KR960034344A - 전자부품용 접착테이프 - Google Patents
전자부품용 접착테이프 Download PDFInfo
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- KR960034344A KR960034344A KR1019960009313A KR19960009313A KR960034344A KR 960034344 A KR960034344 A KR 960034344A KR 1019960009313 A KR1019960009313 A KR 1019960009313A KR 19960009313 A KR19960009313 A KR 19960009313A KR 960034344 A KR960034344 A KR 960034344A
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- 239000002390 adhesive tape Substances 0.000 title claims abstract 6
- 239000010410 layer Substances 0.000 claims abstract 17
- 239000012790 adhesive layer Substances 0.000 claims abstract 13
- 150000001875 compounds Chemical class 0.000 claims abstract 13
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 claims abstract 8
- 125000003277 amino group Chemical group 0.000 claims abstract 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims abstract 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims 4
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 125000002723 alicyclic group Chemical group 0.000 claims 2
- 125000001931 aliphatic group Chemical group 0.000 claims 2
- 125000003118 aryl group Chemical group 0.000 claims 2
- 229920001577 copolymer Polymers 0.000 claims 2
- -1 diamine compound Chemical class 0.000 claims 2
- 239000000945 filler Substances 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 229920000459 Nitrile rubber Polymers 0.000 abstract 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
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- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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- H01L2224/4826—Connecting between the body and an opposite side of the item with respect to the body
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- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73215—Layer and wire connectors
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- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/14—Layer or component removable to expose adhesive
- Y10T428/1452—Polymer derived only from ethylenically unsaturated monomer
- Y10T428/1457—Silicon
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- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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- Y10T428/14—Layer or component removable to expose adhesive
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- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
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Abstract
본 발명은, 비교적 저온으로 접착, 경화할 수 있으며, 충분한 내열성, 신뢰성 등을 가지는 전자부품용 접착 테이프를 제공한다.
본 발명의 전자부품용 접착 테이프는 테이프 박리성 필름의 한면에 (a) 중량 평균 분자량 10,000 내지 200,000 아크릴로니트릴 함유율 5 내지 50중량%, 아미노기 당량 500 내지 10,000인 하기 일반식(I)의 표시되는 피페라디닐에틸아마노카르보닐기 함유 부타디엔-아크릴로니트릴 공중합체와,
(식중 k, m 및 n은 몰비로서, n=1에 대하여 k=3 내지 175, m=0.3 내지 93이다) (b) 2개 이상의 말레이미드기를 함유하는 화합물을 주성분으로 하는 접착층을 적층하여 이루어지고, 이 접착층에 B단계까지 경화된 것으로서, 서로 다른 경화도를 가진 2개 이상의 반경화층으로 구성된다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (10)
- 박리성 필름의 한면에, (a) 중량 평균 분자량 10,000 내지 200,000, 아크릴로니트릴 함유율 5 내지 50중량%, 아미노기 당량 500 내지 10,000인 하기 일반식(I)으로 표시되는 피페라디닐에틸아미노카르보닐기 함유 부타디엔-아크릴로니트릴 공중합체와,(식중, k, m 및 n은 몰비로서, n=1에 대하여, k=3 내지 175, m=0.3 내지 93인 범위의 수를 나타냄.) (b) 하기식(II-1) 내지 식(II-6)으로 표시되는 화합물에서 선택된 2개 이상의 말레이미드기를 함유하는 화합물을 함유하고,(식중, p는 0 내지 7의 정수를 의미함.)(식중, MI=말레이미드기, R=H 또는 CH3r=1 내지 5)성분 (a) 100중량부에 대하여, 성분(b)는 10 내지 900 중량부인 접착층을 적층하여 이루어지고, 그 접착층이 B단계까지 경화된 것으로서, 서로 다른 경화도를 가지는 2이상의 반경화층으로 이루어진 것을 특징으로 하는 전자부품용 접착 테이프.
- 제1항에 있어서, 접착층의 표면에 추가로 박리성 필름이 설치된 것을 특징으로 하는 전자부품용 접착테이프.
- 제1항에 있어서, 접착층에 입경 1㎛ 이하의 충진재가 4 내지 40중량% 함유된 것을 특징으로 하는 전자부품용 접착 테이프.
- 제1항에 있어서, B단계 상태로 경화된 접착층이, 슬라이드 속도 0.01 내지 0.3㎛/sec인 고경화도의 반경화층과, 슬라이드 속도 0.1 내지 10.0㎛/sec인 저경화도의 반경화층으로 이루어지며, 또한 고경화도의 반경화층의 슬라이드 속도(V1)와 저경화도의 반경화층의 슬라이드 속도(V2) 가, V2V1의 관계를 가지는 것을 특징으로 하는 전자부품용 접착 테이프.
