PL1998366T3 - Urządzenie do obróbki substratu i sposób pozycjonowania substratu - Google Patents

Urządzenie do obróbki substratu i sposób pozycjonowania substratu

Info

Publication number
PL1998366T3
PL1998366T3 PL07107164T PL07107164T PL1998366T3 PL 1998366 T3 PL1998366 T3 PL 1998366T3 PL 07107164 T PL07107164 T PL 07107164T PL 07107164 T PL07107164 T PL 07107164T PL 1998366 T3 PL1998366 T3 PL 1998366T3
Authority
PL
Poland
Prior art keywords
substrate
fastening means
frame
edge
attached
Prior art date
Application number
PL07107164T
Other languages
English (en)
Inventor
Thomas Berger
Simon Lau
Dieter Haas
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of PL1998366T3 publication Critical patent/PL1998366T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49998—Work holding

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Manufacturing Of Printed Wiring (AREA)
PL07107164T 2007-04-27 2007-04-27 Urządzenie do obróbki substratu i sposób pozycjonowania substratu PL1998366T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP07107164A EP1998366B1 (en) 2007-04-27 2007-04-27 Substrate processing device and method of placing a substrate

Publications (1)

Publication Number Publication Date
PL1998366T3 true PL1998366T3 (pl) 2010-12-31

Family

ID=38327074

Family Applications (1)

Application Number Title Priority Date Filing Date
PL07107164T PL1998366T3 (pl) 2007-04-27 2007-04-27 Urządzenie do obróbki substratu i sposób pozycjonowania substratu

Country Status (9)

Country Link
US (2) US8323412B2 (pl)
EP (1) EP1998366B1 (pl)
JP (1) JP5068216B2 (pl)
KR (1) KR100957885B1 (pl)
CN (1) CN101299416B (pl)
AT (1) ATE469437T1 (pl)
DE (1) DE602007006772D1 (pl)
PL (1) PL1998366T3 (pl)
TW (1) TWI371078B (pl)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE469437T1 (de) 2007-04-27 2010-06-15 Applied Materials Inc Substratverarbeitungsvorrichtung und verfahren zum platzieren eines substrats
JP5359698B2 (ja) * 2009-08-31 2013-12-04 豊田合成株式会社 化合物半導体の製造装置、化合物半導体の製造方法及び化合物半導体
WO2013020589A1 (en) 2011-08-09 2013-02-14 Applied Materials, Inc. Adjustable mask
CN105189812B (zh) * 2013-03-15 2017-10-20 应用材料公司 用于基板的载具
EP2971225B1 (en) * 2013-03-15 2017-02-22 Applied Materials, Inc. Carrier for a substrate and method for carrying a substrate
KR102219198B1 (ko) * 2013-08-02 2021-02-22 어플라이드 머티어리얼스, 인코포레이티드 기판들을 위한 유지 배열, 및 이를 사용하는 장치 및 방법
WO2016107637A1 (en) * 2014-12-29 2016-07-07 Applied Materials, Inc. Masking arrangement for masking a substrate during a deposition process, deposition apparatus for layer deposition on a substrate, and method for cleaning a masking arrangement
CN109300835B (zh) * 2017-07-25 2021-04-09 北京北方华创微电子装备有限公司 一种晶片支撑结构、预热腔室和半导体处理设备
CN109338335B (zh) * 2018-10-16 2020-09-08 深圳市华星光电技术有限公司 一种用于化学气相沉淀的暗影框结构
CN112981372B (zh) * 2019-12-12 2024-02-13 Asm Ip私人控股有限公司 衬底支撑板、包括它的衬底处理设备以及衬底处理方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5684502A (en) * 1979-12-13 1981-07-09 Fujitsu Ltd Positioning device for plate
JPS6111222Y2 (pl) * 1980-12-19 1986-04-09
US4986007A (en) * 1987-03-25 1991-01-22 Svg Lithography Systems, Inc. Reticle frame assembly
JP2919158B2 (ja) * 1992-02-10 1999-07-12 キヤノン株式会社 基板保持装置
US6033480A (en) * 1994-02-23 2000-03-07 Applied Materials, Inc. Wafer edge deposition elimination
US5957651A (en) * 1995-06-08 1999-09-28 Kokusai Electric Co., Ltd. Substrate carrying apparatus
JPH09213772A (ja) * 1996-01-30 1997-08-15 Dainippon Screen Mfg Co Ltd 基板保持装置
JP3386986B2 (ja) * 1997-10-16 2003-03-17 シャープ株式会社 プラズマ処理装置
US6773562B1 (en) 1998-02-20 2004-08-10 Applied Materials, Inc. Shadow frame for substrate processing
JP4101966B2 (ja) 1999-03-24 2008-06-18 三菱電機株式会社 薄膜の成膜装置
JP4416892B2 (ja) 2000-01-04 2010-02-17 株式会社アルバック マスク及び真空処理装置
JP2001284440A (ja) * 2000-03-16 2001-10-12 Asm Lithography Bv リソグラフ装置の基板ホルダ
US7927424B2 (en) * 2002-04-22 2011-04-19 Stmicroelectronics, Inc. Padded clamp ring with edge exclusion for deposition of thick AlCu/AlSiCu/Cu metal alloy layers
US7236233B2 (en) 2003-10-27 2007-06-26 Asml Netherlands B.V. Assembly of a reticle holder and a reticle
JP2005223217A (ja) 2004-02-06 2005-08-18 Ulvac Japan Ltd 基板位置決め機構および同機構を備えたインライン式真空処理装置
JP4549697B2 (ja) 2004-03-04 2010-09-22 株式会社アルバック 成膜装置及び成膜方法
JP4494832B2 (ja) 2004-03-11 2010-06-30 株式会社アルバック アライメント装置及び成膜装置
ATE469437T1 (de) 2007-04-27 2010-06-15 Applied Materials Inc Substratverarbeitungsvorrichtung und verfahren zum platzieren eines substrats

