KR870008949A - 경화성수지조성물 및 이 조성물로 피복 및 밀봉한 반도체 장치 - Google Patents
경화성수지조성물 및 이 조성물로 피복 및 밀봉한 반도체 장치 Download PDFInfo
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- KR870008949A KR870008949A KR870001666A KR870001666A KR870008949A KR 870008949 A KR870008949 A KR 870008949A KR 870001666 A KR870001666 A KR 870001666A KR 870001666 A KR870001666 A KR 870001666A KR 870008949 A KR870008949 A KR 870008949A
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4042—Imines; Imides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
- C08G59/5086—Triazines; Melamines; Guanamines
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- Microelectronics & Electronic Packaging (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1도는 본 발명에 따른 반도체장치 일부분의 단면도를 나타낸 것이다.
도면의 주요부분에 대한 부호의 설명
10:실리콘 반도체 기관 12:SiO2절연층 14:제1알루미늄배선층 16:제1보호피막 18:제2알루미늄배선층 20:제2보호피막
Claims (6)
- 다음 일반식(I)로 표시되는 적어도 지환족 에테르올리고머와 다음 일반식(II)로 표시되는 페놀성수지, 다음 일반식(III)으로 표시되는 p-히드록실스티렌 폴리머 또는 코폴리머, 적어도 하나의 N-치환된 말레이미드 결합을 가진 화합물 또는 이의 디일스-알더 부가물, 적어도 하나의 알릴 또는 프로페틸그룹과 적어도 하나의 히드록실 그룹을 가진 화합물 및 2,4-디아미노-6-비닐-s-트리아진으로 구성된 그룹에서 선택된 가교제로 이루어진 것을 특징으로 하는 경화성수지조성물.상기 식에서,m 및 n은 각기 0 내지 30이고,2<m+n≤30이며,X1및 X2는 같거나 서로 다르고, 각기 H, CH3, C(CH3)3, OH, NH2, COOH, SH, SO3H, CH2OH, Br, Cl,(여기에서, R1및 R2는 H, CH3또는 CF3이다)이고,p 및 q는 각기 0 내지 10이고,1<p+q≤10이며,Y는 H, NH2, SO3H, Rr 또는 Cl이고r은 5 내지 300이다.
- 제 1항에 있어서, 일반식(II)로 표시되는 페놀성수지의 가교제가 페놀, o-크레졸, 비페놀, 비스페놀 F, 비스페놀 A 또는 트리플루오로메틸비스페놀 A를 포름알데히드와 염산 또는 옥살산과 같은 산촉매 존재하에 축합하여 제조된 적어도 하나의 축합물인 경화성 수지 조성물.
- 제 1항에 있어서, 일반식(III)으로 표시되는 p-히드록실스티렌폴리머 또는 코폴리머의 가교제가 p-히드록실스티렌 폴리머, 4-히드록시-4'-비페닐비닐 폴리머 및 p-히드록실스티렌 또는 4-히드록시-4'-비페닐비닐과 스티렌, 말레산, 브타디엔 및 말레이미드와의 코폴리머로 구성된 그룹에서 선택된 적어도 하나인 경화성 수지 조성물.
- 제 1항에 있어서, 적어도 하나의 N-치환된 말레이미드 결합을 가진 화합물 또는 이의 디일스-알더 부가물의 가교제가 N-치환된 페닐말레이미드 및 다음 구조식으로 표시되는 화합물에서 선택된 적어도 하나인 것인 경화성 수지 조성물.상기 식에서,R는 알킬렌 또는 아릴렌 그룹 또는 이들로 치환된 2가 유기그룹이다.
- 제 1항에 있어서, 적어도 하나의 알릴 또는 프로페닐그룹과 적어도 하나의 히드록실그룹을 가진 화합물의 가교제가 다음 구조식을 가진 그룹에서 선택된 적어도 하나인 것인 경화성수지 조성물.상기 식에서,―X―는 이소프로필렌 또는 메틸렌 그룹, ―O―또는 어느 그룹도 아니다.
