KR970705173A - 기판반송장치 - Google Patents
기판반송장치 Download PDFInfo
- Publication number
- KR970705173A KR970705173A KR1019970700748A KR19970700748A KR970705173A KR 970705173 A KR970705173 A KR 970705173A KR 1019970700748 A KR1019970700748 A KR 1019970700748A KR 19970700748 A KR19970700748 A KR 19970700748A KR 970705173 A KR970705173 A KR 970705173A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- pivot shaft
- alignment mechanism
- driving unit
- substrate holder
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Control Of Conveyors (AREA)
Abstract
반송아암에 부담을 주지않고 기판의 위치결정을 실행할 수 있는 기판반송장치를 제공한다.
기틀(11)에 대하여 선회와 상하동작이 가능하게 설치된 선회축(12)와, 선회축(12)에 회전동작이 가능하게 보기둥( ) 으로 지지된 신축이 가능한 반송아암(ㄹ14)와, 반송아암(14)의 선단부에 설치되어 기판(18)을 올려놓는 기판받이(16)을 구비한다.
기판받이(16)의 하방에 기판받이(16)과 거의 평행으로 배치되는 가이드베이스(20)을 선회축(12)에 고정하고, 가이드베이스(20)을 통해서 기판얼라인멘트기구
(21)을 선회축(12)에 설치한다.
기판얼라인멘트기구(21)은 에어실린더(22)에 연결되는 한쌍의 위치보정부재
(24),(24)를 변위(變位)시키면 위치보정부재(24),(24)가 기판(18)의 위치보정을 실행한다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 제1도의 장치의 평면도.
Claims (11)
- 기틀(11)에 대하여 선회와 상하동작이 가능하게 설치된 선회축(12)와, 선회축에 회전동작이 가능하게 추(樞)지지된 신축이 가능한 반송아암(14)와, 반송아암의 선단부에 설치된 기판받이(16)을 구비하고 그 기판받이(16)위에 기판(18)을 올려놓고 기판을 반송하는 기판반송장치(10)에 있어서, 상기의 기판받이(16)위에 놓여지는 기판(18)의 위치보정을 행하는 기판얼라인멘트기구(21)을, 가이드베이스(20)을 통해서 선회축에 설치한 것을 특징으로 하는 기판반송장치.
- 제1항에 있어서, 상기의 기판얼라인멘트기구(21)은 구동부에 연결되어 기판(18)을 끼고 서로 대항하는 적어도 한쌍의 위치보정부재(24)를 가지며, 각 위치보정부재(24)는 구동부의 구동에 의해서 변위(變位)하여 기판(18)과 맞접할 수 있게 한 것을 특징으로 하는 기판반송장치.
- 제1항에 있어서, 상기의 기판얼라인멘트기구(21)은 한편이 가이드베이스(20)에 고정되고 다른편이 구동부에 연결되어 기판(18)을 끼고 서로 대향하는 적어도 한쌍의 위치보정부재(24)를 가지며, 상기의 다른편의 위치보정부재(24)는 구동부의 구동에 의해서 변위하여, 각 위치보정부재(24)는 기판(18)과 맞접할 수 있는 것을 특징으로하는 기판반송장치.
- 기틀(11)에 대하여 선회와 상하동작이 가능하게 설치된 선회축(12)와, 선회축에 회전동작이 가능하게 추 지지된 신축이 가능한 반송아암(14)와, 반송아암(14)의 선단에 설치된 기판받이(16)을 구비하고, 그 기판받이(16)위에 기판(18)을 올려놓고 기판(18)을 반송하는 기판반송장치에 있어서, 상기 기판받이(16)의 하방에 기판받이와 거의 평행으로 배치되는 가이드베이스(20)을 상기의 선회축(12)에 고정하고, 그 가이드베이스에 지지되는 구동부를 설치하여 상기 기판받이 상방까지 뻗는 위치보정부재(24)를 그 구동부에 연결하고, 상기 구동부의 구동에 의해서 위치보정부재(24)가 변위하여 기판의 위치보정을 실행하는 것을 특징으로하는 기판반송장치.
- 제2항 내지 제4항의 어느 한 항에 있어서, 상기한 위치보정부재(24)는 직사각형태의 기판(18)에 대하여 대각선상에 배치되는 것을 특징으로 하는 기판반송장치.
