ATE469437T1 - Substratverarbeitungsvorrichtung und verfahren zum platzieren eines substrats - Google Patents

Substratverarbeitungsvorrichtung und verfahren zum platzieren eines substrats

Info

Publication number
ATE469437T1
ATE469437T1 AT07107164T AT07107164T ATE469437T1 AT E469437 T1 ATE469437 T1 AT E469437T1 AT 07107164 T AT07107164 T AT 07107164T AT 07107164 T AT07107164 T AT 07107164T AT E469437 T1 ATE469437 T1 AT E469437T1
Authority
AT
Austria
Prior art keywords
substrate
fastening means
frame
edge
attached
Prior art date
Application number
AT07107164T
Other languages
English (en)
Inventor
Thomas Berger
Simon Lau
Dieter Haas
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of ATE469437T1 publication Critical patent/ATE469437T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49998—Work holding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
AT07107164T 2007-04-27 2007-04-27 Substratverarbeitungsvorrichtung und verfahren zum platzieren eines substrats ATE469437T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP07107164A EP1998366B1 (de) 2007-04-27 2007-04-27 Substratverarbeitungsvorrichtung und Verfahren zum Platzieren eines Substrats

Publications (1)

Publication Number Publication Date
ATE469437T1 true ATE469437T1 (de) 2010-06-15

Family

ID=38327074

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07107164T ATE469437T1 (de) 2007-04-27 2007-04-27 Substratverarbeitungsvorrichtung und verfahren zum platzieren eines substrats

Country Status (9)

Country Link
US (2) US8323412B2 (de)
EP (1) EP1998366B1 (de)
JP (1) JP5068216B2 (de)
KR (1) KR100957885B1 (de)
CN (1) CN101299416B (de)
AT (1) ATE469437T1 (de)
DE (1) DE602007006772D1 (de)
PL (1) PL1998366T3 (de)
TW (1) TWI371078B (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE602007006772D1 (de) 2007-04-27 2010-07-08 Applied Materials Inc Substratverarbeitungsvorrichtung und Verfahren zum Platzieren eines Substrats
JP5359698B2 (ja) * 2009-08-31 2013-12-04 豊田合成株式会社 化合物半導体の製造装置、化合物半導体の製造方法及び化合物半導体
CN103890226A (zh) * 2011-08-09 2014-06-25 应用材料公司 可调整的遮罩
WO2014139594A1 (en) * 2013-03-15 2014-09-18 Applied Materials, Inc. Carrier for a substrate and method for carrying a substrate
CN107574426B (zh) * 2013-03-15 2020-06-09 应用材料公司 用于基板的载具
KR102219198B1 (ko) * 2013-08-02 2021-02-22 어플라이드 머티어리얼스, 인코포레이티드 기판들을 위한 유지 배열, 및 이를 사용하는 장치 및 방법
CN107109619A (zh) * 2014-12-29 2017-08-29 应用材料公司 用于沉积处理期间掩蔽基板的掩蔽布置、用于在基板上的层沉积的沉积设备、和用于清洁掩蔽布置的方法
CN109300835B (zh) * 2017-07-25 2021-04-09 北京北方华创微电子装备有限公司 一种晶片支撑结构、预热腔室和半导体处理设备
CN109338335B (zh) * 2018-10-16 2020-09-08 深圳市华星光电技术有限公司 一种用于化学气相沉淀的暗影框结构
CN112981372B (zh) * 2019-12-12 2024-02-13 Asm Ip私人控股有限公司 衬底支撑板、包括它的衬底处理设备以及衬底处理方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5684502A (en) * 1979-12-13 1981-07-09 Fujitsu Ltd Positioning device for plate
JPS6111222Y2 (de) * 1980-12-19 1986-04-09
US4986007A (en) 1987-03-25 1991-01-22 Svg Lithography Systems, Inc. Reticle frame assembly
JP2919158B2 (ja) * 1992-02-10 1999-07-12 キヤノン株式会社 基板保持装置
US6033480A (en) * 1994-02-23 2000-03-07 Applied Materials, Inc. Wafer edge deposition elimination
KR100286248B1 (ko) * 1995-06-08 2001-04-16 엔도 마코토 기판 반송 장치
JPH09213772A (ja) * 1996-01-30 1997-08-15 Dainippon Screen Mfg Co Ltd 基板保持装置
JP3386986B2 (ja) * 1997-10-16 2003-03-17 シャープ株式会社 プラズマ処理装置
US6773562B1 (en) 1998-02-20 2004-08-10 Applied Materials, Inc. Shadow frame for substrate processing
JP4101966B2 (ja) 1999-03-24 2008-06-18 三菱電機株式会社 薄膜の成膜装置
JP4416892B2 (ja) 2000-01-04 2010-02-17 株式会社アルバック マスク及び真空処理装置
JP2001284440A (ja) * 2000-03-16 2001-10-12 Asm Lithography Bv リソグラフ装置の基板ホルダ
US7927424B2 (en) * 2002-04-22 2011-04-19 Stmicroelectronics, Inc. Padded clamp ring with edge exclusion for deposition of thick AlCu/AlSiCu/Cu metal alloy layers
US7236233B2 (en) 2003-10-27 2007-06-26 Asml Netherlands B.V. Assembly of a reticle holder and a reticle
JP2005223217A (ja) 2004-02-06 2005-08-18 Ulvac Japan Ltd 基板位置決め機構および同機構を備えたインライン式真空処理装置
JP4549697B2 (ja) 2004-03-04 2010-09-22 株式会社アルバック 成膜装置及び成膜方法
JP4494832B2 (ja) 2004-03-11 2010-06-30 株式会社アルバック アライメント装置及び成膜装置
DE602007006772D1 (de) 2007-04-27 2010-07-08 Applied Materials Inc Substratverarbeitungsvorrichtung und Verfahren zum Platzieren eines Substrats

Also Published As

Publication number Publication date
JP2008291361A (ja) 2008-12-04
JP5068216B2 (ja) 2012-11-07
US20130055953A1 (en) 2013-03-07
PL1998366T3 (pl) 2010-12-31
EP1998366B1 (de) 2010-05-26
DE602007006772D1 (de) 2010-07-08
KR100957885B1 (ko) 2010-05-13
CN101299416B (zh) 2010-09-29
TW200843024A (en) 2008-11-01
US20080295773A1 (en) 2008-12-04
KR20080096357A (ko) 2008-10-30
EP1998366A1 (de) 2008-12-03
CN101299416A (zh) 2008-11-05
TWI371078B (en) 2012-08-21
US8323412B2 (en) 2012-12-04

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