01-25 | 2013-01-25 | 端子・コネクタ材用銅合金板及び端子・コネクタ材用銅合金板の製造方法 |
| PCT/JP2013/057808 WO2014115342A1 (ja) | 2013-01-25 | 2013-03-19 | 端子・コネクタ材用銅合金板及び端子・コネクタ材用銅合金板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| MX2014012441A MX2014012441A (es) | 2015-01-14 |
| MX342116B true MX342116B (es) | 2016-09-14 |
Family
ID=51227122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2014012441A MX342116B (es) | 2013-01-25 | 2013-03-19 | Lamina de aleacion de cobre para materiales de terminales y conectores y metodo para producir lamina de aleacion de cobre para materiales de terminales y conectores. |
Country Status (8)
| Country | Link |
|---|---|
| US (3) | US9957589B2 (enExample) |
| KR (1) | KR20140127911A (enExample) |
| CN (1) | CN104271783B (enExample) |
| IN (1) | IN2014MN01997A (enExample) |
| MX (1) | MX342116B (enExample) |
| SG (1) | SG11201406611QA (enExample) |
| TW (1) | TWI454585B (enExample) |
| WO (2) | WO2014115307A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014115307A1 (ja) * | 2013-01-25 | 2014-07-31 | 三菱伸銅株式会社 | 端子・コネクタ材用銅合金板及び端子・コネクタ材用銅合金板の製造方法 |
| WO2016072297A1 (ja) * | 2014-11-07 | 2016-05-12 | 住友金属鉱山株式会社 | 銅合金ターゲット |
| WO2016093349A1 (ja) * | 2014-12-12 | 2016-06-16 | 新日鐵住金株式会社 | 配向銅板、銅張積層板、可撓性回路基板、及び電子機器 |
| JP2016132816A (ja) * | 2015-01-21 | 2016-07-25 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品及び端子 |
| KR102116004B1 (ko) | 2018-08-03 | 2020-05-27 | (주)엠티에이 | 다양한 형상의 탄소체 성장용 금형 및 이를 이용한 탄소체 성장방법 |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5153949A (en) | 1974-11-05 | 1976-05-12 | Kajii Mengyo Kk | Shishuyokifuno tenchohoho oyobi tenchoki |
| JPS63161135A (ja) | 1986-12-23 | 1988-07-04 | Mitsui Mining & Smelting Co Ltd | 電気部品用銅合金 |
| JPH01189805A (ja) * | 1988-01-26 | 1989-07-31 | Dowa Mining Co Ltd | ワイヤーハーネスのターミナル用銅合金 |
| JPH06184679A (ja) * | 1992-12-18 | 1994-07-05 | Mitsui Mining & Smelting Co Ltd | 電気部品用銅合金 |
| US5893953A (en) * | 1997-09-16 | 1999-04-13 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
| JP2000087158A (ja) | 1998-09-11 | 2000-03-28 | Furukawa Electric Co Ltd:The | 半導体リードフレーム用銅合金 |
| US6471792B1 (en) * | 1998-11-16 | 2002-10-29 | Olin Corporation | Stress relaxation resistant brass |
| JP3744810B2 (ja) | 2001-03-30 | 2006-02-15 | 株式会社神戸製鋼所 | 端子・コネクタ用銅合金及びその製造方法 |
| CN1177946C (zh) * | 2001-09-07 | 2004-12-01 | 同和矿业株式会社 | 连接器用铜合金及其制造方法 |
| JP4166147B2 (ja) * | 2003-12-03 | 2008-10-15 | 株式会社神戸製鋼所 | 高強度電気電子部品用銅合金板の製造方法 |
| JP5050226B2 (ja) | 2005-03-31 | 2012-10-17 | Ｄｏｗａメタルテック株式会社 | 銅合金材料の製造法 |
| CN101693960B (zh) * | 2005-06-08 | 2011-09-07 | 株式会社神户制钢所 | 铜合金、铜合金板及其制造方法 |
| KR100792653B1 (ko) * | 2005-07-15 | 2008-01-09 | 닛코킨조쿠 가부시키가이샤 | 전기 전자기기용 동합금 및 그의 제조 방법 |
| JP2007056365A (ja) | 2005-07-27 | 2007-03-08 | Mitsui Mining & Smelting Co Ltd | 銅−亜鉛−錫合金及びその製造方法 |