- 제1항에 있어서, B단계까지 경하된 접착층이 슬라이드 속도가 0.1 내지 10.0㎛/sec인 저경화도의 제1의 반경화층, 슬라이드 속도 0.3㎛/sec이하의 고경화도의 반경화층 및 슬라이드 속도 0.1 내지 10.0㎛/sec인 저경화도의 제2의 반경화층을 순차 적층하여 이루어지며, 또한 고경화도의 반경화층의 슬라이드 속도(V3)와 저경화도의 제1의 반경화층의 슬라이드 속도(V4)및 제2의 반경화층의 슬라이드 속도(V5) 가 V4V3및 V5V3의 관계를 가지는 것을 특징으로 하는 전자부품용 접착 테이프.
- 박리성 필름의 한면에, (a) 중량 평균 분자량 10,000 내지 200,000, 아크릴로니트릴 함유율 5 내지 50중량%, 아미노기당량 500 내지 10,000인 하기 일반식(I)으로 표시되는 피페라디닐에틸아미노카르보닐기 함유 부타디엔-아크릴로니트릴 공중합체,(식중, k, m 및 n은 몰비로서, n=1에 대하여, k=3 내지 175, m=0.3 내지 93인 범위의 수를 나타냄.) (b) 하기식(II-1) 내지 식(II-6)으로 표시되는 화합물에서 선택된 2개 이상의 말레이미드기를 함유하는 화합물.(식중, p는 0 내지 7의 정수를 의미함.)(식중, MI=말레이미드기, R=H 또는 CH3r=1 내지 5)및 (c) 하기 일반식(III)으로 표시되는 디아민 화합물H2N-R1-NH2(Ⅲ)(식중, R1은 2가의 지방족기, 방향족기 또는 지환식기를 나타냄) 또는 중량 평균 분자량 200 내지 7,000의 하기 일반식(IV)으로 표시되는 아미노기 함유 폴리실록산 화합물을 함유하고(식중, R2는 2가의 지방족기, 방향족기 또는 지환식기를 나타내며, s는 0 내지 7의 정수를 의미함); 성분 (a) 100중량부에 대하여, 성분 (b)와 성분(c)의 총합이 10 내지 900중량부이며, 성분 (c)의 마이노기 1몰 당량에 대한 성분 (b)의 말레이미드기가 1 내지 100몰 당량인 접착층을 적층하여 이루어지며, 그 접착층이 B 단계 상태로 경화된 것으로써, 서로 다른 경화도를 가진 2 이상의 반경화층으로 이루어진 것을 (식중, k, m 및 n은 몰비로서, n=1에 대하여, k=3 내지 175, m=0.3 내지 93인 범위의 수를 나타냄.) (b) 하기식(II-1) 내지 식(II-6)으로 표시되는 화합물에서 선택된 2개 이상의 말레이미드기를 함유하는 화합물
- 제6항에 있어서, 접착층의 표면에, 추가로 박리성 필름이 설치된 것을 (식중, k, m 및 n은 몰비로서, n=1에 대하여, k=3 내지 175, m=0.3 내지 93인 범위의 수를 나타냄.) (b) 하기식(II-1) 내지 식(II-6)으로 표시되는 화합물에서 선택된 2개 이상의 말레이미드기를 함유하는 화합물
- 제6항에 있어서, 접착층이 입경 1㎛ 이하의 충진재가 4 내지 40중량% 함유되어 있는 것을 (식중, k, m 및 n은 몰비로서, n=1에 대하여, k=3 내지 175, m=0.3 내지 93인 범위의 수를 나타냄.) (b) 하기식(II-1) 내지 식(II-6)으로 표시되는 화합물에서 선택된 2개 이상의 말레이미드기를 함유하는 화합물
- 제6항에 있어서, B단계 상태로 경화된 접착층이, 슬라이드 속도 0.01 내지 0.3㎛/sec인 고경화도의 반경화층과, 슬라이드 속도 0.1 내지 10.0㎛/sec인 저경화도의 반경화층으로 이루어지고, 또한 고경화도의 반경화층의 슬라이드 속도(V1)와 저경화도의 반경화층의 슬라이드 속도(V2)가 V2V1의 관계를 가진 것을 (식중, k, m 및 n은 몰비로서, n=1에 대하여, k=3 내지 175, m=0.3 내지 93인 범위의 수를 나타냄.) (b) 하기식(II-1) 내지 식(II-6)으로 표시되는 화합물에서 선택된 2개 이상의 말레이미드기를 함유하는 화합물
- 제6항에 있어서, B단계까지 경화된 접착층이, 슬라이드 속도가 0.1 내지 10.0㎛/sec인 저경화도의 제1의 반경화층, 슬라이드 속도 0.3㎛/sec이하의 고경화도의 반경화층 및 슬라이드 속도 0.1 내지 10.0㎛/sec인 저경화도이 제2의 반경화층을 순차 적응하여 이루어지고, 또한 고경화도의 반경화층의 슬라이드 속도(V1)와 저경화도의 제1의 반경화층의 슬라이드 속도(V4)및 제2의 반경화층의 슬라이드 속도(V5)가 V4V3및 V5V3의 관계를 가진 것을 (식중, k, m 및 n은 몰비로서, n=1에 대하여, k=3 내지 175, m=0.3 내지 93인 범위의 수를 나타냄.) (b) 하기식(II-1) 내지 식(II-6)으로 표시되는 화합물에서 선택된 2개 이상의 말레이미드기를 함유하는 화합물.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
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JP7095917A JP2896751B2 (ja) | 1995-03-30 | 1995-03-30 | 電子部品用接着テープ |
JP95-95917 | 1995-03-30 |
