WO2008111640A1 - オキセタン樹脂組成物 - Google Patents

オキセタン樹脂組成物 Download PDF

Info

Publication number
WO2008111640A1
WO2008111640A1 PCT/JP2008/054608 JP2008054608W WO2008111640A1 WO 2008111640 A1 WO2008111640 A1 WO 2008111640A1 JP 2008054608 W JP2008054608 W JP 2008054608W WO 2008111640 A1 WO2008111640 A1 WO 2008111640A1
Authority
WO
WIPO (PCT)
Prior art keywords
oxethane
alicyclic
resin composition
weight
resin
Prior art date
Application number
PCT/JP2008/054608
Other languages
English (en)
French (fr)
Inventor
Atsuhiko Katayama
Niranjan Kumar Shrestha
Kazumasa Kobayashi
Syuichiro Hase
Original Assignee
Nippon Steel Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co., Ltd. filed Critical Nippon Steel Chemical Co., Ltd.
Priority to JP2009504081A priority Critical patent/JP5543199B2/ja
Publication of WO2008111640A1 publication Critical patent/WO2008111640A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/08—Saturated oxiranes
    • C08G65/10—Saturated oxiranes characterised by the catalysts used
    • C08G65/105—Onium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Polyethers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

　透明性、耐熱性、低吸水率性、低誘電率性に優れた硬化物を与えるオキセタン樹脂組成物及びこれから得られる硬化物を提供する。 　このオキセタン樹脂組成物は、環式脂肪族オキセタン樹脂（Ａ）10～88重量％、環状脂肪族エポキシ樹脂（Ｂ）10～88重量％、及び熱カチオン重合開始剤（Ｃ）を環式脂肪族オキセタン樹脂（Ａ）と環状脂肪族エポキシ樹脂（Ｂ）の合計100重量部に対し0.01～20重量部を配合してなる。環式脂肪族オキセタン樹脂（Ａ）としては、4,4'-ビス[（3-エチル-3-オキセタニル）メトキシメチル]ビシクロヘキシル、1,4-ビス[（3-エチル-3-オキセタニル）メトキシメチル]シクロヘキサン又はこれらの混合物があり、環状脂肪族エポキシ樹脂（Ｂ）としては、3,4-エポキシシクロヘキシルメチル-3',4'-エポキシシクロヘキシサンカルボキシレートがある。
PCT/JP2008/054608 2007-03-15 2008-03-13 オキセタン樹脂組成物 WO2008111640A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009504081A JP5543199B2 (ja) 2007-03-15 2008-03-13 オキセタン樹脂組成物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007066354 2007-03-15
JP2007-066354 2007-03-15

Publications (1)

Publication Number Publication Date
WO2008111640A1 true WO2008111640A1 (ja) 2008-09-18

Family

ID=39759571

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/054608 WO2008111640A1 (ja) 2007-03-15 2008-03-13 オキセタン樹脂組成物

Country Status (3)

Country Link
JP (1) JP5543199B2 (ja)
TW (1) TWI464193B (ja)
WO (1) WO2008111640A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8114567B2 (en) * 2006-04-21 2012-02-14 Ndsu Research Foundation Polyol photosensitizers, carrier gas UV laser ablation sensitizers, and other additives and methods for making and using same
WO2014196515A1 (ja) * 2013-06-03 2014-12-11 株式会社ダイセル 硬化性エポキシ樹脂組成物
WO2015027393A1 (en) * 2013-08-27 2015-03-05 Ablestik (Shanghai) Limited. Curable composition and use for electronic device
WO2018062930A3 (ko) * 2016-09-30 2018-08-09 주식회사 엘지화학 접착제 조성물
WO2018235824A1 (ja) * 2017-06-23 2018-12-27 三井化学株式会社 画像表示装置封止材および画像表示装置封止シート

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000302774A (ja) * 1999-04-26 2000-10-31 Ube Ind Ltd ビスオキセタンエーテル化合物類の製造方法
JP2002201264A (ja) * 2000-12-28 2002-07-19 Showa Denko Kk 封止樹脂用組成物
JP2004002668A (ja) * 2002-04-24 2004-01-08 Toshiba Corp 液体インクおよび記録装置
JP2004250434A (ja) * 2003-01-29 2004-09-09 Toagosei Co Ltd オキセタン環を有する脂環式化合物
WO2005080364A1 (ja) * 2004-02-23 2005-09-01 Nippon Steel Chemical Co., Ltd. 脂環式オキセタン化合物の製造方法
JP2005290141A (ja) * 2004-03-31 2005-10-20 Nippon Steel Chem Co Ltd オキセタン樹脂組成物
JP2006013347A (ja) * 2004-06-29 2006-01-12 Stanley Electric Co Ltd 発光ダイオード用封止樹脂及びそれを使用した発光ダイオード
WO2007037434A1 (ja) * 2005-09-29 2007-04-05 Cmet Inc. 光学的立体造形用樹脂組成物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4350832B2 (ja) * 1999-04-19 2009-10-21 Ｊｓｒ株式会社 立体造形用光硬化性樹脂組成物およびこれを硬化してなる造形物
JP2003096184A (ja) * 2001-07-17 2003-04-03 Mitsui Chemicals Inc 光硬化型樹脂組成物
JP5256570B2 (ja) * 2005-06-06 2013-08-07 東洋インキＳｃホールディングス株式会社 封止用組成物

