KR960034344A - 전자부품용 접착테이프 - Google Patents

전자부품용 접착테이프 Download PDF

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KR960034344A
KR960034344A KR1019960009313A KR19960009313A KR960034344A KR 960034344 A KR960034344 A KR 960034344A KR 1019960009313 A KR1019960009313 A KR 1019960009313A KR 19960009313 A KR19960009313 A KR 19960009313A KR 960034344 A KR960034344 A KR 960034344A
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유끼노로 사꾸모또
다께시 하시모또
다께시 니시가와
후미요시 야마나시
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호소까와 마사지로
가부시끼가이샤 도모에가와세이시쇼
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Abstract

본 발명은, 비교적 저온으로 접착, 경화할 수 있으며, 충분한 내열성, 신뢰성 등을 가지는 전자부품용 접착 테이프를 제공한다.
본 발명의 전자부품용 접착 테이프는 테이프 박리성 필름의 한면에 (a) 중량 평균 분자량 10,000 내지 200,000 아크릴로니트릴 함유율 5 내지 50중량%, 아미노기 당량 500 내지 10,000인 하기 일반식(I)의 표시되는 피페라디닐에틸아마노카르보닐기 함유 부타디엔-아크릴로니트릴 공중합체와,
(식중 k, m 및 n은 몰비로서, n=1에 대하여 k=3 내지 175, m=0.3 내지 93이다) (b) 2개 이상의 말레이미드기를 함유하는 화합물을 주성분으로 하는 접착층을 적층하여 이루어지고, 이 접착층에 B단계까지 경화된 것으로서, 서로 다른 경화도를 가진 2개 이상의 반경화층으로 구성된다.

Description

전자부품용 접착테이프
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (10)

