MX2022016393A - Composicion de resina y absorbente de ondas electromagneticas. - Google Patents

Composicion de resina y absorbente de ondas electromagneticas.

Info

Publication number
MX2022016393A
MX2022016393A MX2022016393A MX2022016393A MX2022016393A MX 2022016393 A MX2022016393 A MX 2022016393A MX 2022016393 A MX2022016393 A MX 2022016393A MX 2022016393 A MX2022016393 A MX 2022016393A MX 2022016393 A MX2022016393 A MX 2022016393A
Authority
MX
Mexico
Prior art keywords
electromagnetic wave
resin composition
wave absorber
reflectance
molded
Prior art date
Application number
MX2022016393A
Other languages
English (en)
Inventor
Hidekazu Shoji
Shuta ISEKI
Original Assignee
Mitsubishi Eng Plastics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2020219280A external-priority patent/JP2022104212A/ja
Priority claimed from JP2020219282A external-priority patent/JP2022104214A/ja
Priority claimed from JP2020219281A external-priority patent/JP2022104213A/ja
Application filed by Mitsubishi Eng Plastics Corp filed Critical Mitsubishi Eng Plastics Corp
Publication of MX2022016393A publication Critical patent/MX2022016393A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/016—Flame-proofing or flame-retarding additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/041—Carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/16—Halogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/10—Homopolymers or copolymers of propene
    • C08L23/12—Polypropene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/019—Specific properties of additives the composition being defined by the absence of a certain additive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C08L25/06—Polystyrene

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Textile Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Se proporciona una composición de resina para un absorbente de ondas electromagnéticas que tiene una gran absorbancia de ondas electromagnéticas, pequeña transmitancia y pequeña reflectancia de ondas electromagnéticas, así como mostrar una pequeña variación de reflectancia dependiendo de la frecuencia de ondas electromagnéticas; y un absorbente de ondas electromagnéticas. La composición de resina contiene 0.1 a 10.0 partes en masa de un material absorbente de ondas electromagnéticas, por 100 partes en masa de una resina termoplástica, que muestra una absorbancia en una frecuencia de 76.5 GHz de 40.0 a 100%, cuando se forma un tamaño de 150 mm×150 mm×2 mm de grueso y se determina por la Ecuación (A); mostrar una diferencia entre un valor máximo y un valor mínimo de reflectancia en el intervalo de una frecuencia de 70 GHz a 80 GHz de 20.0% o más pequeño, cuando se forma un tamaño de 150 mm×150 mm×2 mm de grueso y se determina por la Ecuación (B); y se pretende para uso como un absorbente de ondas electromagnéticas.
MX2022016393A 2020-06-17 2021-06-16 Composicion de resina y absorbente de ondas electromagneticas. MX2022016393A (es)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2020104511 2020-06-17
JP2020109525 2020-06-25
JP2020168735 2020-10-05
JP2020191979 2020-11-18
JP2020219280A JP2022104212A (ja) 2020-12-28 2020-12-28 樹脂組成物、成形体および電磁波吸収体
JP2020219282A JP2022104214A (ja) 2020-12-28 2020-12-28 樹脂組成物、成形体および電磁波吸収体
JP2020219281A JP2022104213A (ja) 2020-12-28 2020-12-28 樹脂組成物、成形体および電磁波吸収体
PCT/JP2021/022815 WO2021256488A1 (ja) 2020-06-17 2021-06-16 樹脂組成物および電磁波吸収体

Publications (1)

Publication Number Publication Date
MX2022016393A true MX2022016393A (es) 2023-01-30

Family

ID=79268108

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2022016393A MX2022016393A (es) 2020-06-17 2021-06-16 Composicion de resina y absorbente de ondas electromagneticas.

Country Status (7)

Country Link
US (1) US20230340252A1 (es)
EP (1) EP4171188A4 (es)
KR (1) KR20230028389A (es)
CN (1) CN115700024A (es)
MX (1) MX2022016393A (es)
TW (1) TW202210587A (es)
WO (1) WO2021256488A1 (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4116365A1 (en) * 2021-07-08 2023-01-11 SHPP Global Technologies B.V. Polyester compositions including carbon nanotubes as microwave absorbers in sensor applications
WO2024009848A1 (ja) * 2022-07-04 2024-01-11 三菱ケミカル株式会社 樹脂組成物、ペレット、および、成形品

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005150461A (ja) * 2003-11-17 2005-06-09 Yuka Denshi Co Ltd 電波吸収体
JP2005344065A (ja) 2004-06-04 2005-12-15 Mitsubishi Engineering Plastics Corp ポリフェニレンエーテル系樹脂組成物
EP2322577A4 (en) 2008-07-21 2014-11-12 Mitsubishi Eng Plastics Corp FLAME RESISTANT RESIN COMPOSITION BASED ON POLYBUTYLENEPEPHTHALATE
KR101267272B1 (ko) 2008-12-30 2013-05-23 제일모직주식회사 수지 조성물
JP5387016B2 (ja) 2009-02-02 2014-01-15 三菱エンジニアリングプラスチックス株式会社 難燃性熱可塑性ポリエステル樹脂組成物
JP5720933B2 (ja) * 2010-02-10 2015-05-20 株式会社豊田中央研究所 樹脂組成物およびその製造方法
JP5250154B2 (ja) * 2010-04-14 2013-07-31 高橋 玄策 導電性熱可塑性樹脂組成物
JP2011132550A (ja) 2011-04-07 2011-07-07 Mitsubishi Engineering Plastics Corp ポリアミド樹脂組成物および導電性軸状成形品
US9734930B2 (en) * 2013-09-24 2017-08-15 Samsung Electronics Co., Ltd. Conductive resin composition and display device using the same
KR101654405B1 (ko) * 2013-12-06 2016-09-05 주식회사 엘지화학 기계적 물성이 개선된 복합재 및 이를 함유하는 성형품
JP6490704B2 (ja) * 2014-08-29 2019-03-27 エルジー・ケム・リミテッド 機械的物性が改善された複合材及びこれを含有する成形品
KR101798835B1 (ko) * 2015-01-14 2017-11-20 현대모비스 주식회사 전자기파 흡수용 수지조성물 및 이를 포함하는 성형품
EP3345953A4 (en) 2015-09-04 2018-12-12 Mitsubishi Chemical Corporation Polyester resin, production method for said polyester resin, and polyester resin composition
JP6707859B2 (ja) * 2015-12-25 2020-06-10 日本ゼオン株式会社 電磁波吸収材料
JP6741554B2 (ja) 2016-10-27 2020-08-19 三菱エンジニアリングプラスチックス株式会社 車両内装部品用ポリブチレンテレフタレート樹脂組成物
JP6944322B2 (ja) 2017-09-20 2021-10-06 三菱エンジニアリングプラスチックス株式会社 熱可塑性樹脂組成物の製造方法
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CN111936880B (zh) 2018-05-02 2024-01-02 三菱化学株式会社 毫米波雷达用罩和具备该罩的毫米波雷达模块

Also Published As

Publication number Publication date
EP4171188A4 (en) 2023-11-15
WO2021256488A1 (ja) 2021-12-23
TW202210587A (zh) 2022-03-16
EP4171188A1 (en) 2023-04-26
CN115700024A (zh) 2023-02-03
KR20230028389A (ko) 2023-02-28
US20230340252A1 (en) 2023-10-26

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