- 다음 일반식(I)로 표시되는 적어도 지환족 에테르올리고머와 다음 일반식(II)로 표시되는 페놀성 수지, 다음 일반식(III)으로 표시되는 p-히드록실스티렌 폴리머 또는 코폴리머, 적어도 하나의 N-치환된 말레이미드결합을 가진 화합물 또는 이의 디일스-알더 부가물, 적어도 하나의 알릴 또는 프로페닐 그룹 및 적어도 하나의 히드록실그룹을 가진 화합물 및 2,4-디아미노-6-비닐-s-트리아진으로 구성된 그룹에서 선택된 가교제로 이루어진 열경화성수지 조성물로 반도체 소자 및 리드배선의 적어도 일부분을 피복 및 밀봉하여 얻는 반도체장치.상기 식에서,m 및 n은 각기 0 내지 30이고,2<m+≤30이며,X1및 X2는 같거나 서로 다르고, 각기 H, CH3, C(CH3)3, OH, NH2, COOH, SH, SO3H, CH2OH, Br, Cl,(여기에서, R1및 R2는 H, CH3또는 CF3이다)이고,P 및 q는 각기 0 내지 10이고,1<P+q≤10이며,Y는 H, NH2, SO3H, Br 또는 Cl이고,r은 5 내지 300이다.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61048348A JPS62207320A (ja) | 1986-03-07 | 1986-03-07 | 熱硬化性樹脂組成物で封止してなる半導体装置 |
JP61-48348 | 1986-03-07 | ||
JP48348 | 1986-03-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR870008949A true KR870008949A (ko) | 1987-10-22 |
KR940001716B1 KR940001716B1 (ko) | 1994-03-05 |
Family
ID=12800875
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019870001666A KR940001716B1 (ko) | 1986-03-07 | 1987-02-26 | 경화성 수지조성물 및 이 조성물로 피복 및 밀봉한 반도체장치 |
Country Status (3)
Country | Link |
---|---|
EP (2) | EP0237255A3 (ko) |
JP (1) | JPS62207320A (ko) |
KR (1) | KR940001716B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100557610B1 (ko) * | 1999-10-11 | 2006-03-10 | 주식회사 하이닉스반도체 | 신규한 포토레지스트 단량체, 그의 중합체 및 이를 함유하는 포토레지스트 조성물 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH064814B2 (ja) * | 1986-03-19 | 1994-01-19 | 東芝ケミカル株式会社 | 半導体ペレット搭載用ペースト |
JPH02298510A (ja) * | 1989-05-12 | 1990-12-10 | Daicel Chem Ind Ltd | エポキシ化合物 |
DE4330684A1 (de) * | 1993-09-10 | 1995-03-16 | Ruetgerswerke Ag | Härtbare Bindemittel |
US5618891A (en) * | 1995-03-29 | 1997-04-08 | General Electric Co. | Solventless resin composition having minimal reactivity at room temperature |
WO1998031750A1 (en) * | 1997-01-21 | 1998-07-23 | The Dow Chemical Company | Latent catalysts for epoxy curing systems |
US6613839B1 (en) | 1997-01-21 | 2003-09-02 | The Dow Chemical Company | Polyepoxide, catalyst/cure inhibitor complex and anhydride |
US6350840B1 (en) * | 1998-07-02 | 2002-02-26 | National Starch And Chemical Investment Holding Corporation | Underfill encapsulants prepared from allylated amide compounds |
TW200303439A (en) | 2002-02-04 | 2003-09-01 | Mitsui Chemicals Inc | Method for producing liquid crystal display cell and sealing agent for liquid crystal display cell |
JP4451214B2 (ja) | 2004-05-21 | 2010-04-14 | シャープ株式会社 | 半導体装置 |
JP6507506B2 (ja) * | 2014-07-16 | 2019-05-08 | 住友ベークライト株式会社 | 封止用樹脂組成物及び半導体装置 |
CN110330648B (zh) * | 2019-07-30 | 2021-06-18 | 苏州大学 | 可重塑双马来酰亚胺树脂用预聚体及其应用 |
CN110330649B (zh) * | 2019-07-30 | 2021-04-27 | 苏州大学 | 可重塑双马来酰亚胺树脂及其应用 |
CN110330647B (zh) * | 2019-07-30 | 2021-06-18 | 苏州大学 | 可重塑形状记忆双马来酰亚胺树脂及其应用 |
CN110330650B (zh) * | 2019-07-30 | 2021-07-09 | 苏州大学 | 双马来酰亚胺树脂预聚体及其应用 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB904549A (en) * | 1959-05-06 | 1962-08-29 | British Celanese | Preparation of epoxy ethers and formation of cured resinous products therefrom |
US4273916A (en) * | 1979-02-14 | 1981-06-16 | Trw Inc. | Curable cycloaliphatic epoxy-polyimide compositions |
JPS5949225A (ja) * | 1982-09-16 | 1984-03-21 | Hitachi Ltd | 耐熱性難燃性樹脂組成物 |
JPS60170620A (ja) * | 1984-02-16 | 1985-09-04 | Daicel Chem Ind Ltd | 新規なエポキシ樹脂組成物 |
US4565859A (en) * | 1984-01-30 | 1986-01-21 | Daicel Chemical Industries, Ltd. | Polyether compounds, epoxy resins, epoxy resin compositions, and processes for production thereof |
JPS61197621A (ja) * | 1985-02-27 | 1986-09-01 | Daicel Chem Ind Ltd | 封止剤 |
JPS61233012A (ja) * | 1985-04-10 | 1986-10-17 | Daicel Chem Ind Ltd | 繊維強化プラスチツクス |
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1986
- 1986-03-07 JP JP61048348A patent/JPS62207320A/ja active Granted
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1987
- 1987-02-26 KR KR1019870001666A patent/KR940001716B1/ko not_active IP Right Cessation
- 1987-03-03 EP EP87301854A patent/EP0237255A3/en not_active Withdrawn
- 1987-03-03 EP EP19920201125 patent/EP0503744A3/en not_active Ceased
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100557610B1 (ko) * | 1999-10-11 | 2006-03-10 | 주식회사 하이닉스반도체 | 신규한 포토레지스트 단량체, 그의 중합체 및 이를 함유하는 포토레지스트 조성물 |
Also Published As
Publication number | Publication date |
---|---|
JPS62207320A (ja) | 1987-09-11 |
EP0503744A2 (en) | 1992-09-16 |
EP0237255A2 (en) | 1987-09-16 |
JPH045041B2 (ko) | 1992-01-30 |
KR940001716B1 (ko) | 1994-03-05 |
EP0503744A3 (en) | 1992-12-09 |
EP0237255A3 (en) | 1990-05-30 |
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