KR950011574A - 전자 부품용 접착 테이프 및 액상 접착제 - Google Patents

전자 부품용 접착 테이프 및 액상 접착제 Download PDF

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KR950011574A
KR950011574A KR1019940027033A KR19940027033A KR950011574A KR 950011574 A KR950011574 A KR 950011574A KR 1019940027033 A KR1019940027033 A KR 1019940027033A KR 19940027033 A KR19940027033 A KR 19940027033A KR 950011574 A KR950011574 A KR 950011574A
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유끼노리 사꾸모또
다께시 하시모또
가쓰지 나까바
마사하루 고바야시
다께시 니시가야
후미요시 야마나시
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호소까와 마사지로오
가부시끼가이샤 도모에가와 세이시쇼
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Abstract

본 발명은 비교적 저온에서 경화가 가능하고 충분한 내열성 등을 갖는 전자 부품용 액상 접착제 및 이를 사용한 전자 부품용 접착 테이프를 제공한다.
본 발명의 액상 접착제는 (a) 중량 평균 분자량이 1,000∼50,000, 아크릴로니트릴 함유율이 5∼50중량%인 하기 식(I) :
(식 중, m=50∼95, n=5∼50)로 표시되는 양 말단에 피페라지닐에틸아미노카르보닐기를 갖는 부타디엔-아크릴로니트릴 공중합체, 및 (b) 2개 이상의 말레이미드기를 함유하는 화합물을 용해시켜 수득되며, 성분(a) 100중량부에 대하여 성분 (b)가 10-900중량부이다. 이를 내열성 필름의 한면 또는 양면에, 또는 박리성 필름의 한면에 도포하여 전자 부품용 접착 테이프를 수득한다.

Description

전자 부품용 접착 테이프 및 액상 접착제
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (10)

