KR970030899A - 반도체 장치 - Google Patents
반도체 장치 Download PDFInfo
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- KR970030899A KR970030899A KR1019960052061A KR19960052061A KR970030899A KR 970030899 A KR970030899 A KR 970030899A KR 1019960052061 A KR1019960052061 A KR 1019960052061A KR 19960052061 A KR19960052061 A KR 19960052061A KR 970030899 A KR970030899 A KR 970030899A
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- layer
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- electron supply
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 7
- 239000000758 substrate Substances 0.000 claims abstract 4
- 239000000969 carrier Substances 0.000 claims abstract 2
- 239000012535 impurity Substances 0.000 claims abstract 2
- 238000005253 cladding Methods 0.000 claims 3
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/201—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds, e.g. alloys
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- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7782—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET
- H01L29/7783—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET using III-V semiconductor material
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- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
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- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
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- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
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- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/223—Buried stripe structure
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- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/223—Buried stripe structure
- H01S5/2231—Buried stripe structure with inner confining structure only between the active layer and the upper electrode
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- H01S5/3211—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures characterised by special cladding layers, e.g. details on band-discontinuities
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- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
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- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
- H01S5/32333—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm based on InGaAsP
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- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
- H01S5/32341—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP
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- H01S5/00—Semiconductor lasers
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- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/3235—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength longer than 1000 nm, e.g. InP-based 1300 nm and 1500 nm lasers
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- H01S5/00—Semiconductor lasers
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- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34313—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer having only As as V-compound, e.g. AlGaAs, InGaAs
- H01S5/3432—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer having only As as V-compound, e.g. AlGaAs, InGaAs the whole junction comprising only (AI)GaAs
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Abstract
반도체 장치는 InP기판과; 캐리어인 전자가 주행하는 채널층과; 채널층에 공급하는 Alx1Ga1-x1Asy1Pz1Sb1-y1-z1(0≤x1≤1, 0≤y1≤1, 0≤z1≤1) 전자공급층을 포함한다.
상기 전자공급층은 상기 채널층보다 작은 전자 친화력을 가지며, n형 불순물로 도핑되어 있다.
n형 AlGaAsPSb는 열적으로 안전하기 때문에, 그것의 전기적 특성은 350℃ 정도의 열처리에 의해서 변화되지 않아, 열적으로 안정되고, 제조공정중에 있더라도, 또한 동작중에 있더라도, 그 특성이 시간의 경과에 따라 거의 변화하지 않는 높은 신뢰성을 가지는 HEMT를 실현할 수 있다.
또한, 원하는 밴드구조를 가지는 전자공급층과 채널층으로 이루어지는 헤테로 구조를 높은 자유도를 기초로, 용이하게 형성할 수 있어, 디바이스설계의 자유도를 비약적으로 확대시킬 수 있다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 실시예1에 의한 반도체 장치(HEMT)를 나타낸 단면도.
Claims (3)
- 반도체 기판과; 반도체 기판상에 배치된 AlxGa1-xAsyPzSb1-y-z(0≤x≤1, 0≤y≤1, 0≤z≤1)층을 구비한 것을 특징으로 하는 반도체 장치.
- 격자정수를 가지는 InP기판과; 전자 친화력을 가지며, 캐리어인 전자가 주행하는 채널층과; 상기 채널층에 전자를 공급하는 Alx1Ga1-x1Asy1Pz1Sb1-y1-z1(0≤x1≤1, 0≤y1≤1, 0≤z1≤1) 전자공급층을 구비하고, 상기 전자공급층은 상기 채널층의 전자 친화력보다 작은 전자 친화력을 가지며, n형 불순물로 도핑되어 있는 것을 특징으로 하는 반도체 장치.
