KR970042910A - 블리딩이 적은 플렉시블 에폭시접착제 - Google Patents

블리딩이 적은 플렉시블 에폭시접착제 Download PDF

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Publication number
KR970042910A
KR970042910A KR1019960066319A KR19960066319A KR970042910A KR 970042910 A KR970042910 A KR 970042910A KR 1019960066319 A KR1019960066319 A KR 1019960066319A KR 19960066319 A KR19960066319 A KR 19960066319A KR 970042910 A KR970042910 A KR 970042910A
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South Korea
Prior art keywords
phenol
epoxy resin
flexible epoxy
compound
resin composition
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KR1019960066319A
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English (en)
Inventor
빙 우
퀸 케이 통
로버트 더블유.알. 험프리스
Original Assignee
해밀톤 데이비드 엘.
내쇼날 스타치 앤드 케미칼 인베스트멘트 홀딩 코포레이션
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Application filed by 해밀톤 데이비드 엘., 내쇼날 스타치 앤드 케미칼 인베스트멘트 홀딩 코포레이션 filed Critical 해밀톤 데이비드 엘.
Publication of KR970042910A publication Critical patent/KR970042910A/ko

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    • H—ELECTRICITY
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
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    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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    • H01L2924/15747—Copper [Cu] as principal constituent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
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Abstract

본 발명의 개선된 플렉시블 에폭시수지 조성물은 2개 또는 3개의 히드록실기를 가지는 폴리히드록실 화합물, 또는 1개 이상의 페닐기를 또한 함유하는 모노히드록실 화합물을 조성물에 가하여 구성된다. 히드록실 화합물은 플렉시빌라이저에 대하여 1:3 내지 1:10의 중량비로 조성물에 존재하고, 경화되지 않은 상태로 도포될때 기판상에 수지의 블리딩을 감소시킨다.

Description

블리딩이 적은 플렉시블 에폭시접착제
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (2)

  1. 경화 후에 접착제로 굳어지고, 기본 성분으로서 에폭시수지, 플렉시빌라이저,경화제 및 충전재를 포함하여 이루어지는 마이크로일렉트로닉 응용품에 사용하는 플렉시블 에폭시수지 조성물에 있어서, 또한 플렉시빌라이저에 대하여 1:3 내지 1:10의 중량비로 2개 또는 3개의 히드록실기를 가지는 폴리히드록실 화합물 또는 1개 이상의 페닐기를 가지는 모노히드록실 화합물로 이루어지는 것을 특징으로 하는 플렉시블 에폭시수지 조성물.
  2. 청구항 1에 있어서, 폴리히드록실 화합물은 레조르시놀, 2,2-비스(4-히드록시페닐)프로판, 4,4´-비페놀, 4-벤질옥시 페놀, 비스(4-히드록시페닐)메탄, 4-시아노페놀, 3,4-디메틸 페놀; 방향족 논페놀계 화합물, 스티렌 글리콜, 페닐에틸 알콜, 1,3-디옥산-5,5-디메탄올, 리본계-감마-락톤, 에틸렌 글리콜, 글리세롤, 4,4´-비페놀, 4-벤질옥시 페놀, 페놀 노볼락수지, 페닐에틸 알콜, 4-시아노-페놀, 및 3,4-디메틸 페놀의 군에서 선정되는 것을 특징으로 하는 플렉시블 에폭시수지 조성물.
KR1019960066319A 1995-12-01 1996-12-16 블리딩이 적은 플렉시블 에폭시접착제 KR970042910A (ko)

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