KR970042908A - 전자부품용 액체 접착제 및 접착 테이프 - Google Patents
전자부품용 액체 접착제 및 접착 테이프 Download PDFInfo
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- KR970042908A KR970042908A KR1019960072505A KR19960072505A KR970042908A KR 970042908 A KR970042908 A KR 970042908A KR 1019960072505 A KR1019960072505 A KR 1019960072505A KR 19960072505 A KR19960072505 A KR 19960072505A KR 970042908 A KR970042908 A KR 970042908A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
- C08F8/42—Introducing metal atoms or metal-containing groups
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
- C08F8/30—Introducing nitrogen atoms or nitrogen-containing groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3415—Five-membered rings
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
- C09J109/02—Copolymers with acrylonitrile
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- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
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- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
- C09J161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
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- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
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- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
- C09J183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- C08K5/18—Amines; Quaternary ammonium compounds with aromatically bound amino groups
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- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
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- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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Abstract
비교적 낮은 온도에서 결합용으로 이용할 수 있으며 경화될 수 있고 충분한 내열성 및 신뢰도를 갖는 전자 부품용 접착제 및 상기 접착제를 이용한 전자 부품용 접착테이프에 관한 것으로 상기 접착제는 유기 용매에 성분(a)로서 아크릴로니트릴-부타디엔 공중합체, 성분(b)로서 페놀 수지,성분 (c)로서 최소 2개의 말레이미드기를 갖는 화합물 및 성분(d)로서 청구범위 제1항에서 일반식(1)의 디아민 화합물 및 또는 각 말단이 아미노기로 종결되고 중량 평균 분자량이 200∼7,000이며 청구범위 제1항에서 일반식(2)의 폴리실록산 화합물을 용해시켜 제조되며, 상기 성분(a) 100중량부당 성분(b),(c) 및 (d)의 총중량은 10-900 중량부 상기 성분 (b),(c) 및 (d)의 총중량을 기준으로 성분(b)의 양은 10∼90 중량%이며, 성분(c)의 말레이미드가 1몰당량 성분(d)의 아미노기의 양은 0.01∼2.0몰 당량인 액체 접착제가 제공된다.
Description
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Claims (13)
- 유기 용매에 성분(a)로서 아크릴로니트릴-부타디엔 공중합체, 성분(b)로서 페놀 수지, 성분(c)로서 최소 2개의 말레이미드기를 갖는 화합물 및 성분(d)로서 하기식(1)의 디아민 화합물 및 또는 각 말단이 아미노기로 종결되고 중량 평균 분자량이 200∼7,000이며 하기식(2)의 폴리실록산 화합물을 용해시켜 제조되며, 상기 성분(a) 100중량부당 성분(b).(c), 및 (d)의 총중량은 10-900 중량부 성분 b).(c), 및 (d)의 총중량을 기준으로 성분(b)의 양은 10∼90 중량%이며 성분(c)의 말레이미드가 1몰당량당 성분(d)의 아미노기의 양은 0.01∼2.0몰당량인 전자 부품용 액체 접착제[화학식 1](단, 상기 식에서 R1은 2가 지방족,방향족 혹은 지방족 고리기이다.)[화학식 2](단, 상기 식에서 R2은 2가 지방족,방향족 혹은 지방족 고리기이며, n은 0-7의 정수이다.)
- 제1항에 있어서, 상기 액체 접착제는 나이가 성분(e)로서 에폭시 수지를 함유하며, 성분(a) 100중량부당 성분(b),(c),(d) 및 (e)의 총중량은 10∼900중량부, 성분(b),(c),(d) 및 (e)의 총중량을 기준으로 성분(b)와 (e)의 총중량은 10∼90중량%이며, 성분(c)의 말레이미드가 1몰당량당 성분(d)의 아미노기의 양은 0.01∼2.0몰 당량임을 특징으로 하는 액체 접착제.