- 제5항에 있어서, 상기 각 위치보정부재(24)는 직사각형태의 각부(모서리부)(18a)(19b)에 있어서 인접하는 변에 각각 맞접할 수 있는 것을 특징으로 하는 기판반송장치.
- 제2항 내지 제6항의 어느 한 항에 있어서, 상기 위치보정부재(24)의 기판(18)에 맞접하는 기판맞접하는 부(28)은 평면시각으로 원형형태인것을 특징으로 하는 기판반송장치.
- 제2항 내지 제6항의 어느 한 항에 있어서, 상기의 위치보정부재(24)의 기판(18)에 맞접하는 기판맞접하는 부(28)은 평면시각으로 타원형 형태인것을 특징으로 하는 기판반송장치.
- 제1항 내지 제8항의 어느 한 항에 있어서, 상기의 기판받이(16)은 반송아암(14)에 설치되는 기초부와 기초부에서 분기되어 선단을 뻗는 복수의 조갑부(16b)를 구비하며, 그 조갑부(16b)는 그 선단부에 있어서 선단을 향해서 폭이 가늘게 되어 있는 것을 특징으로 하는 기판반송장치.
- 제9항에 있어서, 상기 조갑부(16b)는 그 선단부에 있어서 선단을 향해서 두께가 얇게 되어 있는 것을 특징으로 하는 기판반송장치.
- 제9항 또는 제10항의 어느 한 항에 있어서, 상기 기판받이(16)은 상기 조갑부의 적당한 위치에 복수의 조갑부(16b)를 연결하는 연결부(16c)를 구비하는 것을 특징으로 하는 기판반송장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP95-142128 | 1995-06-08 | ||
JP14212895 | 1995-06-08 | ||
JP142128 | 1995-06-08 | ||
PCT/JP1996/001531 WO1996042108A1 (fr) | 1995-06-08 | 1996-06-06 | Dispositif de transport de substrat |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970705173A true KR970705173A (ko) | 1997-09-06 |
KR100286248B1 KR100286248B1 (ko) | 2001-04-16 |
Family
ID=15308037
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019970700748A KR100286248B1 (ko) | 1995-06-08 | 1996-06-06 | 기판 반송 장치 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5957651A (ko) |
EP (1) | EP0776035A4 (ko) |
KR (1) | KR100286248B1 (ko) |
TW (1) | TW367300B (ko) |
WO (1) | WO1996042108A1 (ko) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1057214A1 (en) | 1998-02-18 | 2000-12-06 | Applied Materials, Inc. | End effector for wafer handler in processing system |
JP3742000B2 (ja) * | 2000-11-30 | 2006-02-01 | 富士通株式会社 | プレス装置 |
US7641247B2 (en) | 2002-12-17 | 2010-01-05 | Applied Materials, Inc. | End effector assembly for supporting a substrate |
US20070269297A1 (en) | 2003-11-10 | 2007-11-22 | Meulen Peter V D | Semiconductor wafer handling and transport |
US10086511B2 (en) | 2003-11-10 | 2018-10-02 | Brooks Automation, Inc. | Semiconductor manufacturing systems |
US7458763B2 (en) | 2003-11-10 | 2008-12-02 | Blueshift Technologies, Inc. | Mid-entry load lock for semiconductor handling system |
US20050113976A1 (en) * | 2003-11-10 | 2005-05-26 | Blueshift Technologies, Inc. | Software controller for handling system |
TWI455226B (zh) * | 2007-03-09 | 2014-10-01 | Applied Materials Inc | 用於基板傳送設備且在高溫下防下垂的端效器 |
ATE469437T1 (de) * | 2007-04-27 | 2010-06-15 | Applied Materials Inc | Substratverarbeitungsvorrichtung und verfahren zum platzieren eines substrats |
KR101502130B1 (ko) * | 2008-07-10 | 2015-03-13 | 주식회사 원익아이피에스 | 반송장치, 그가 설치된 반송챔버 및 이를 포함하는진공처리시스템 |
JP5456287B2 (ja) * | 2008-09-05 | 2014-03-26 | 東京エレクトロン株式会社 | 縦型熱処理装置 |
JP5501688B2 (ja) * | 2009-07-30 | 2014-05-28 | 東京エレクトロン株式会社 | 基板位置合わせ機構、それを用いた真空予備室および基板処理システム |
CN102126612B (zh) * | 2011-01-18 | 2013-05-22 | 东莞宏威数码机械有限公司 | 位置校正装置 |
USD731368S1 (en) | 2014-01-14 | 2015-06-09 | Stempf Automotive Industries, Inc. | Strut suspension spacer combination |
