MX2022016392A - Composicion de resina, articulo formado, absorbente de ondas electromagneticas y metodo para medir la absorbancia de una composicion de resina. - Google Patents

Composicion de resina, articulo formado, absorbente de ondas electromagneticas y metodo para medir la absorbancia de una composicion de resina.

Info

Publication number
MX2022016392A
MX2022016392A MX2022016392A MX2022016392A MX2022016392A MX 2022016392 A MX2022016392 A MX 2022016392A MX 2022016392 A MX2022016392 A MX 2022016392A MX 2022016392 A MX2022016392 A MX 2022016392A MX 2022016392 A MX2022016392 A MX 2022016392A
Authority
MX
Mexico
Prior art keywords
resin composition
electromagnetic wave
molded body
absorption rate
wave absorber
Prior art date
Application number
MX2022016392A
Other languages
English (en)
Inventor
Hidekazu Shoji
Shuta ISEKI
Original Assignee
Mitsubishi Eng Plastics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2020219280A external-priority patent/JP2022104212A/ja
Priority claimed from JP2020219282A external-priority patent/JP2022104214A/ja
Priority claimed from JP2020219281A external-priority patent/JP2022104213A/ja
Application filed by Mitsubishi Eng Plastics Corp filed Critical Mitsubishi Eng Plastics Corp
Publication of MX2022016392A publication Critical patent/MX2022016392A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/10—Homopolymers or copolymers of propene
    • C08L23/12—Polypropene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/016—Flame-proofing or flame-retarding additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/041—Carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N22/00—Investigating or analysing materials by the use of microwaves or radio waves, i.e. electromagnetic waves with a wavelength of one millimetre or more
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C08L25/06—Polystyrene

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nanotechnology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Textile Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

Proporcionar una composición de resina que tienen gran absorbancia de ondas electromagnéticas, pequeña transmitancia y pequeña reflectancia de la onda electromagnética, así como mostrar la pequeña variación de la reflectancia dependiendo de la frecuencia de la onda electromagnética; un artículo formado; un absorbente de ondas electromagnéticas. La composición de resina contiene, por 100 partes en masa de una resina termoplástica, 0.1 a 10.0 partes en masa de un nanotubo de carbono, y 10 a 100 partes en masa de una fibra de vidrio, con una proporción en masa del nanotubo de carbono y la fibra de vidrio (nanotubo de carbono/fibra de vidrio) que es 0.01 a 0.30.
MX2022016392A 2020-06-17 2021-06-16 Composicion de resina, articulo formado, absorbente de ondas electromagneticas y metodo para medir la absorbancia de una composicion de resina. MX2022016392A (es)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2020104511 2020-06-17
JP2020109525 2020-06-25
JP2020168734 2020-10-05
JP2020191978 2020-11-18
JP2020219280A JP2022104212A (ja) 2020-12-28 2020-12-28 樹脂組成物、成形体および電磁波吸収体
JP2020219282A JP2022104214A (ja) 2020-12-28 2020-12-28 樹脂組成物、成形体および電磁波吸収体
JP2020219281A JP2022104213A (ja) 2020-12-28 2020-12-28 樹脂組成物、成形体および電磁波吸収体
PCT/JP2021/022814 WO2021256487A1 (ja) 2020-06-17 2021-06-16 樹脂組成物、成形体、電磁波吸収体および樹脂組成物の吸収率の測定方法

Publications (1)

Publication Number Publication Date
MX2022016392A true MX2022016392A (es) 2023-01-30

Family

ID=79268098

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2022016392A MX2022016392A (es) 2020-06-17 2021-06-16 Composicion de resina, articulo formado, absorbente de ondas electromagneticas y metodo para medir la absorbancia de una composicion de resina.

Country Status (7)

Country Link
US (1) US20230242747A1 (es)
EP (1) EP4169977A4 (es)
KR (1) KR20230028388A (es)
CN (1) CN115698185A (es)
MX (1) MX2022016392A (es)
TW (1) TW202204520A (es)
WO (1) WO2021256487A1 (es)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4209552A1 (en) * 2022-01-07 2023-07-12 SHPP Global Technologies B.V. Articles and structures of wave absorption material

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JP2005344065A (ja) 2004-06-04 2005-12-15 Mitsubishi Engineering Plastics Corp ポリフェニレンエーテル系樹脂組成物
EP2322577A4 (en) 2008-07-21 2014-11-12 Mitsubishi Eng Plastics Corp FLAME RESISTANT RESIN COMPOSITION BASED ON POLYBUTYLENEPEPHTHALATE
KR101267272B1 (ko) 2008-12-30 2013-05-23 제일모직주식회사 수지 조성물
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KR101798835B1 (ko) * 2015-01-14 2017-11-20 현대모비스 주식회사 전자기파 흡수용 수지조성물 및 이를 포함하는 성형품
EP3345953A4 (en) 2015-09-04 2018-12-12 Mitsubishi Chemical Corporation Polyester resin, production method for said polyester resin, and polyester resin composition
JP6741554B2 (ja) 2016-10-27 2020-08-19 三菱エンジニアリングプラスチックス株式会社 車両内装部品用ポリブチレンテレフタレート樹脂組成物
JPWO2019017471A1 (ja) * 2017-07-20 2020-05-28 マクセルホールディングス株式会社 電磁波吸収性組成物、電磁波吸収体
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JP7249478B2 (ja) * 2017-10-30 2023-03-31 ダイセルミライズ株式会社 電磁波遮蔽性成形体
JP7234204B2 (ja) * 2018-02-27 2023-03-07 三菱エンジニアリングプラスチックス株式会社 熱可塑性樹脂組成物、成形品、熱可塑性樹脂組成物の製造方法、および、メッキ付成形品の製造方法
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Also Published As

Publication number Publication date
EP4169977A1 (en) 2023-04-26
WO2021256487A1 (ja) 2021-12-23
US20230242747A1 (en) 2023-08-03
TW202204520A (zh) 2022-02-01
KR20230028388A (ko) 2023-02-28
CN115698185A (zh) 2023-02-03
EP4169977A4 (en) 2023-11-15

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