- 제1항에 있어서, 성분(a)로서 아크릴로니트릴-부타디엔 공중합체의 중량 평균 분자량은 50,000∼1,000,000이고 아크릴로니트릴의 함량은 5∼50중량%임을 특징으로 하는 액체 접착제.
- 제1항에 있어서, 성분(b)로서 페놀수지는 p-tert-부틸페놀형 페놀 수지,비스페놀 A형 페놀수지 혹은 크레졸형 페놀수지로부터 선택되며 상기 페놀수지의 페놀성분은 p-tert-부틸페놀, 비스페놀 A 및 크레졸 혹은 이들의 공-축합으로 제조된 레졸형 페놀수지로 구성되는 그룹으로부터 선택된 최소 일종임을 특징으로 하는 액체 접착제.
- 제1항에 있어서, 성분(c)로서 최소 2개의 말레이미드계를 갖는 화합물은 하기식 (3a) 내지 (3f)으로 부터 선택됨을 특징으로 하는 액체 접착제.[화학식 3a][화학식 3b][화학식 3c][화학식 3d](단, 상기식에서 p는 0-7의 정수이다.)[화학식 3e][화학식 3f](단, 상기식에서 MI= R = H 혹은 CH3 이고 r = 1-5이다)
- 제2항에 있어서, 성분(e)로서 에폭시 수지는 노볼락형 에폭시 수지, 비닐페놀형 에폭시 수지,비스페놀형 에폭시 수지와 비페닐형 에폭시 수지의 혼합물로 구성되는 그룹으로부터 선택된 최소 하나의 에폭시 수지임을 특징으로 하는 액체접착제.
- 제1항에 있어서, 상기 액체 접착제는 나아가 입자 직경이 1um 미만인 충진제를 총고형분의 함량을 기준으로 4∼40중량%를 함유하는 특징으로 하는 액체 접착제.
- 제1항의 액체 접착제를 내열성 피막의 최소 일면에 적용하고 상기 액체 접착제를 건조하여 형성된 접착층을 갖는 전자부품용 접착테이프로
- 제8항에 있어서, 상기 내열성 피막은 폴리아미드 피막임을 특징으로 하는 접착테이프
- 제1항의 액체 접착제를 분리형 피막의 최소 일면에 적용하고 상기 액체 접착제를 건조하여 형성된 접착층을 갖는 전자부품용 접착테이프
- 리드 프레임의 고정에 청구범위 제1항의 액체 접착제를 사용하는 방법.
- 리드 프레임의 고정에 청구범위 제8항의 접착 테이프를 사용하는 방법.
- 리드 프레임의 고정에 청구범위 제10항의 접착 테이프를 사용하는 방법.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP351086/95 | 1995-12-25 | ||
JP07351086A JP3118404B2 (ja) | 1995-12-25 | 1995-12-25 | 電子部品用液状接着剤および接着テープ |
JP172946/96 | 1996-06-12 | ||
JP17294696A JP3118420B2 (ja) | 1996-06-12 | 1996-06-12 | 電子部品用液状接着剤および接着テープ |
Publications (2)
Publication Number | Publication Date |
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KR970042908A true KR970042908A (ko) | 1997-07-26 |
KR100403949B1 KR100403949B1 (ko) | 2005-04-06 |
Family
ID=26495106
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960072505A KR100403949B1 (ko) | 1995-12-25 | 1996-12-26 | 전자부품용액체접착제및접착테이프 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5863988A (ko) |
KR (1) | KR100403949B1 (ko) |
MY (1) | MY118143A (ko) |
SG (1) | SG82567A1 (ko) |
TW (1) | TW364005B (ko) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100613754B1 (ko) * | 2000-01-18 | 2006-08-22 | 주식회사 코오롱 | 내열성 접착테이프 |
KR100625054B1 (ko) * | 2000-05-04 | 2006-09-18 | 주식회사 코오롱 | 내열성 접착테이프 |
KR100642678B1 (ko) * | 2004-07-13 | 2006-11-10 | 가부시키가이샤 도모에가와 세이시쇼 | 전자부품용 접착테이프 및 전자부품 |
KR100707732B1 (ko) * | 2001-10-29 | 2007-04-16 | 주식회사 코오롱 | 전자부품용 접착액 및 접착테이프 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW340967B (en) * | 1996-02-19 | 1998-09-21 | Toray Industries | An adhesive sheet for a semiconductor to connect with a substrate, and adhesive sticking tape for tab, an adhesive sticking tape for wire bonding connection, a substrate for connecting with a semiconductor and a semiconductor device |