- 레이저광을 발진하고, 에너지밴드갭을 가지는 활성층과; 이 활성층의 에너지밴드갭보다 에너지밴드갭이 큰 제1도전형의 Alx5Ga1-x5Asy5Pz5Sb1-y5-z5(0≤x5≤1, 0≤y5≤1, 0≤z5≤1) 하부클래드층과, 이 활성층의 에너지밴드갭보다 에너지밴드갭이 큰 상기 제1도전형과는 반대의 제2도전형의 Alx6Ga1-x6Asy6Pz6Sb1-y6-z6(0≤x6≤1, 0≤y6≤1, 0≤z6≤1) 상부클래드층을 구비하고, 상기 상하부클래드층의 사이에 활성층을 삽입하는 것을 특징으로 하는 반도체 레이저 장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP7287273A JPH09129865A (ja) | 1995-11-06 | 1995-11-06 | 半導体装置 |
JP95-287273 | 1995-11-06 |
Publications (1)
Publication Number | Publication Date |
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KR970030899A true KR970030899A (ko) | 1997-06-26 |
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Application Number | Title | Priority Date | Filing Date |
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KR1019960052061A KR970030899A (ko) | 1995-11-06 | 1996-11-05 | 반도체 장치 |
Country Status (5)
Country | Link |
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US (1) | US5729030A (ko) |
EP (1) | EP0772243A1 (ko) |
JP (1) | JPH09129865A (ko) |
KR (1) | KR970030899A (ko) |
TW (1) | TW310479B (ko) |
Families Citing this family (14)
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JPS6261113A (ja) * | 1985-09-11 | 1987-03-17 | Toshiba Corp | マイクロコンピユ−タの初期化方法及びその装置 |
JP2003140100A (ja) * | 2001-11-01 | 2003-05-14 | Oki Electric Ind Co Ltd | 導波路型光素子、これを用いた集積化光導波路素子、及びその製造方法 |
KR100438895B1 (ko) * | 2001-12-28 | 2004-07-02 | 한국전자통신연구원 | 고전자 이동도 트랜지스터 전력 소자 및 그 제조 방법 |
US7045404B2 (en) * | 2004-01-16 | 2006-05-16 | Cree, Inc. | Nitride-based transistors with a protective layer and a low-damage recess and methods of fabrication thereof |
JP2006173571A (ja) * | 2004-12-14 | 2006-06-29 | Korea Electronics Telecommun | 半導体素子のトランジスタ及びその製造方法 |
US20070170517A1 (en) * | 2006-01-26 | 2007-07-26 | International Business Machines Corporation | CMOS devices adapted to reduce latchup and methods of manufacturing the same |
US20080054300A1 (en) * | 2006-06-30 | 2008-03-06 | Philip Gene Nikkel | Body contact structure and method for the reduction of drain lag and gate lag in field effect transistors |
JP5186661B2 (ja) * | 2007-09-28 | 2013-04-17 | 富士通株式会社 | 化合物半導体装置 |
JP4944813B2 (ja) * | 2008-02-21 | 2012-06-06 | 日本電信電話株式会社 | 半導体光増幅器 |
US20140198817A1 (en) * | 2013-01-14 | 2014-07-17 | Finisar Corporation | Lasers With InGaAsP Quantum Wells And GaAsP Barrier Layers |
JP6331375B2 (ja) * | 2013-12-17 | 2018-05-30 | 富士通株式会社 | 電界効果型半導体装置 |
JP6233090B2 (ja) * | 2014-02-21 | 2017-11-22 | 富士通株式会社 | 半導体装置 |
JP2016146406A (ja) * | 2015-02-06 | 2016-08-12 | 古河電気工業株式会社 | 半導体発光素子および半導体発光素子アレイ |
JP6814965B2 (ja) * | 2017-03-06 | 2021-01-20 | パナソニックIpマネジメント株式会社 | 半導体エピタキシャルウェハ、半導体素子、および半導体素子の製造方法 |
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US3979271A (en) * | 1973-07-23 | 1976-09-07 | Westinghouse Electric Corporation | Deposition of solid semiconductor compositions and novel semiconductor materials |
JPS5626484A (en) * | 1979-08-13 | 1981-03-14 | Nippon Telegr & Teleph Corp <Ntt> | Semiconductor light source |
JPS5726492A (en) * | 1980-07-24 | 1982-02-12 | Nec Corp | Semiconductor laser |
JPS5853863A (ja) * | 1981-09-26 | 1983-03-30 | Fujitsu Ltd | 半導体装置の製造方法 |
JPH0654786B2 (ja) * | 1984-12-27 | 1994-07-20 | 住友電気工業株式会社 | ヘテロ接合半導体デバイス |
JPH025438A (ja) * | 1988-06-22 | 1990-01-10 | Fujitsu Ltd | 絶縁ゲート型電界効果トランジスタ |
JPH0388340A (ja) * | 1989-08-31 | 1991-04-12 | Fujitsu Ltd | 高電子移動度トランジスタ |
EP0531550B1 (en) * | 1991-03-28 | 1997-12-29 | Asahi Kasei Kogyo Kabushiki Kaisha | Field effect transistor |
US5663583A (en) * | 1995-06-06 | 1997-09-02 | Hughes Aircraft Company | Low-noise and power ALGaPSb/GaInAs HEMTs and pseudomorpohic HEMTs on GaAs substrate |
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1995
- 1995-11-06 JP JP7287273A patent/JPH09129865A/ja active Pending
-
1996
- 1996-01-18 TW TW085100573A patent/TW310479B/zh active
- 1996-05-24 US US08/653,245 patent/US5729030A/en not_active Expired - Fee Related
- 1996-07-25 EP EP96112025A patent/EP0772243A1/en not_active Withdrawn
- 1996-11-05 KR KR1019960052061A patent/KR970030899A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
TW310479B (ko) | 1997-07-11 |
JPH09129865A (ja) | 1997-05-16 |
EP0772243A1 (en) | 1997-05-07 |
US5729030A (en) | 1998-03-17 |
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A201 | Request for examination | ||
WITB | Written withdrawal of application |