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KR100642678B1 (ko) * | 2004-07-13 | 2006-11-10 | 가부시키가이샤 도모에가와 세이시쇼 | 전자부품용 접착테이프 및 전자부품 |
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JP2001131501A (ja) * | 1999-11-04 | 2001-05-15 | Hitachi Chem Co Ltd | 三層接着フィルム、半導体チップ搭載用基板及び半導体装置 |
JP2001152107A (ja) * | 1999-11-25 | 2001-06-05 | Hitachi Chem Co Ltd | 積層接着フィルム、半導体チップ搭載用基板及び半導体装置 |
DE112004002845T5 (de) * | 2004-05-13 | 2007-03-08 | The Yokohama Rubber Co., Ltd. | Kautschuk mit endständigem Maleinimid und härtbare Zusammensetzungen, hergestellt unter Verwendung des Kautschuks mit endständigem Maleinimid |
US8105880B2 (en) | 2007-12-05 | 2012-01-31 | Analog Devices, Inc. | Method for attaching a semiconductor die to a leadframe, and a semiconductor device |
JP5110441B2 (ja) | 2008-01-15 | 2012-12-26 | 大日本印刷株式会社 | 半導体装置用配線部材、半導体装置用複合配線部材、および樹脂封止型半導体装置 |
TWI501371B (zh) * | 2009-01-13 | 2015-09-21 | Dainippon Printing Co Ltd | A wiring member for a semiconductor device, a composite wiring member for a semiconductor device, and a resin-sealed type semiconductor device |
US8906258B2 (en) | 2011-08-29 | 2014-12-09 | Ticona Llc | Heat-resistant liquid crystalline polymer composition having a low melting temperature |
CN103764741B (zh) | 2011-08-29 | 2015-09-23 | 提克纳有限责任公司 | 低熔体粘度液晶聚合物的熔融聚合 |
US9074133B2 (en) | 2011-08-29 | 2015-07-07 | Ticona Llc | Thermotropic liquid crystalline polymer with improved low shear viscosity |
WO2013032981A1 (en) | 2011-08-29 | 2013-03-07 | Ticona Llc | High flow liquid crystalline polymer composition |
JP2014525498A (ja) | 2011-08-29 | 2014-09-29 | ティコナ・エルエルシー | 高流動性液晶ポリマー組成物 |
WO2013032971A1 (en) | 2011-08-29 | 2013-03-07 | Ticona Llc | Melt-extruded substrate for use in thermoformed articles |
TW201313884A (zh) | 2011-08-29 | 2013-04-01 | Ticona Llc | 液晶聚合物之固態聚合 |
US9045685B2 (en) | 2011-08-29 | 2015-06-02 | Ticona Llc | Cast molded parts formed from a liquid crystalline polymer |
CN103764623B (zh) | 2011-08-29 | 2016-04-27 | 提克纳有限责任公司 | 芳族酰胺化合物 |
WO2014130275A2 (en) | 2013-02-22 | 2014-08-28 | Ticona Llc | High performance polymer composition with improved flow properties |
CN113912988A (zh) | 2013-06-07 | 2022-01-11 | 提克纳有限责任公司 | 高强度热致液晶聚合物 |
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JP2732020B2 (ja) * | 1993-10-22 | 1998-03-25 | 株式会社巴川製紙所 | 電子部品用接着テープおよび液状接着剤 |
JP3137518B2 (ja) * | 1993-10-29 | 2001-02-26 | 株式会社巴川製紙所 | 電子部品用液状接着剤およびそれを用いる絶縁接着層の形成方法 |
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US5609956A (en) | 1997-03-11 |
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