WO2008087688A1 - 導電・磁性フィラー、それを含む樹脂組成物、それを用いた電磁波干渉抑制用シート及び用途及び電磁波干渉抑制シートの製造方法 - Google Patents

導電・磁性フィラー、それを含む樹脂組成物、それを用いた電磁波干渉抑制用シート及び用途及び電磁波干渉抑制シートの製造方法 Download PDF

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Publication number
WO2008087688A1
WO2008087688A1 PCT/JP2007/000018 JP2007000018W WO2008087688A1 WO 2008087688 A1 WO2008087688 A1 WO 2008087688A1 JP 2007000018 W JP2007000018 W JP 2007000018W WO 2008087688 A1 WO2008087688 A1 WO 2008087688A1
Authority
WO
WIPO (PCT)
Prior art keywords
electromagnetic wave
wave interference
interference suppression
electroconductive
suppression sheet
Prior art date
Application number
PCT/JP2007/000018
Other languages
English (en)
French (fr)
Inventor
Kazumi Yamamoto
Tetsuya Kimura
Original Assignee
Toda Kogyo Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toda Kogyo Corporation filed Critical Toda Kogyo Corporation
Priority to US11/883,881 priority Critical patent/US20090114440A1/en
Priority to PCT/JP2007/000018 priority patent/WO2008087688A1/ja
Publication of WO2008087688A1 publication Critical patent/WO2008087688A1/ja
Priority to US13/064,933 priority patent/US20110203835A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0075—Magnetic shielding materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
    • H01F1/26—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/34—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
    • H01F1/36—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles
    • H01F1/37—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles in a bonding agent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

　低周波から高周波まで広い周波数帯域で抑制効果を持つ電磁波干渉抑制用軟磁性粉末材料とそれを用いた電磁波干渉抑制用シートを提供する。 　電磁波干渉抑制シート中に導電性カーボンと軟磁性粉末を体積比３～１０：５０～７０で混合した導電・磁性フィラーを高充填することによって、電子機器の高密度実装に適し、近傍電磁界の電磁波吸収に優れ、かつ反射が十分に抑制された電磁波干渉抑制シートを得ることができる。
PCT/JP2007/000018 2007-01-18 2007-01-18 導電・磁性フィラー、それを含む樹脂組成物、それを用いた電磁波干渉抑制用シート及び用途及び電磁波干渉抑制シートの製造方法 WO2008087688A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US11/883,881 US20090114440A1 (en) 2007-01-18 2007-01-18 Conductive Magnetic Filler, Resin Composition Containing the Filler, Electromagnetic Interference Suppressing Sheet Using the Resin Composition and Applications Thereof, and Process for Producing the Electromagnetic Interference Suppressing Sheet
PCT/JP2007/000018 WO2008087688A1 (ja) 2007-01-18 2007-01-18 導電・磁性フィラー、それを含む樹脂組成物、それを用いた電磁波干渉抑制用シート及び用途及び電磁波干渉抑制シートの製造方法
US13/064,933 US20110203835A1 (en) 2007-01-18 2011-04-27 Conductive magnetic filler, resin composition containing the filler, electromagnetic interference suppressing sheet using the resin composition and applications thereof, and process for producing the electromagnetic interference suppressing sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/000018 WO2008087688A1 (ja) 2007-01-18 2007-01-18 導電・磁性フィラー、それを含む樹脂組成物、それを用いた電磁波干渉抑制用シート及び用途及び電磁波干渉抑制シートの製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/064,933 Continuation US20110203835A1 (en) 2007-01-18 2011-04-27 Conductive magnetic filler, resin composition containing the filler, electromagnetic interference suppressing sheet using the resin composition and applications thereof, and process for producing the electromagnetic interference suppressing sheet

Publications (1)

Publication Number Publication Date
WO2008087688A1 true WO2008087688A1 (ja) 2008-07-24

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/000018 WO2008087688A1 (ja) 2007-01-18 2007-01-18 導電・磁性フィラー、それを含む樹脂組成物、それを用いた電磁波干渉抑制用シート及び用途及び電磁波干渉抑制シートの製造方法

Country Status (2)

Country Link
US (2) US20090114440A1 (ja)
WO (1) WO2008087688A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012044084A (ja) * 2010-08-23 2012-03-01 Sony Chemical & Information Device Corp 電磁波吸収性熱伝導シート及び電磁波吸収性熱伝導シートの製造方法
CN112625445A (zh) * 2016-09-28 2021-04-09 莫列斯有限公司 电磁屏蔽用片材及其制造方法