| JP4984108B2 (ja) | 2005-09-30 | 2012-07-25 | Ｄｏｗａメタルテック株式会社 | プレス打抜き性の良いＣｕ−Ｎｉ−Ｓｎ−Ｐ系銅合金およびその製造法 |
| JP4810703B2 (ja) | 2005-09-30 | 2011-11-09 | Ｄｏｗａメタルテック株式会社 | 銅合金の製造法 |
| JP4810704B2 (ja) * | 2006-01-10 | 2011-11-09 | Ｄｏｗａメタルテック株式会社 | 耐応力腐食割れ性に優れたＣｕ−Ｎｉ−Ｓｉ−Ｚｎ系銅合金の製造法 |
| JP5040140B2 (ja) | 2006-03-31 | 2012-10-03 | Ｄｏｗａメタルテック株式会社 | Ｃｕ−Ｎｉ−Ｓｉ−Ｚｎ系銅合金 |
| JP4247922B2 (ja) * | 2006-09-12 | 2009-04-02 | 古河電気工業株式会社 | 電気・電子機器用銅合金板材およびその製造方法 |
| JP4157898B2 (ja) * | 2006-10-02 | 2008-10-01 | 株式会社神戸製鋼所 | プレス打ち抜き性に優れた電気電子部品用銅合金板 |
| US20080190523A1 (en) * | 2007-02-13 | 2008-08-14 | Weilin Gao | Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same |
| JP4357536B2 (ja) * | 2007-02-16 | 2009-11-04 | 株式会社神戸製鋼所 | 強度と成形性に優れる電気電子部品用銅合金板 |
| JP5075438B2 (ja) * | 2007-03-20 | 2012-11-21 | Ｄｏｗａメタルテック株式会社 | Ｃｕ−Ｎｉ−Ｓｎ−Ｐ系銅合金板材およびその製造法 |
| JP5191725B2 (ja) * | 2007-08-13 | 2013-05-08 | Ｄｏｗａメタルテック株式会社 | Ｃｕ−Ｚｎ−Ｓｎ系銅合金板材およびその製造法並びにコネクタ |
| US7928541B2 (en) | 2008-03-07 | 2011-04-19 | Kobe Steel, Ltd. | Copper alloy sheet and QFN package |
| JP5311860B2 (ja) | 2008-03-28 | 2013-10-09 | 株式会社神戸製鋼所 | Ｐｂフリーはんだ付け性に優れるＰＣＢオス端子用Ｓｎめっき付き銅合金板 |
| WO2010079707A1 (ja) | 2009-01-09 | 2010-07-15 | 三菱伸銅株式会社 | 高強度高導電銅合金圧延板及びその製造方法 |
| JP5466879B2 (ja) * | 2009-05-19 | 2014-04-09 | Ｄｏｗａメタルテック株式会社 | 銅合金板材およびその製造方法 |
| WO2011068121A1 (ja) * | 2009-12-02 | 2011-06-09 | 古河電気工業株式会社 | 銅合金板材、これを用いたコネクタ、並びにこれを製造する銅合金板材の製造方法 |
| JP5490594B2 (ja) | 2010-03-31 | 2014-05-14 | Ｊｘ日鉱日石金属株式会社 | 電池接続タブ材料用Ｃｕ−Ｚｎ系合金条 |
| JP5432201B2 (ja) * | 2011-03-30 | 2014-03-05 | Ｊｘ日鉱日石金属株式会社 | 放熱性及び繰り返し曲げ加工性に優れた銅合金板 |
| EP2759611B1 (en) | 2011-09-16 | 2018-05-30 | Mitsubishi Shindoh Co., Ltd. | Copper alloy sheet and method for producing it |
| MX2014002319A (es) | 2011-09-20 | 2014-04-10 | Mitsubishi Shindo Kk | Chapa de aleacion de cobre y metodo para fabricar chapa de aleacion de cobre. |
| JP5153949B1 (ja) | 2012-03-30 | 2013-02-27 | Ｊｘ日鉱日石金属株式会社 | Ｃｕ−Ｚｎ−Ｓｎ−Ｎｉ−Ｐ系合金 |
| WO2014115307A1 (ja) * | 2013-01-25 | 2014-07-31 | 三菱伸銅株式会社 | 端子・コネクタ材用銅合金板及び端子・コネクタ材用銅合金板の製造方法 |
-
2013
- 2013-01-25 WO PCT/JP2013/051602 patent/WO2014115307A1/ja not_active Ceased
- 2013-03-19 TW TW102109712A patent/TWI454585B/zh active
- 2013-03-19 US US14/395,430 patent/US9957589B2/en active Active
- 2013-03-19 IN IN1997MUN2014 patent/IN2014MN01997A/en unknown
- 2013-03-19 SG SG11201406611QA patent/SG11201406611QA/en unknown
- 2013-03-19 MX MX2014012441A patent/MX342116B/es active IP Right Grant
- 2013-03-19 CN CN201380023308.1A patent/CN104271783B/zh active Active
- 2013-03-19 WO PCT/JP2013/057808 patent/WO2014115342A1/ja not_active Ceased
- 2013-03-19 KR KR1020147027070A patent/KR20140127911A/ko not_active Ceased
-
2014
- 2014-10-17 US US14/517,703 patent/US20150122380A1/en not_active Abandoned
-
2015
