KR970063919A - Saw 필터용 세라믹 패키지 - Google Patents

Saw 필터용 세라믹 패키지 Download PDF

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Publication number
KR970063919A
KR970063919A KR1019970004103A KR19970004103A KR970063919A KR 970063919 A KR970063919 A KR 970063919A KR 1019970004103 A KR1019970004103 A KR 1019970004103A KR 19970004103 A KR19970004103 A KR 19970004103A KR 970063919 A KR970063919 A KR 970063919A
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KR
South Korea
Prior art keywords
ceramic package
saw filter
package
metal pad
saw
Prior art date
Application number
KR1019970004103A
Other languages
English (en)
Other versions
KR100326904B1 (ko
Inventor
하지메 시마무라
Original Assignee
사와무라 시코우
오끼뎅끼 고오교오 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 사와무라 시코우, 오끼뎅끼 고오교오 가부시끼가이샤 filed Critical 사와무라 시코우
Publication of KR970063919A publication Critical patent/KR970063919A/ko
Application granted granted Critical
Publication of KR100326904B1 publication Critical patent/KR100326904B1/ko

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves
    • H03H9/6423—Means for obtaining a particular transfer characteristic
    • H03H9/6433—Coupled resonator filters
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/058—Holders; Supports for surface acoustic wave devices
    • H03H9/059—Holders; Supports for surface acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves
    • H03H9/6423—Means for obtaining a particular transfer characteristic
    • H03H9/6433—Coupled resonator filters
    • H03H9/6436—Coupled resonator filters having one acoustic track only

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

패턴면과 패키지의 저면에 설정된 금속패드사이에 틈을 설치하여 임피던스의 조정이 용이한 SAW 필터용 세라믹 패키지를 제공한다.
SAW 필터용 세라믹 패키지에 있어서 세라믹 패키지10의 저면에 형성되는 금속 패드17과 상기 세라믹 패키지10의 저면에 틈을 통해 전송로부33가 대향하도록 배치되는 SAW 필터칩31를 배치한다.

Description

SAW 필터용 세라믹 패키지
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 실시예를 표시하는 SAW 필터용 세라믹 패키지의 구성도.

Claims (4)

  1. SAW 필터용 세라믹 패키지에 있어서, (a) 세라믹 패키지의 저면에 형성되는 금속패드와, (b) 상기 세라믹 패키지의 저면에 틈을 통하여 전송로부가 대향하도록 배치되는 SAW 필터침을 구비하는 것을 특징으로 하는 SAW 필터용 세라믹 패키지.
  2. 제1항에 있어서, 상기 세라믹 패키지와 SAW 필터칩과의 접속에 범프구조를 설치한 것을 특징으로 하는 SAW 필터용 세라믹 패키지.
  3. 제1항에 있어서, 상기 세라믹 패키지와 SAW 필터칩의 주변에 면하는 단차를 설치한 것을 특징으로 하는 SAW 필터용 세라믹 패키지.
  4. 제1항에 있어서, 상기 금속패드와 상기 SAW 필터의 전송로부를 가지는 패턴면 사이에 임피던스를 부가하는 것을 특징으로 하는 SAW 필터용 세라믹 패키지.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019970004103A 1996-02-28 1997-02-12 세라믹패키지내부에밀봉된saw필터 KR100326904B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP041194 1996-02-28
JP8041194A JPH09232904A (ja) 1996-02-28 1996-02-28 Ｓａｗフィルタ用セラミックパッケージ

Publications (2)

Publication Number Publication Date
KR970063919A true KR970063919A (ko) 1997-09-12
KR100326904B1 KR100326904B1 (ko) 2002-07-03

Family

ID=12601622

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970004103A KR100326904B1 (ko) 1996-02-28 1997-02-12 세라믹패키지내부에밀봉된saw필터

Country Status (5)

Country Link
US (1) US5949305A (ko)
EP (2) EP0793340A3 (ko)
JP (1) JPH09232904A (ko)
KR (1) KR100326904B1 (ko)
DE (1) DE69738146T2 (ko)

