KR950011573A - 전자 부품용 접착 테이프 및 액상 접착제 - Google Patents

전자 부품용 접착 테이프 및 액상 접착제 Download PDF

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KR950011573A
KR950011573A KR1019940027032A KR19940027032A KR950011573A KR 950011573 A KR950011573 A KR 950011573A KR 1019940027032 A KR1019940027032 A KR 1019940027032A KR 19940027032 A KR19940027032 A KR 19940027032A KR 950011573 A KR950011573 A KR 950011573A
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유끼노리 사꾸모또
다께시 하시모또
가쓰지 나까바
마사하루 고바야시
다께시 니시가야
후미요시 야마나시
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호소까와 마사지로오
가부시끼가이샤 도모에가와 세이시쇼
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Abstract

본 발명은 비교적 저온에서 경화가 가능하고 충분한 내열성 등을 갖는 전자 부품용 액상 접착제 및 이를 사용한 전자 부품용 접착 테이프를 제공한다.
본 발명의 액상 접착제는 (a) 중량 평균 분자량이 10,000∼200,000, 아크릴로니트릴 함유율이 5-50중량%, 및 아미노기 당량이 570-10,000인 하기 식 (I) :
(식 중, k, m 및 n은 몰비이고 n-1에 대하여 k= 3∼17, m=0.3∼93을 나타낸다)로 표시되는 피페라지닐에 틸아미노카르보닐기 함유 부타디엔-아크릴로니트릴 공중합체, 및 (b) 2개 이상의 말레이미드기를 함유하는 화합물을 용해시켜 수득되며, 성분 (a) 100중량부에 대하여 성분(b)가 10-900중량부이다. 이를 내열성 필름의 한면 또는 양면에, 또는 박리성 필름의 한면에 도포하여 전자 부품용 접착 테이프를 수득한다.

Description

전자 부품용 접착 테이프 및 액상 접착제
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 븐 발명의 접착 테이프 또는 종래의 접착 테이프를 사용한 수지 봉지형(封止型) 반도체 장치의 일례의 단면도이다.
제2도는 본 발명의 접착 테이프 또는 종래의 접착 테이프를 사용한 수지 봉지헝 반도체 장치의 다른 일례의 단면도이다.
제3도는 본 발명의 접착 테이프 또는 종래의 접착 테이프를 사용한 수지 봉지헝 반도체 장치의 또 다른 일례의 단면도이다.

Claims (10)

