KR870008949A - 경화성수지조성물 및 이 조성물로 피복 및 밀봉한 반도체 장치 - Google Patents

경화성수지조성물 및 이 조성물로 피복 및 밀봉한 반도체 장치 Download PDF

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KR870008949A
KR870008949A KR870001666A KR870001666A KR870008949A KR 870008949 A KR870008949 A KR 870008949A KR 870001666 A KR870001666 A KR 870001666A KR 870001666 A KR870001666 A KR 870001666A KR 870008949 A KR870008949 A KR 870008949A
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resin composition
crosslinking agent
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아끼오 니시까와
도오루 고야마
지까시 간노
노부오 시바다
모또요 와지마
리쯔로 디다
도시가즈 나라하라
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미다 가쓰시게
가부시기 가이샤 히다찌 세이사꾸쇼
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Abstract

내용 없음

Description

경화성수지조성물 및 이 조성물로 피복 및 밀봉한 반도체 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1도는 본 발명에 따른 반도체장치 일부분의 단면도를 나타낸 것이다.
도면의 주요부분에 대한 부호의 설명
10:실리콘 반도체 기관 12:SiO2절연층 14:제1알루미늄배선층 16:제1보호피막 18:제2알루미늄배선층 20:제2보호피막

Claims (6)

  1. 다음 일반식(I)로 표시되는 적어도 지환족 에테르올리고머와 다음 일반식(II)로 표시되는 페놀성수지, 다음 일반식(III)으로 표시되는 p-히드록실스티렌 폴리머 또는 코폴리머, 적어도 하나의 N-치환된 말레이미드 결합을 가진 화합물 또는 이의 디일스-알더 부가물, 적어도 하나의 알릴 또는 프로페틸그룹과 적어도 하나의 히드록실 그룹을 가진 화합물 및 2,4-디아미노-6-비닐-s-트리아진으로 구성된 그룹에서 선택된 가교제로 이루어진 것을 특징으로 하는 경화성수지조성물.
    상기 식에서,
    m 및 n은 각기 0 내지 30이고,
    2<m+n≤30이며,
    X1및 X2는 같거나 서로 다르고, 각기 H, CH3, C(CH3)3, OH, NH2, COOH, SH, SO3H, CH2OH, Br, Cl,
    (여기에서, R1및 R2는 H, CH3또는 CF3이다)이고,
    p 및 q는 각기 0 내지 10이고,
    1<p+q≤10이며,
    Y는 H, NH2, SO3H, Rr 또는 Cl이고
    r은 5 내지 300이다.
  2. 제 1항에 있어서, 일반식(II)로 표시되는 페놀성수지의 가교제가 페놀, o-크레졸, 비페놀, 비스페놀 F, 비스페놀 A 또는 트리플루오로메틸비스페놀 A를 포름알데히드와 염산 또는 옥살산과 같은 산촉매 존재하에 축합하여 제조된 적어도 하나의 축합물인 경화성 수지 조성물.
  3. 제 1항에 있어서, 일반식(III)으로 표시되는 p-히드록실스티렌폴리머 또는 코폴리머의 가교제가 p-히드록실스티렌 폴리머, 4-히드록시-4'-비페닐비닐 폴리머 및 p-히드록실스티렌 또는 4-히드록시-4'-비페닐비닐과 스티렌, 말레산, 브타디엔 및 말레이미드와의 코폴리머로 구성된 그룹에서 선택된 적어도 하나인 경화성 수지 조성물.
  4. 제 1항에 있어서, 적어도 하나의 N-치환된 말레이미드 결합을 가진 화합물 또는 이의 디일스-알더 부가물의 가교제가 N-치환된 페닐말레이미드 및 다음 구조식으로 표시되는 화합물에서 선택된 적어도 하나인 것인 경화성 수지 조성물.
    상기 식에서,
    R는 알킬렌 또는 아릴렌 그룹 또는 이들로 치환된 2가 유기그룹이다.
  5. 제 1항에 있어서, 적어도 하나의 알릴 또는 프로페닐그룹과 적어도 하나의 히드록실그룹을 가진 화합물의 가교제가 다음 구조식을 가진 그룹에서 선택된 적어도 하나인 것인 경화성수지 조성물.
    상기 식에서,
    ―X―는 이소프로필렌 또는 메틸렌 그룹, ―O―또는 어느 그룹도 아니다.
  6. 다음 일반식(I)로 표시되는 적어도 지환족 에테르올리고머와 다음 일반식(II)로 표시되는 페놀성 수지, 다음 일반식(III)으로 표시되는 p-히드록실스티렌 폴리머 또는 코폴리머, 적어도 하나의 N-치환된 말레이미드결합을 가진 화합물 또는 이의 디일스-알더 부가물, 적어도 하나의 알릴 또는 프로페닐 그룹 및 적어도 하나의 히드록실그룹을 가진 화합물 및 2,4-디아미노-6-비닐-s-트리아진으로 구성된 그룹에서 선택된 가교제로 이루어진 열경화성수지 조성물로 반도체 소자 및 리드배선의 적어도 일부분을 피복 및 밀봉하여 얻는 반도체장치.
    상기 식에서,
    m 및 n은 각기 0 내지 30이고,
    2<m+≤30이며,
    X1및 X2는 같거나 서로 다르고, 각기 H, CH3, C(CH3)3, OH, NH2, COOH, SH, SO3H, CH2OH, Br, Cl,
    (여기에서, R1및 R2는 H, CH3또는 CF3이다)이고,
    P 및 q는 각기 0 내지 10이고,
    1<P+q≤10이며,
    Y는 H, NH2, SO3H, Br 또는 Cl이고,
    r은 5 내지 300이다.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870001666A 1986-03-07 1987-02-26 경화성 수지조성물 및 이 조성물로 피복 및 밀봉한 반도체장치 KR940001716B1 (ko)