- 2015-11-19 US US14/946,108 patent/US10020088B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20150122380A1 (en) | 2015-05-07 |
| IN2014MN01997A (enExample) | 2015-08-14 |
| WO2014115342A1 (ja) | 2014-07-31 |
| US20150318068A1 (en) | 2015-11-05 |
| CN104271783A (zh) | 2015-01-07 |
| KR20140127911A (ko) | 2014-11-04 |
| SG11201406611QA (en) | 2014-11-27 |
| CN104271783B (zh) | 2016-10-26 |
| US10020088B2 (en) | 2018-07-10 |
| MX2014012441A (es) | 2015-01-14 |
| US20160104550A1 (en) | 2016-04-14 |
| TW201430150A (zh) | 2014-08-01 |
| US9957589B2 (en) | 2018-05-01 |
| TWI454585B (zh) | 2014-10-01 |
| WO2014115307A1 (ja) | 2014-07-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| MX342116B (es) | Lamina de aleacion de cobre para materiales de terminales y conectores y metodo para producir lamina de aleacion de cobre para materiales de terminales y conectores. | |
| EP2508632A4 (en) | COPPER ALLOY SHEET | |
| MY154606A (en) | High-temperature lead-free solder alloy | |
| MX362934B (es) | Aleacion de cobre. | |
| EP2695958A3 (en) | Copper alloy sheet | |
| MY184937A (en) | Alloy material, contact probe, and connection terminal | |
| WO2016105276A8 (en) | Corrosion and moisture resistant copper based bonding wire comprising nickel | |
| PH12015502404A1 (en) | Lead-free solder alloy | |
| WO2014139548A8 (de) | Verwendung einer kupfer-zink-legierung | |
| MY170901A (en) | Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar | |
| MX347796B (es) | Composicion de poliuretano termoplastico con alta resistencia a aislamiento. | |
| BR112012011692A2 (pt) | material de conexão de circuito e estrutura de conexão para membro de circuito usando o mesmo | |
| WO2010035258A3 (en) | Discrete metallic copper nanoparticles | |
| PH12018501391A1 (en) | Copper alloy material for automobile and electrical and electronic components and method of producing the same | |
| TW201612326A (en) | Copper alloy plate and method for manufacturing copper alloy plate | |
| WO2017021818A3 (en) | Age-hardenable sterling silver alloy with improved "tarnishing" resistance and master alloy composition for its production | |
| MX2018010584A (es) | Aleacion de cobre que contiene estaño, metodo para su preparacion y su uso. | |
| IN2015DN00537A (enExample) | ||
| IN2012DN02757A (enExample) | ||
| CN103849793B (zh) | 一种电气用铜合金复合板材 | |
| WO2012057516A3 (ko) | 도전성 접착 필름, 상기 필름을 구비한 태양전지 패널 및 상기 패널의 제조 방법 | |
| WO2012062248A8 (de) | Kupferlegierung | |
| WO2016205134A3 (en) | Plating bronze on polymer sheets | |
| TH146404A (th) | คอปเปอร์-อัลลอย เพลตสำหรับวัสดุปลายทาง/ตัวเชื่อมต่อ และวิธีการสำหรับการผลิตคอปเปอร์-อัลลอยเพลตสำหรับวัสดุปลายทาง/ตัวเชื่อมต่อ | |
| MX2011009526A (es) | Aleacion de bronce libre de plomo. |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG | Grant or registration |