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US8723054B2 (en) * 2007-04-11 2014-05-13 Toda Kogyo Corporation Electromagnetic noise suppression sheet, flat cable for high-frequency signals, flexible printed circuit board, and process for producing the electromagnetic noise suppression sheet
JP6017416B2 (ja) * 2010-05-10 2016-11-02 コリア インスティチュ−ト オブ マシナリ− アンド マテリアルズ 広帯域電磁気波吸収体及びその製造方法
US9666342B2 (en) 2010-05-27 2017-05-30 University Of South Florida Magneto-dielectric polymer nanocomposites
US9384877B2 (en) 2010-05-27 2016-07-05 University Of South Florida Magneto dielectric polymer nanocomposites and method of making
JP5626078B2 (ja) * 2011-03-31 2014-11-19 Tdk株式会社 磁性シート
EP2723154A4 (en) * 2011-06-17 2016-01-27 Toda Kogyo Corp SUPPRESSORS OF ELECTROMAGNETIC INTERFERENCES
EP2711938B1 (en) * 2012-09-25 2014-11-26 Nexans Silicone multilayer insulation for electric cable
JPWO2014098065A1 (ja) * 2012-12-19 2017-01-12 戸田工業株式会社 電磁波干渉抑制体
JP2015090894A (ja) * 2013-11-05 2015-05-11 イビデン株式会社 プリント配線板
DE102014214483A1 (de) * 2013-12-09 2015-06-11 Hyundai Motor Company Steckverbinder und kabel zur absorption niederfrequenter elektromagnetischer wellen
JP2017022319A (ja) * 2015-07-14 2017-01-26 住友ベークライト株式会社 電磁波シールド用フィルム、および電子部品搭載基板
JP6661919B2 (ja) * 2015-08-25 2020-03-11 東洋インキＳｃホールディングス株式会社 フレキシブルプリント回路基板用またはフレキシブルフラットケーブル用電磁波抑制シートおよびこれを用いた電磁波抑制粘着シート
JP2017059627A (ja) * 2015-09-15 2017-03-23 日本合成化学工業株式会社 電磁波抑制シートおよびこれを用いた電磁波抑制粘着シート、電磁波抑制用樹脂組成物、電磁波抑制層
US10717911B2 (en) * 2015-10-09 2020-07-21 Ineos Styrolution Group Gmbh Electrically conducting thermally conductive polymer resin composition based on styrenics with balanced properties
ITUA20164309A1 (it) * 2016-06-13 2017-12-13 Mondo Spa Composizione magnetica, rivestimento che la comprende e relativi procedimenti
JP7286270B2 (ja) * 2018-03-30 2023-06-05 デュポン帝人アドバンスドペーパー株式会社 電磁波吸収シート、およびその製造方法
CN111669956B (zh) * 2019-03-06 2024-04-02 天津莱尔德电子材料有限公司 热管理和/或电磁干扰减轻材料以及相关装置和方法
JP7200923B2 (ja) * 2019-12-25 2023-01-10 株式会社オートネットワーク技術研究所 通信用電線

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JPS60249392A (ja) * 1984-05-24 1985-12-10 ティーディーケイ株式会社 電磁シ−ルド材料
JP2000244173A (ja) * 1999-02-18 2000-09-08 Hitachi Maxell Ltd 液状電波干渉防止組成物
JP2002050506A (ja) * 2000-08-04 2002-02-15 C I Kasei Co Ltd 電波吸収体
JP2004336028A (ja) * 2003-04-18 2004-11-25 Nitta Ind Corp 電磁波吸収材料
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012044084A (ja) * 2010-08-23 2012-03-01 Sony Chemical & Information Device Corp 電磁波吸収性熱伝導シート及び電磁波吸収性熱伝導シートの製造方法
WO2012026466A1 (ja) * 2010-08-23 2012-03-01 ソニーケミカル＆インフォメーションデバイス株式会社 電磁波吸収性熱伝導シート及び電磁波吸収性熱伝導シートの製造方法
CN112625445A (zh) * 2016-09-28 2021-04-09 莫列斯有限公司 电磁屏蔽用片材及其制造方法
CN112625445B (zh) * 2016-09-28 2022-10-04 莫列斯有限公司 电磁屏蔽用片材及其制造方法

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US20090114440A1 (en) 2009-05-07

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