  1. 내열성 필름의 적어도 한 면에 (a) 중량 평균 분자량이 1,000∼50,000, 아크릴로니트릴 함유율이 5-50중량%인 하기 식 (I)
    (식 중, m= 50∼95, n= 5∼50)로 표시되는 양 말단에 피페라지닐에틸아미노카르보닐기를 갖는 부타디엔-아크릴로니트릴 공중합체, 및 (b) 하기 식(Ⅱ-1)∼(Ⅱ -6) :
    (식 중, P 는 0∼7의 정수를 나타낸다)
    (식중 MI =, R=H 또는 CH3, 및 r = 1∼5를 나타낸다)
    로 표시되는 화합물에서 선택되는 2개 이상의 말레이미드기를 포함하는 화합물을 함유하고, 성분(a) 100중량부에 대하여 성분(b)가 10∼900중량부인 접착층을 적충하여 이루어짐을 특징으로 하는 전자 부품용 접착 테이프.
  2. 제1항에 있어서, 내열성 필름의 적어도 한면에, (a) 중량 평균 분자량이 1, 000-50,000, 아크릴로니트릴 함유율이 5∼50중량%인 상기 식(I)로 표시되는 양 말단에 피페라지닐에틸아미노카르보닐기를 갖는 부타디엔-아크릴로니트릴 공중합체, (b) 상기 식(Ⅱ-1)∼(Ⅱ-6)으로 표시되는 화합물에서 선택되는 2개 이상의 말레이미드기를 함유하는 화합물, 및(C) 하기 일반식(Ⅲ) :
    H2N-R1-NH2(Ⅲ)
    (식 중, R1은 2가의 지방족기, 방향족기, 또는 치환식기를 나타낸다)으로 표시되는 디아민 화합물 또는 하기 일반식(Ⅳ) :
    (식 중, R2은 2가의 지방족기, 방향족기, 또는 지환식기를 나타내고, s는 0∼7에서 정수를 나타낸다)로 표시되는 중량 평균 분자량이 200∼7,000인 아미노기 함유 폴리실록산 화합물을 함유하며, 성분 (a) 100 중량부에 대한 성분 (b) 및 c)의 총 합이 10∼900중량부이고. 성분(c)의 아미노기 1몰 당량에 대한 성분(b)의 말레이미드기가 1∼100몰 당량인 접착층을 적층하여 이루어짐을 특징으로 하는 전자 부품용 접착 테이프.
  3. 제1 또는 2항에 있어서, 내열성 필름이 폴리이미드 수지 필름임을 특징으로 하는 전자 부품용 접착 테이프.
  4. 제1 또는 2항에 있어서, 접착층에 입경 l㎛ 이하의 충전제가 4-40중량%함유되어 있음을 특징으로 하는 전자 부품용 접착 테이프.
  5. 박리성 필름의 적어도 한 면에, (a) 중량 평균 분자량이 10,000∼200,000, 아크릴로니트릴 함유율이 5-50중량%인 하기 식(I) :
    (식 중. m= 50∼95, n= 5∼50)로 표시되는 양 말단에 피페라지닐에틸 아미노카르보닐기를 갖는 부타디엔-아크릴로니트릴 공중합체, 및 (b) 하기 식(Ⅱ-1)∼(Ⅱ-6) :
    (식 중, P 는 0∼7의 정수를 나타낸다)
    (식중 MI =, R=H 또는 CH3, 및 r = 1∼5를 나타낸다)
    로 표시되는 화합물에서 선택되는 2개 이상의 말레이미드기를 포함하는 화합물을 함유하고, 성분(a) 100중량부에 대하여 성분(b)가 10∼900중량부인 접착층을 적측하여 이루어짐을 특징으로 하는 전자 부품용 접착 테이프.
  6. 제5항에 있어서, 박리성 필름의 적어도 한면에, (a) 중량 평균 분자량이 1,000∼50,000, 아크릴로니트릴 함유율이 5∼50중량%인 상기 식(I)로 표시되는 양 말단에 피페라지닐에틸아미노카르보닐기를 갖는 부타디엔-아크릴로니트릴 공중합체, (b) 상기 식(Ⅱ-1)∼(Ⅱ-6)으로 표시되는 화합물에서 선택되는 2개 이상의 말레이 미드기를 함유하는 화함물, 및 (C) 하기 일반식(Ⅲ) :
    H2N-R1-NH2(Ⅲ)
    (식 중, R1은 2가의 지방족기, 방향족기, 또는 지환식기를 나타낸다)으로 표시되는 디아민 화합물 또는 하기 일반식(Ⅳ) :
    (Ⅳ)
    (식 중, R2은 2가의 지방족기, 방향족기, 또는 지환식기를 나타내고, s는 0∼7에서 정수를 나타낸다)로 표시되는 중량 평균 분자량이 200∼7,000인 아미노기 함유 폴리실록산 화합물을 함유하며, 성분 (a) 100 중량부에 대한 성분 (b) 및 c)의 총 합이 10∼900중량부이고. 성분(c)의 아미노기 1몰 당량에 대한 성분(b)의 말레이미드기가 1∼100몰 당량인 접착층을 적층하여 이루어짐을 특징으로 하는 전자 부품용 접착 테이프.
  7. 제5또는 6항에 있어서, 접착층에 입경 l㎛ 이하의 충전제가 4∼40중량%함유되어 있음을 특징으로 하는 전자 부품용 접착 테이프.
  8. 유기 용매 중에, (a) 중량 평균 분자량이 1,000∼50,000, 아크릴로니트릴 함유율이 5-50중량%인 하기 식(I) :
    (식 중, m= 50∼95, n= 5∼50)로 표시되는 양 말단에 피페라지닐에틸아미노카르보닐기를 갖는 부타디엔-아크릴로니트릴 공중합체, 및 (b) 하기 식(Ⅱ-1)∼(Ⅱ -6) :
    (식 중, P 는 0∼7의 정수를 나타낸다)
    (식중 MI =, R=H 또는 CH3, 및 r = 1∼5를 나타낸다)
    로 표시되는 화합물에서 선택되는 2개 이상의 말레이미드기를 포함하는 화합물을 용해시켜 수득되며, 성분(a) 100중량부에 대하여 성분(b)가 10∼900중량부 임을 특징으로 하는 전자 부품용 액상 접착제.
  9. 제8항에 있어서, 유기 용매 중에, (a) 중량 평균 분자량이 1,000∼50,000, 아크릴로니트릴 함유율이 5∼50중량%인 상기 식(I)로 표시되는 양 말단에 피페라지닐에틸아미노카르보닐기를 갖는 부타디엔-아크릴로니트릴 공중합체, (b) 상기 식(Ⅱ-1)∼(Ⅱ-6)으로 표시되는 화합물에서 선택되는 2개 이상의 말레이미드기를 함유하는 화합물 및 (C) 하기 일반식(Ⅲ) :
    H2N-R1-NH2(Ⅲ)
    (식 중, R1은 2가의 지방족기, 방향족기, 또는 지환식기를 나타낸다)으로 표시되는 디아민 화합물 또는 하기 일반식(Ⅳ) :
    (식 중, R2은 2가의 지방족기, 방향족기, 또는 지환식기를 나타내고, s는 0∼7에서 정수를 나타낸다)로 표시되는 중량 평균 분자량이 200∼7,000인 아미노기 함유 폴리실록산 화합물을 함유하며, 성분 (a) 100 중량부에 대한 성분 (b) 및 c)의 총 합이 10∼900중량부이고. 성분(c)의 아미노기 1몰 당량에 대한 성분(b)의 말레이미드기가 1∼100몰 당량임을 특징으로 하는 전자 부품용 액상 접착제.
  10. 제8또는 제9항에 있어서, 전 고형분에 대하여 입경 l㎛ 이하의 충전제가 4∼40중량% 함유되어 있음을 특징으로 하는 전자 부품용 액상 접착제.
    ※ 참고사항 : 최초출원 래용에 의하여 공개하는 것임.
KR1019940027033A 1993-10-22 1994-10-21 전자 부품용 접착 테이프 및 액상 접착제 KR100289545B1 (ko)

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JPH0940868A (ja) * 1995-07-27 1997-02-10 Toray Dow Corning Silicone Co Ltd 加熱硬化性シリコーンゴム組成物
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KR20110010601A (ko) * 2008-03-31 2011-02-01 헨켈 코포레이션 다중층 ｕｖ-경화성 접착 필름
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