WO2018062930A3 - 접착제 조성물 - Google Patents

접착제 조성물 Download PDF

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Publication number
WO2018062930A3
WO2018062930A3 PCT/KR2017/010914 KR2017010914W WO2018062930A3 WO 2018062930 A3 WO2018062930 A3 WO 2018062930A3 KR 2017010914 W KR2017010914 W KR 2017010914W WO 2018062930 A3 WO2018062930 A3 WO 2018062930A3
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WO
WIPO (PCT)
Prior art keywords
electronic device
organic electronic
adhesive composition
present application
including same
Prior art date
Application number
PCT/KR2017/010914
Other languages
English (en)
French (fr)
Other versions
WO2018062930A2 (ko
Inventor
김소영
이승민
양세우
Original Assignee
주식회사 엘지화학
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Filing date
Publication date
Application filed by 주식회사 엘지화학 filed Critical 주식회사 엘지화학
Priority to US16/338,353 priority Critical patent/US11377518B2/en
Priority to JP2019512764A priority patent/JP6719662B2/ja
Priority to CN201780057939.3A priority patent/CN109715749B/zh
Publication of WO2018062930A2 publication Critical patent/WO2018062930A2/ko
Publication of WO2018062930A3 publication Critical patent/WO2018062930A3/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/223—Di-epoxy compounds together with monoepoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2190/00—Compositions for sealing or packing joints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

Abstract

본 출원은 접착제 조성물 및 이를 포함하는 유기전자장치에 관한 것으로서, 외부로부터 유기전자장치로 유입되는 수분 또는 산소를 효과적으로 차단할 수 있는 구조의 형성이 가능하여 유기전자장치의 수명을 확보할 수 있고, 전면 발광형 유기전자장치의 구현이 가능하며, 유기전자장치에 발생할 수 있는 암점 등의 불량을 방지할 수 있는 접착제 조성물 및 이를 포함하는 유기전자장치를 제공한다.
PCT/KR2017/010914 2016-09-30 2017-09-29 접착제 조성물 WO2018062930A2 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US16/338,353 US11377518B2 (en) 2016-09-30 2017-09-29 Adhesive composition
JP2019512764A JP6719662B2 (ja) 2016-09-30 2017-09-29 接着剤組成物
CN201780057939.3A CN109715749B (zh) 2016-09-30 2017-09-29 粘合剂组合物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20160126968 2016-09-30
KR10-2016-0126968 2016-09-30

Publications (2)

Publication Number Publication Date
WO2018062930A2 WO2018062930A2 (ko) 2018-04-05
WO2018062930A3 true WO2018062930A3 (ko) 2018-08-09

Family

ID=61760544

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2017/010914 WO2018062930A2 (ko) 2016-09-30 2017-09-29 접착제 조성물

Country Status (6)

Country Link
US (1) US11377518B2 (ko)
JP (1) JP6719662B2 (ko)
KR (1) KR102040467B1 (ko)
CN (1) CN109715749B (ko)
TW (1) TWI645007B (ko)
WO (1) WO2018062930A2 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018106088A1 (ko) * 2016-12-09 2018-06-14 주식회사 엘지화학 밀봉재 조성물
KR102118365B1 (ko) * 2017-04-21 2020-06-04 주식회사 엘지화학 유기전자소자 봉지용 조성물
WO2019240484A1 (ko) * 2018-06-12 2019-12-19 주식회사 엘지화학 밀봉재 조성물
DE102022102650A1 (de) 2022-02-04 2023-08-10 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Kationisch polymerisierbare flammgeschützte Massen
DE102022106647A1 (de) 2022-03-22 2023-09-28 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Niedertemperaturhärtende Massen auf Basis von Glycidylethern

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US20070208106A1 (en) * 2003-12-19 2007-09-06 Chunfu Chen Cationically Curable Epoxy Resin Composition
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Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004231957A (ja) * 2003-01-09 2004-08-19 Sekisui Chem Co Ltd 光後硬化性組成物、表示素子用接着剤及び表示素子
US20070208106A1 (en) * 2003-12-19 2007-09-06 Chunfu Chen Cationically Curable Epoxy Resin Composition
JP2008063397A (ja) * 2006-09-06 2008-03-21 Kyoritsu Kagaku Sangyo Kk 光カチオン硬化型又は熱カチオン硬化型接着剤
WO2008111640A1 (ja) * 2007-03-15 2008-09-18 Nippon Steel Chemical Co., Ltd. オキセタン樹脂組成物
US20160163986A1 (en) * 2013-08-27 2016-06-09 Henkel Ag & Co. Kgaa Curable composition and its use for electronic device
WO2015198921A1 (ja) * 2014-06-23 2015-12-30 株式会社ダイセル 光硬化性組成物、及びそれを含む光学素子用接着剤
JP2016102170A (ja) * 2014-11-28 2016-06-02 株式会社ダイセル 光学素子用接着剤、及びそれを用いた光学ユニット

Also Published As

Publication number Publication date
CN109715749B (zh) 2021-04-20
US11377518B2 (en) 2022-07-05
KR20180036619A (ko) 2018-04-09
TWI645007B (zh) 2018-12-21
KR102040467B1 (ko) 2019-11-05
CN109715749A (zh) 2019-05-03
US20190225740A1 (en) 2019-07-25
TW201827549A (zh) 2018-08-01
WO2018062930A2 (ko) 2018-04-05
JP2019529619A (ja) 2019-10-17
JP6719662B2 (ja) 2020-07-08

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