  1. 박리성 필름의 한면에, (a) 중량 평균 분자량 10,000 내지 200,000, 아크릴로니트릴 함유율 5 내지 50중량%, 아미노기 당량 500 내지 10,000인 하기 일반식(I)으로 표시되는 피페라디닐에틸아미노카르보닐기 함유 부타디엔-아크릴로니트릴 공중합체와,
    (식중, k, m 및 n은 몰비로서, n=1에 대하여, k=3 내지 175, m=0.3 내지 93인 범위의 수를 나타냄.) (b) 하기식(II-1) 내지 식(II-6)으로 표시되는 화합물에서 선택된 2개 이상의 말레이미드기를 함유하는 화합물을 함유하고,
    (식중, p는 0 내지 7의 정수를 의미함.)
    (식중, MI=말레이미드기, R=H 또는 CH3r=1 내지 5)
    성분 (a) 100중량부에 대하여, 성분(b)는 10 내지 900 중량부인 접착층을 적층하여 이루어지고, 그 접착층이 B단계까지 경화된 것으로서, 서로 다른 경화도를 가지는 2이상의 반경화층으로 이루어진 것을 특징으로 하는 전자부품용 접착 테이프.
  2. 제1항에 있어서, 접착층의 표면에 추가로 박리성 필름이 설치된 것을 특징으로 하는 전자부품용 접착테이프.
  3. 제1항에 있어서, 접착층에 입경 1㎛ 이하의 충진재가 4 내지 40중량% 함유된 것을 특징으로 하는 전자부품용 접착 테이프.
  4. 제1항에 있어서, B단계 상태로 경화된 접착층이, 슬라이드 속도 0.01 내지 0.3㎛/sec인 고경화도의 반경화층과, 슬라이드 속도 0.1 내지 10.0㎛/sec인 저경화도의 반경화층으로 이루어지며, 또한 고경화도의 반경화층의 슬라이드 속도(V1)와 저경화도의 반경화층의 슬라이드 속도(V2) 가, V2V1의 관계를 가지는 것을 특징으로 하는 전자부품용 접착 테이프.
  5. 제1항에 있어서, B단계까지 경하된 접착층이 슬라이드 속도가 0.1 내지 10.0㎛/sec인 저경화도의 제1의 반경화층, 슬라이드 속도 0.3㎛/sec이하의 고경화도의 반경화층 및 슬라이드 속도 0.1 내지 10.0㎛/sec인 저경화도의 제2의 반경화층을 순차 적층하여 이루어지며, 또한 고경화도의 반경화층의 슬라이드 속도(V3)와 저경화도의 제1의 반경화층의 슬라이드 속도(V4)및 제2의 반경화층의 슬라이드 속도(V5) 가 V4V3및 V5V3의 관계를 가지는 것을 특징으로 하는 전자부품용 접착 테이프.
  6. 박리성 필름의 한면에, (a) 중량 평균 분자량 10,000 내지 200,000, 아크릴로니트릴 함유율 5 내지 50중량%, 아미노기당량 500 내지 10,000인 하기 일반식(I)으로 표시되는 피페라디닐에틸아미노카르보닐기 함유 부타디엔-아크릴로니트릴 공중합체,
    (식중, k, m 및 n은 몰비로서, n=1에 대하여, k=3 내지 175, m=0.3 내지 93인 범위의 수를 나타냄.) (b) 하기식(II-1) 내지 식(II-6)으로 표시되는 화합물에서 선택된 2개 이상의 말레이미드기를 함유하는 화합물.
    (식중, p는 0 내지 7의 정수를 의미함.)
    (식중, MI=말레이미드기, R=H 또는 CH3r=1 내지 5)및 (c) 하기 일반식(III)으로 표시되는 디아민 화합물
    H2N-R1-NH2(Ⅲ)
    (식중, R1은 2가의 지방족기, 방향족기 또는 지환식기를 나타냄) 또는 중량 평균 분자량 200 내지 7,000의 하기 일반식(IV)으로 표시되는 아미노기 함유 폴리실록산 화합물을 함유하고
    (식중, R2는 2가의 지방족기, 방향족기 또는 지환식기를 나타내며, s는 0 내지 7의 정수를 의미함); 성분 (a) 100중량부에 대하여, 성분 (b)와 성분(c)의 총합이 10 내지 900중량부이며, 성분 (c)의 마이노기 1몰 당량에 대한 성분 (b)의 말레이미드기가 1 내지 100몰 당량인 접착층을 적층하여 이루어지며, 그 접착층이 B 단계 상태로 경화된 것으로써, 서로 다른 경화도를 가진 2 이상의 반경화층으로 이루어진 것을 (식중, k, m 및 n은 몰비로서, n=1에 대하여, k=3 내지 175, m=0.3 내지 93인 범위의 수를 나타냄.) (b) 하기식(II-1) 내지 식(II-6)으로 표시되는 화합물에서 선택된 2개 이상의 말레이미드기를 함유하는 화합물
  7. 제6항에 있어서, 접착층의 표면에, 추가로 박리성 필름이 설치된 것을 (식중, k, m 및 n은 몰비로서, n=1에 대하여, k=3 내지 175, m=0.3 내지 93인 범위의 수를 나타냄.) (b) 하기식(II-1) 내지 식(II-6)으로 표시되는 화합물에서 선택된 2개 이상의 말레이미드기를 함유하는 화합물
  8. 제6항에 있어서, 접착층이 입경 1㎛ 이하의 충진재가 4 내지 40중량% 함유되어 있는 것을 (식중, k, m 및 n은 몰비로서, n=1에 대하여, k=3 내지 175, m=0.3 내지 93인 범위의 수를 나타냄.) (b) 하기식(II-1) 내지 식(II-6)으로 표시되는 화합물에서 선택된 2개 이상의 말레이미드기를 함유하는 화합물
  9. 제6항에 있어서, B단계 상태로 경화된 접착층이, 슬라이드 속도 0.01 내지 0.3㎛/sec인 고경화도의 반경화층과, 슬라이드 속도 0.1 내지 10.0㎛/sec인 저경화도의 반경화층으로 이루어지고, 또한 고경화도의 반경화층의 슬라이드 속도(V1)와 저경화도의 반경화층의 슬라이드 속도(V2)가 V2V1의 관계를 가진 것을 (식중, k, m 및 n은 몰비로서, n=1에 대하여, k=3 내지 175, m=0.3 내지 93인 범위의 수를 나타냄.) (b) 하기식(II-1) 내지 식(II-6)으로 표시되는 화합물에서 선택된 2개 이상의 말레이미드기를 함유하는 화합물
  10. 제6항에 있어서, B단계까지 경화된 접착층이, 슬라이드 속도가 0.1 내지 10.0㎛/sec인 저경화도의 제1의 반경화층, 슬라이드 속도 0.3㎛/sec이하의 고경화도의 반경화층 및 슬라이드 속도 0.1 내지 10.0㎛/sec인 저경화도이 제2의 반경화층을 순차 적응하여 이루어지고, 또한 고경화도의 반경화층의 슬라이드 속도(V1)와 저경화도의 제1의 반경화층의 슬라이드 속도(V4)및 제2의 반경화층의 슬라이드 속도(V5)가 V4V3및 V5V3의 관계를 가진 것을 (식중, k, m 및 n은 몰비로서, n=1에 대하여, k=3 내지 175, m=0.3 내지 93인 범위의 수를 나타냄.) (b) 하기식(II-1) 내지 식(II-6)으로 표시되는 화합물에서 선택된 2개 이상의 말레이미드기를 함유하는 화합물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960009313A 1995-03-30 1996-03-29 전자부품용 접착테이프 KR0150931B1 (ko)

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WO2013032971A1 (en) 2011-08-29 2013-03-07 Ticona Llc Melt-extruded substrate for use in thermoformed articles
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