  1. 내열성 필름은 적어도 한 면에, (a) 중량 평균 분자량이 10,000∼200,000, 아크릴로니트릴 함유율이 5-50중량%, 및 아미노기 당량이 500-10,000인 하기 식(I)
    (식 중, k, m및 n은 몰비이고 n=1에 대하여 k=3∼17, m=0.3∼93을 나타낸다)로 표시되는 피페라지닐에틸 아미노카르보닐기 함유 부타디엔-아크릴로니트릴 공중합체, 및 (b) 하기 식 (Ⅱ-1) I (Ⅱ-6) :
    (식 중, P 는 0∼7 의 정수를 나타낸다)
    (식중, MI =, R = H 또는 CH3, 및 r = 1∼5 를 나타낸다)
    로 표시되는 화합물에서 선택되는 2개 이상의 말레이미드기를 포함하는 화합물을 함유하고, 성분(a) 100중량부에 대하여 성분(b)가 10∼900중량부인 접착제를 적충하여 이루어짐을 특징으로 하는 전자 부품용 접착 테이프.
  2. 제1항에 있어서, 내열성 필름의 적어도 한면에, (a) 중량 평균 분자량이 10,000-200,000, 아크릴로니트릴 함유율이 5∼50중량%, 아미노기 당량이 500 ∼10,000인 상기 식(I)로 표시되는 피페라지닐에틸아미노카르보닌기 함유 부타디엔 -아크릴로니트릴 공중합체, (b) 상기 식(Ⅱ-1)∼(Ⅱ-6)으로 표시되는 화합물에서 선택되는 2개 이상의 말레이미드기를 포함하는 화합물 및 (c) 하기 일반식 (Ⅲ) :
    H2N-Rl-NH2(Ⅲ)
    (식 중, R1은 2가의 지방족기, 방향족기, 또는 지환식기를 나타낸다)으로 표시되는 디아민 화합물 또는 하기 일반식 (Ⅳ) :
    (식 중, R2은 2가의 지방족기, 방향족기, 또는 지환식기를 나타내고, S는 0∼7의 정수를 나타낸다)로 표시되는 중량 평균 분자량이 200∼7,000인 아미노기 함유 폴리실톡산 화합물을 함유하며, 성분 (a) 100 중량부에 대한 성분 (b) 및 c)의 총 합이 10-900중량부이고, 성분(c)의 아미노기 1몰 당량에 대한 성분(b)의 말레이미드기가 1∼100몰 당량인 접착층을 적충하여 이루어짐을 특징으로 하는 전자 부품용 접착 테이프.
  3. 제1또는 2항에 있어서, 내열성 필름이 폴리이미드 수지 필름임을 특징으로 하는 전자 부품용 접착 테이프.
  4. 제1 또는 2항에 있어서, 접착층에 입경 l㎛ 이하의 충전제가 4-40중량% 함유되어 있음을 특징으로 하는 전자 부품용 접착 테이프.
  5. 박리성 필름의 적어도 한 면에, (a) 중량 평균 분자량이 10,000∼200,000, 아크릴로니트릴 함유율이 5∼50중량%, 및 아미노기 당량이 500-10,000인 하기 식 (I) :
    (식 중, k, m및 n은 몰비이고 n=1에 대하여 k=3∼175, m=0.3∼93을 나타낸다)로 표시되는 피페라지닐에틸아미노카르보닐기 함유 부타디엔-아크릴로니트릴 공중합체, 및 (b) 하기 식 (Ⅱ-1)I(Ⅱ-6) :
    (식 중, p 는 0∼7 의 정수를 나타낸다)
    (식중, MI =, R = H 또는 CH3, 및 r = 1∼5 를 나타낸다)
    로 표시되는 화합물에서 선택되는 2개 이상의 말레이미드기를 포함하는 화합물을 함유하고, 성분(a) 100중량부에 대하여 성분(b)가 10∼900중량부인 접착제를 적충하여 이루어짐을 특징으로 하는 전자 부품용 접착 테이프.
  6. 제5항에 있어서, 내열성 필름의 적어도 한면에, (a) 중팡 평균 분자량이 10,000-200,000, 아크릴로니트릴 함유율이 5∼50중량%, 아미노기 당량이 500-10,000인 상기 식(I)로 표시되는 피페라지닐에틸아미노카르보닐기 함유 부타디엔-아크릴로니트릴 공중합체, (b) 상기 식(Ⅱ-1)∼(Ⅱ-6)으로 표시되는 화합물에서 선택되는 2개 이상의 말레이디드기를 포함하는 화합물 및 (c) 하기 일반식 (Ⅲ) :
    H2N-Rl-NH2(Ⅲ)
    (식 중, R1은 2가의 지방족기, 방향족기, 또는 지환식기를 나타낸다)으로 표시되는 디아민 화합물 또는 하기 일반식 (Ⅳ) :
    (식 중, R2은 2가의 지방족기, 방향족기, 또는 지환식기를 나타내고, S는 0∼7의 정수를 나타낸다)로 표시되는 중량 평균 분자량이 200∼7,000인 아미노기 함유 폴리실록산 화합물을 함유하며, 성분 (a) 100 중량부에 대한 성분 (b) 및 c)의 총 합이 10-900중량부이고, 성분(c)의 아미노기 1몰 당량에 대한 성분(b)의 말레이미드기가 1∼100몰 당량인 접착층을 적충하여 이루어짐을 특징으로 하는 전자 부품용 접착 테이프.
  7. 제5 또는 6항에 있어서, 접착층에 입경 1㎛ 이하의 충전제가 4∼40중량% 함유되어 있음을 특징으로 하는 전자 부품용 접착 테이프.
  8. 유기 용매 중에. (a) 중량 평균 분자량이 10,000-200,000, 아크릴로니트린 함유율이 5-50중량% 및, 아미노기 당량이 500∼10,000인 하기 식(I) :
    (식 중, k, m및 n은 몰비이고 n=1에 대하여 k=3-175, m=0.3-93을 나타낸다)로 표시되는 피제라지닐에 틸아미노카르보닐기 함유 부타디엔-아크릴로니트릴 공중합체, 및 (b) 하기 식(Ⅱ-1)I(Ⅱ-6) :
    (식 중, p는 0∼7 의 정수를 나타낸다)
    (식중, MI =, R = H 또는 CH3, 및 r = 1∼5 를 나타낸다)
    로 표시되는 화합물에서 선택되는 2개 이상의 말레이미드기를 포함하는 화합물을 용해시켜 수득되며 성분(a) 100중량부에 대하여 성분(b)가 10-900중량부인 접착제를 적층하여 이루어짐을 특징으로 하는 전자 부품용 접착 테이프.
    900중량부임을 특징으로 하는 전자 부품용 액상 접착제.
  9. 제8항에 있어서, 유기 용매 중에, (a) 중량 평균 분자량이 10,000∼200,000아크릴로니트릴 함유율이 5-50중량%, 아미노기 당량이 500∼10,000인 상기 식(I)로 표시되는 피페라지닐에틸아미노카르보닐기 함유 부타디엔-아크릴로니트릴 공중합체, (b) 상기 식(Ⅱ-1)∼(Ⅱ-6)으로 표시되는 화합물에서 선택되는 2개 이상의 말레이미드기를 포함하는 화합물 및 (c) 하기 일반식(Ⅲ) :
    H2N-Rl-NH2(Ⅲ)
    (식 중, R1은 2가의 지방족기, 방향족기, 또는 지환식기를 나타낸다)으로 표시되는 디아민 화합물 또는 하기 일반식 (Ⅳ) :
    (식 중, R2은 2가의 지방족기, 방향족기, 또는 지환식기를 나타내고, S는 0∼7의 정수를 나타낸다)로 표시되는 중량 평균 분자량이 200∼7,000인 아미노기 함유 폴리실톡산 화합물을 함유하며, 성분 (a) 100 중량부에 대한 성분 (b) 및 (c)의 총 합이 10-900중량부이고, 성분(c)의 아미노기 1몰 당량에 대한 성분(b)의 말레이미드기가 1∼100몰 당량임을 특징으로 하는 전자 부품용 액상 적찹제.
  10. 제8또는 9항에 있어서, 전 고형분에 대하여 입결 1㎛ 이하의 충전제가 4∼40중량% 함유되어 있음을 특징으로 하는 전자 부품용 액상 접착제.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940027032A 1993-10-22 1994-10-21 전자 부품용 접착 테이프 및 액상 접착제 KR100287238B1 (ko)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020025167A (ko) * 2002-03-15 2002-04-03 권영준 건초용 절단기