Also Published As

Publication number Publication date
EP1998366B1 (en) 2010-05-26
EP1998366A1 (en) 2008-12-03
CN101299416A (zh) 2008-11-05
US20130055953A1 (en) 2013-03-07
ATE469437T1 (de) 2010-06-15
US20080295773A1 (en) 2008-12-04
TW200843024A (en) 2008-11-01
KR20080096357A (ko) 2008-10-30
JP5068216B2 (ja) 2012-11-07
KR100957885B1 (ko) 2010-05-13
JP2008291361A (ja) 2008-12-04
DE602007006772D1 (de) 2010-07-08
TWI371078B (en) 2012-08-21
US8323412B2 (en) 2012-12-04
CN101299416B (zh) 2010-09-29

Similar Documents

Publication Publication Date Title
PL1998366T3 (pl) Urządzenie do obróbki substratu i sposób pozycjonowania substratu
DE502005003731D1 (de) Magnetische Maskenhalterung
EP1814142A4 (en) SUBSTRATE CARRIER DEVICE, SUBSTRATE SUPPORT METHOD AND EXPOSURE DEVICE
GB2464841B (en) Apparatus and method for moving a substrate
ATE437248T1 (de) Verfahren und vorrichtung zur maskenpositionierung
MY190081A (en) Apparatus and method for mounting components on a substrate
MY179206A (en) Wafer processing method
TW200644105A (en) Protective tape separating method and apparatus using the same
TW200735180A (en) Manufacturing method of semiconductor device
TW200706464A (en) Transformation station for a packaging production machine
SG10201906641WA (en) Wafer plate and mask arrangement for substrate fabrication
TW200735339A (en) Method for fabricating a back-side illuminated image sensor
ATE549959T1 (de) Verstellbare montagehalterung
TW200625504A (en) Substrate holder, stage device and exposure device
KR20150122587A (ko) 절삭 장치
WO2008114753A1 (ja) 基板載置台，基板処理装置，基板載置台の表面加工方法
FR2791916B1 (fr) Procede de maintien en position d'une piece dans un poste d'assemblage
KR102219198B1 (ko) 기판들을 위한 유지 배열, 및 이를 사용하는 장치 및 방법
KR200489874Y1 (ko) 기판 에지 마스킹 시스템
EP2216428A4 (en) METHOD FOR PRODUCING A SiC MONOCRYSTAL SUBSTRATE AND SiC MONOCRYSTAL SUBSTRATE DERIVED FROM THIS METHOD
JP6310705B2 (ja) 基板保持装置および成膜装置
EP1378932A3 (en) Semiconductor chip mounting apparatus and mounting method
TW200701386A (en) A semiconductor substrate processing apparatus with a passive substrate gripper
TW200601443A (en) Manufacturing process and manufacturing device of ultra thin chip
TW200511472A (en) Alignment system for integrated circuit fabrication