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JP61048348A JPS62207320A (ja) 1986-03-07 1986-03-07 熱硬化性樹脂組成物で封止してなる半導体装置
JP61-48348 1986-03-07
JP48348 1986-03-07

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KR940001716B1 KR940001716B1 (ko) 1994-03-05

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100557610B1 (ko) * 1999-10-11 2006-03-10 주식회사 하이닉스반도체 신규한 포토레지스트 단량체, 그의 중합체 및 이를 함유하는 포토레지스트 조성물

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH064814B2 (ja) * 1986-03-19 1994-01-19 東芝ケミカル株式会社 半導体ペレット搭載用ペースト
JPH02298510A (ja) * 1989-05-12 1990-12-10 Daicel Chem Ind Ltd エポキシ化合物
DE4330684A1 (de) * 1993-09-10 1995-03-16 Ruetgerswerke Ag Härtbare Bindemittel
US5618891A (en) * 1995-03-29 1997-04-08 General Electric Co. Solventless resin composition having minimal reactivity at room temperature
WO1998031750A1 (en) * 1997-01-21 1998-07-23 The Dow Chemical Company Latent catalysts for epoxy curing systems
US6613839B1 (en) 1997-01-21 2003-09-02 The Dow Chemical Company Polyepoxide, catalyst/cure inhibitor complex and anhydride
US6350840B1 (en) * 1998-07-02 2002-02-26 National Starch And Chemical Investment Holding Corporation Underfill encapsulants prepared from allylated amide compounds
TW200303439A (en) 2002-02-04 2003-09-01 Mitsui Chemicals Inc Method for producing liquid crystal display cell and sealing agent for liquid crystal display cell
JP4451214B2 (ja) 2004-05-21 2010-04-14 シャープ株式会社 半導体装置
JP6507506B2 (ja) * 2014-07-16 2019-05-08 住友ベークライト株式会社 封止用樹脂組成物及び半導体装置
CN110330648B (zh) * 2019-07-30 2021-06-18 苏州大学 可重塑双马来酰亚胺树脂用预聚体及其应用
CN110330649B (zh) * 2019-07-30 2021-04-27 苏州大学 可重塑双马来酰亚胺树脂及其应用
CN110330647B (zh) * 2019-07-30 2021-06-18 苏州大学 可重塑形状记忆双马来酰亚胺树脂及其应用
CN110330650B (zh) * 2019-07-30 2021-07-09 苏州大学 双马来酰亚胺树脂预聚体及其应用

Family Cites Families (7)

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GB904549A (en) * 1959-05-06 1962-08-29 British Celanese Preparation of epoxy ethers and formation of cured resinous products therefrom
US4273916A (en) * 1979-02-14 1981-06-16 Trw Inc. Curable cycloaliphatic epoxy-polyimide compositions
JPS5949225A (ja) * 1982-09-16 1984-03-21 Hitachi Ltd 耐熱性難燃性樹脂組成物
JPS60170620A (ja) * 1984-02-16 1985-09-04 Daicel Chem Ind Ltd 新規なエポキシ樹脂組成物
US4565859A (en) * 1984-01-30 1986-01-21 Daicel Chemical Industries, Ltd. Polyether compounds, epoxy resins, epoxy resin compositions, and processes for production thereof
JPS61197621A (ja) * 1985-02-27 1986-09-01 Daicel Chem Ind Ltd 封止剤
JPS61233012A (ja) * 1985-04-10 1986-10-17 Daicel Chem Ind Ltd 繊維強化プラスチツクス

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100557610B1 (ko) * 1999-10-11 2006-03-10 주식회사 하이닉스반도체 신규한 포토레지스트 단량체, 그의 중합체 및 이를 함유하는 포토레지스트 조성물

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JPS62207320A (ja) 1987-09-11
EP0503744A2 (en) 1992-09-16
EP0237255A2 (en) 1987-09-16
JPH045041B2 (ko) 1992-01-30
KR940001716B1 (ko) 1994-03-05
EP0503744A3 (en) 1992-12-09
EP0237255A3 (en) 1990-05-30

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