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100333452B1 (ko) 1994-12-26 2002-04-18 이사오 우치가사키 필름 형상의 유기 다이본딩재 및 이를 이용한 반도체 장치
JP2896751B2 (ja) * 1995-03-30 1999-05-31 株式会社巴川製紙所 電子部品用接着テープ
JP2896754B2 (ja) * 1995-06-08 1999-05-31 株式会社巴川製紙所 電子部品用接着テープ
TW310481B (ko) 1995-07-06 1997-07-11 Hitachi Chemical Co Ltd
US6717242B2 (en) 1995-07-06 2004-04-06 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
JP3535281B2 (ja) * 1995-08-31 2004-06-07 株式会社巴川製紙所 電子部品用接着テープ及び液状接着剤
US6099678A (en) * 1995-12-26 2000-08-08 Hitachi Chemical Company Ltd. Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device
TW326566B (en) 1996-04-19 1998-02-11 Hitachi Chemical Co Ltd Composite film and lead frame with composite film attached
US5773113A (en) * 1996-11-21 1998-06-30 Brady Precision Tape Co. Adhesive compositions for electronic applications
US6512039B1 (en) * 2001-11-16 2003-01-28 Lord Corporation Adhesives for bonding peroxide-cured elastomers
US6751099B2 (en) * 2001-12-20 2004-06-15 Intel Corporation Coated heat spreaders
US20030232926A1 (en) * 2002-05-14 2003-12-18 Nikolic Nikola A. Thermoset adhesive films
KR100444925B1 (ko) * 2004-04-19 2004-08-21 (주)새한마이크로닉스 열경화성 접착제용 조성물 및 그를 이용한 전자부품용접착 테이프
WO2013032974A1 (en) 2011-08-29 2013-03-07 Ticona Llc Solid-state polymerization of a liquid crystalline polymer
TW201319118A (zh) 2011-08-29 2013-05-16 Ticona Llc 低熔融黏度液晶聚合物之熔融聚合
KR20140057360A (ko) 2011-08-29 2014-05-12 티코나 엘엘씨 고유동성 액정 중합체 조성물
US9045685B2 (en) 2011-08-29 2015-06-02 Ticona Llc Cast molded parts formed from a liquid crystalline polymer
KR20140059825A (ko) 2011-08-29 2014-05-16 티코나 엘엘씨 고유동성 액정 중합체 조성물
US8906258B2 (en) 2011-08-29 2014-12-09 Ticona Llc Heat-resistant liquid crystalline polymer composition having a low melting temperature
KR20140057629A (ko) 2011-08-29 2014-05-13 티코나 엘엘씨 방향족 아마이드 화합물
WO2013032971A1 (en) 2011-08-29 2013-03-07 Ticona Llc Melt-extruded substrate for use in thermoformed articles
WO2013032975A1 (en) 2011-08-29 2013-03-07 Ticona Llc Thermotropic liquid crystalline polymer with improved low shear viscosity
WO2014130275A2 (en) 2013-02-22 2014-08-28 Ticona Llc High performance polymer composition with improved flow properties
US9206300B2 (en) 2013-06-07 2015-12-08 Ticona Llc High strength thermotropic liquid crystalline polymer

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4145320A (en) * 1974-10-15 1979-03-20 Paolo Ferruti Polymers containing polyunsaturated acid radicals, process for their preparation and use thereof
US5298565A (en) * 1989-04-05 1994-03-29 The Lubrizol Corporation Graft copolymers and lubricants containing such as dispersant-viscosity improvers
DE4113316C2 (de) * 1991-04-24 2003-09-11 Bosch Gmbh Robert Anschlußschaltung für eine Lambdasonde und Prüfverfahren für eine solche Schaltung
JP2684004B2 (ja) * 1993-10-22 1997-12-03 株式会社巴川製紙所 ピペラジニルエチルアミノカルボニル基含有ブタジエン−アクリロニトリル共重合体およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020025167A (ko) * 2002-03-15 2002-04-03 권영준 건초용 절단기

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US5512628A (en) 1996-04-30
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