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000302774A (ja) * 1999-04-26 2000-10-31 Ube Ind Ltd ビスオキセタンエーテル化合物類の製造方法
JP2002201264A (ja) * 2000-12-28 2002-07-19 Showa Denko Kk 封止樹脂用組成物
JP2004002668A (ja) * 2002-04-24 2004-01-08 Toshiba Corp 液体インクおよび記録装置
JP2004250434A (ja) * 2003-01-29 2004-09-09 Toagosei Co Ltd オキセタン環を有する脂環式化合物
WO2005080364A1 (ja) * 2004-02-23 2005-09-01 Nippon Steel Chemical Co., Ltd. 脂環式オキセタン化合物の製造方法
JP2005290141A (ja) * 2004-03-31 2005-10-20 Nippon Steel Chem Co Ltd オキセタン樹脂組成物
JP2006013347A (ja) * 2004-06-29 2006-01-12 Stanley Electric Co Ltd 発光ダイオード用封止樹脂及びそれを使用した発光ダイオード
WO2007037434A1 (ja) * 2005-09-29 2007-04-05 Cmet Inc. 光学的立体造形用樹脂組成物

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8114567B2 (en) * 2006-04-21 2012-02-14 Ndsu Research Foundation Polyol photosensitizers, carrier gas UV laser ablation sensitizers, and other additives and methods for making and using same
US8445174B2 (en) 2006-04-21 2013-05-21 Ndsu Research Foundation Polyol photosensitizers, carrier gas UV laser ablation sensitizers, and other additives and methods for making and using same
US8704348B2 (en) 2006-04-21 2014-04-22 Ndsu Research Foundation Polyol photosensitizers, carrier gas UV laser ablation sensitizers, and other additives and methods for making and using same
WO2014196515A1 (ja) * 2013-06-03 2014-12-11 株式会社ダイセル 硬化性エポキシ樹脂組成物
JPWO2014196515A1 (ja) * 2013-06-03 2017-02-23 株式会社ダイセル 硬化性エポキシ樹脂組成物
WO2015027393A1 (en) * 2013-08-27 2015-03-05 Ablestik (Shanghai) Limited. Curable composition and use for electronic device
CN110669204A (zh) * 2013-08-27 2020-01-10 汉高股份有限及两合公司 可固化组合物及其用于电子设备的用途
WO2018062930A3 (ko) * 2016-09-30 2018-08-09 주식회사 엘지화학 접착제 조성물
US11377518B2 (en) 2016-09-30 2022-07-05 Lg Chem, Ltd. Adhesive composition
WO2018235824A1 (ja) * 2017-06-23 2018-12-27 三井化学株式会社 画像表示装置封止材および画像表示装置封止シート
JPWO2018235824A1 (ja) * 2017-06-23 2020-03-19 三井化学株式会社 画像表示装置封止材および画像表示装置封止シート
US11264589B2 (en) 2017-06-23 2022-03-01 Mitsui Chemicals, Inc. Image display device sealing material and image display device sealing sheet

Also Published As

Publication number Publication date
TWI464193B (zh) 2014-12-11
JP5543199B2 (ja) 2014-07-09
JPWO2008111640A1 (ja) 2010-06-24
TW200904851A (en) 2009-02-01

Similar Documents

Publication Publication Date Title
WO2008111640A1 (ja) オキセタン樹脂組成物
WO2009124998A3 (de) Hochverzweigte polymere und oligomere mit terminalen aminogruppen als härter für epoxidharze
WO2013174891A3 (de) Silangruppen-haltiges polymer
WO2014020060A3 (de) Flüssige härter zur härtung von epoxidharzen (i)
WO2013142750A3 (en) Crash-durable adhesive with enhanced stress durability
EP2028220A4 (en) FORM BODY AND MANUFACTURING METHOD THEREFOR
RU2015122411A (ru) Композиционные материалы из термореактивной смолы, содержащие межслойные повышающие ударопрочность частицы
WO2012050756A3 (en) Solvent resistant thermoplastic toughened epoxy
MY171200A (en) Film adhesive composition, method for producing the same, film adhesive, semiconductor package using the film adhesive, and method for manufacturing the semiconductor package
WO2008152843A1 (ja) エポキシ系樹脂組成物
WO2009060917A1 (ja) 熱可塑性樹脂組成物、並びに該組成物からなる成形体及びシート
WO2012166453A3 (en) Impact-resistant poly(arylene ether) resins with improved clarity
MY144436A (en) Composition of epoxy resin, phenol resin and (epoxy resin-) ctbn
WO2018073652A3 (en) Epoxy resin compositions and fiber-reinforced composite materials prepared therefrom
TW200734365A (en) Resin composition, resin cured product, and liquid discharge head
CN103289250B (zh) 一种安全无毒的pvc薄膜及其制备方法
CA2862782A1 (en) Toughness modifier for curable resin, and curable resin composition
RU2014115729A (ru) Композиция, содержащая полиамид 66 и полиамид, выбранный из группы, состоящей из: полиамида 610, полиамида 1010 и полиамида 1012
MY153000A (en) Resin composition for encapsulating semiconductor and semiconductor device
WO2014062530A3 (en) Toughened epoxy thermosets containing core shell rubbers and polyols
WO2008111283A1 (ja) 光硬化性樹脂組成物
WO2008139874A1 (ja) プロピレン系樹脂組成物の架橋体および該架橋体の製造方法、ならびに該架橋体からなる架橋成形体
EP1591486A4 (en) THERMOPLASTIC POLYESTER RESIN COMPOSITION AND FORM BODY
WO2009028479A1 (ja) 反応性カルボキシレート化合物、それを用いた硬化型樹脂組成物、およびその用途
MX367174B (es) Revestimiento de gel a base de resina epoxi para acabado de superficie de componentes hechos de plasticos reforzados con fibras.

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08722012

Country of ref document: EP

Kind code of ref document: A1

DPE1 Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101)
ENP Entry into the national phase

Ref document number: 2009504081

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08722012

Country of ref document: EP

Kind code of ref document: A1