USD731367S1 (en) | 2014-01-14 | 2015-06-09 | Stempf Automotive Industries, Inc. | Strut suspension spacer |
US9233588B2 (en) | 2014-01-14 | 2016-01-12 | Stempf Automotive Industries, Inc. | Strut suspension assembly system |
USD750535S1 (en) | 2014-10-17 | 2016-03-01 | Stempf Automotive Industries, Inc. | Suspension spacer |
US9211775B1 (en) | 2014-10-17 | 2015-12-15 | Stempf Automotive Industries, Inc. | Adjustable suspension height modification apparatus |
CN113772378B (zh) * | 2021-09-13 | 2023-06-13 | 天津昌润鹏科技有限公司 | 一种探针自动摆盘装置及使用方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3260427B2 (ja) * | 1991-09-10 | 2002-02-25 | 東京エレクトロン株式会社 | 真空処理装置及び真空処理装置における基板搬送方法 |
US5374147A (en) * | 1982-07-29 | 1994-12-20 | Tokyo Electron Limited | Transfer device for transferring a substrate |
US4655584A (en) * | 1984-05-11 | 1987-04-07 | Nippon Kogaku K. K. | Substrate positioning apparatus |
JPH0610775B2 (ja) * | 1984-12-05 | 1994-02-09 | 株式会社ニコン | 円形基板の位置決め装置 |
US4887904A (en) * | 1985-08-23 | 1989-12-19 | Canon Kabushiki Kaisha | Device for positioning a semi-conductor wafer |
EP0265517A1 (en) * | 1986-05-16 | 1988-05-04 | EASTMAN KODAK COMPANY (a New Jersey corporation) | Article transfer apparatus |
JP2508540B2 (ja) * | 1987-11-02 | 1996-06-19 | 三菱マテリアル株式会社 | ウェ―ハの位置検出装置 |
JPH0346251A (ja) * | 1989-07-13 | 1991-02-27 | Fujitsu Ltd | 位置決め装置 |
CH680275A5 (ko) * | 1990-03-05 | 1992-07-31 | Tet Techno Investment Trust | |
JP2881483B2 (ja) * | 1990-07-05 | 1999-04-12 | 東京エレクトロン株式会社 | 基板搬送アーム |
JPH0555342A (ja) * | 1991-08-26 | 1993-03-05 | Hitachi Ltd | ウエーハチヤツクおよびウエーハ搬送装置 |
JPH07114233B2 (ja) * | 1992-04-01 | 1995-12-06 | 株式会社ニコン | 基板の位置決め装置 |
US5558482A (en) * | 1992-07-29 | 1996-09-24 | Tokyo Electron Limited | Multi-chamber system |
JP2694248B2 (ja) * | 1993-02-22 | 1997-12-24 | セイコーインスツルメンツ株式会社 | 試料搬送装置 |
US5421889A (en) * | 1993-06-29 | 1995-06-06 | Tokyo Electron Limited | Method and apparatus for inverting samples in a process |
US5566466A (en) * | 1994-07-01 | 1996-10-22 | Ontrak Systems, Inc. | Spindle assembly with improved wafer holder |
JP3143770B2 (ja) * | 1994-10-07 | 2001-03-07 | 東京エレクトロン株式会社 | 基板搬送装置 |
TW309503B (ko) * | 1995-06-27 | 1997-07-01 | Tokyo Electron Co Ltd | |
US5700046A (en) * | 1995-09-13 | 1997-12-23 | Silicon Valley Group, Inc. | Wafer gripper |
-
1996
- 1996-06-06 KR KR1019970700748A patent/KR100286248B1/ko not_active IP Right Cessation
- 1996-06-06 EP EP96916323A patent/EP0776035A4/en not_active Withdrawn
- 1996-06-06 WO PCT/JP1996/001531 patent/WO1996042108A1/ja not_active Application Discontinuation
- 1996-06-06 US US08/776,653 patent/US5957651A/en not_active Expired - Lifetime
- 1996-06-22 TW TW085107494A patent/TW367300B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US5957651A (en) | 1999-09-28 |
WO1996042108A1 (fr) | 1996-12-27 |
TW367300B (en) | 1999-08-21 |
KR100286248B1 (ko) | 2001-04-16 |
EP0776035A1 (en) | 1997-05-28 |
EP0776035A4 (en) | 2003-02-12 |
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