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JPH11127055A (ja) * 1997-10-23 1999-05-11 Murata Mfg Co Ltd 複合電子部品
EP0961404B1 (en) 1998-05-29 2008-07-02 Fujitsu Limited Surface-acoustic-wave filter having an improved suppression outside a pass-band
EP1017169B1 (en) * 1998-12-29 2005-03-16 Kabushiki Kaisha Toshiba Surface acoustic wave device
JP3726998B2 (ja) 1999-04-01 2005-12-14 株式会社村田製作所 表面波装置
JP3860364B2 (ja) * 1999-08-11 2006-12-20 富士通メディアデバイス株式会社 弾性表面波装置
US8623709B1 (en) 2000-11-28 2014-01-07 Knowles Electronics, Llc Methods of manufacture of top port surface mount silicon condenser microphone packages
US7434305B2 (en) 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
KR100483042B1 (ko) * 2000-11-29 2005-04-15 삼성전기주식회사 표면 탄성파 필터의 세라믹 패키지 시일링방법 및 장치
KR100716155B1 (ko) * 2001-03-08 2007-05-10 엘지이노텍 주식회사 매칭회로가 내장된 표면탄성파 필터 패키지
KR100519750B1 (ko) * 2001-05-10 2005-10-07 삼성전자주식회사 저온소결 세라믹으로 실링된 칩 스케일 패키지 구조체 및그 제조방법
KR20030065950A (ko) * 2002-02-02 2003-08-09 보성반도체 주식회사 메탈 범프를 이용한 초박형 세라믹 패키지의 제조방법
KR100435042B1 (ko) * 2002-04-27 2004-06-07 엘지이노텍 주식회사 듀플렉스 패키지 제조방법
KR100455699B1 (ko) * 2002-10-09 2004-11-06 주식회사 케이이씨 표면 탄성파 필터 장치
EP2774390A4 (en) 2011-11-04 2015-07-22 Knowles Electronics Llc EMBEDDED DIELEKTRIKUM AS A BARRIER IN AN ACOUSTIC DEVICE AND METHOD OF MANUFACTURING
US9078063B2 (en) 2012-08-10 2015-07-07 Knowles Electronics, Llc Microphone assembly with barrier to prevent contaminant infiltration
US9794661B2 (en) 2015-08-07 2017-10-17 Knowles Electronics, Llc Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package
US10483248B2 (en) * 2017-03-23 2019-11-19 Skyworks Solutions, Inc. Wafer level chip scale filter packaging using semiconductor wafers with through wafer vias

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2673993B2 (ja) * 1990-07-02 1997-11-05 日本無線株式会社 表面弾性波装置
JPH04170811A (ja) * 1990-11-05 1992-06-18 Fujitsu Ltd 弾性表面波デバイス
JPH04360407A (ja) * 1991-06-07 1992-12-14 Matsushita Electric Ind Co Ltd 表面波デバイス用セラミックパッケージ
US5438305A (en) * 1991-08-12 1995-08-01 Hitachi, Ltd. High frequency module including a flexible substrate
JPH0590873A (ja) * 1991-09-28 1993-04-09 Murata Mfg Co Ltd 弾性表面波装置
JPH05335878A (ja) * 1992-05-29 1993-12-17 Meidensha Corp 表面実装型弾性表面波素子
JPH0697759A (ja) * 1992-09-16 1994-04-08 Fujitsu Ltd 弾性表面波装置とその製造方法
US5459368A (en) * 1993-08-06 1995-10-17 Matsushita Electric Industrial Co., Ltd. Surface acoustic wave device mounted module
JPH07212180A (ja) * 1994-01-10 1995-08-11 Toyo Commun Equip Co Ltd 表面実装型圧電部品
JPH07336183A (ja) * 1994-06-03 1995-12-22 Japan Energy Corp 弾性表面波装置
JP3301262B2 (ja) * 1995-03-28 2002-07-15 松下電器産業株式会社 弾性表面波装置

Also Published As

Publication number Publication date
JPH09232904A (ja) 1997-09-05
EP0793340A3 (en) 1998-05-13
EP0793340A2 (en) 1997-09-03
DE69738146D1 (de) 2007-10-25
EP1653613B1 (en) 2007-09-12
US5949305A (en) 1999-09-07
DE69738146T2 (de) 2008-06-12
EP1653613A1 (en) 2006-05-03
KR100326904B1 (ko) 2002-07-03

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