US5840598A (en) | 1997-08-14 | 1998-11-24 | Micron Technology, Inc. | LOC semiconductor assembled with room temperature adhesive |
EP1026217B1 (en) * | 1999-02-08 | 2003-04-23 | Toray Saehan Inc. | Method of producing adhesive tape for electronic parts |
US6429238B1 (en) * | 1999-06-10 | 2002-08-06 | Shin-Etsu Chemical Co., Ltd. | Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device |
KR100607372B1 (ko) * | 2000-04-20 | 2006-08-02 | 도레이새한 주식회사 | 전자부품용 접착테이프 |
EP1167483A1 (en) * | 2000-06-20 | 2002-01-02 | Saehan Industries, Inc. | Adhesive tape for electronic parts |
US6608126B2 (en) * | 2000-12-18 | 2003-08-19 | Dow Corning Corporation | Silicone liquid crystals, vesicles, and gels |
US6503847B2 (en) * | 2001-04-26 | 2003-01-07 | Institute Of Microelectronics | Room temperature wafer-to-wafer bonding by polydimethylsiloxane |
US6512039B1 (en) * | 2001-11-16 | 2003-01-28 | Lord Corporation | Adhesives for bonding peroxide-cured elastomers |
US7326369B2 (en) * | 2005-03-07 | 2008-02-05 | National Starch And Chemical Investment Holding Corporation | Low stress conductive adhesive |
US9796159B2 (en) * | 2011-04-14 | 2017-10-24 | The United States Of America As Represented By The Administrator Of Nasa | Electric field activated shape memory polymer composite |
KR101395322B1 (ko) * | 2012-07-18 | 2014-05-16 | 도레이첨단소재 주식회사 | 고전압에서 전기적 신뢰성이 향상된 접착제 조성물 및 이를 이용한 반도체 패키지용 접착 테이프 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61211016A (ja) * | 1985-03-18 | 1986-09-19 | Fujikura Ltd | フレキシブルプリント基板と補強板との接合方法 |
SU1317292A2 (ru) * | 1985-10-10 | 1987-06-15 | Государственный Союзный Научно-Исследовательский Институт Радиовещательного Приема И Акустики Им.А.С.Попова | Устройство дл измерени температуры перехода транзистора |
JPH07108967B2 (ja) * | 1986-12-02 | 1995-11-22 | 住友ゴム工業株式会社 | 一液型接着剤 |
US5523137A (en) * | 1991-07-24 | 1996-06-04 | Tomoegawa Paper Co., Ltd. | Adhesive paper for tape automated bonding |
-
1996
- 1996-12-18 US US08/768,392 patent/US5863988A/en not_active Expired - Lifetime
- 1996-12-20 MY MYPI96005395A patent/MY118143A/en unknown
- 1996-12-21 SG SG9611890A patent/SG82567A1/en unknown
- 1996-12-24 TW TW085115954A patent/TW364005B/zh not_active IP Right Cessation
- 1996-12-26 KR KR1019960072505A patent/KR100403949B1/ko not_active IP Right Cessation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100613754B1 (ko) * | 2000-01-18 | 2006-08-22 | 주식회사 코오롱 | 내열성 접착테이프 |
KR100625054B1 (ko) * | 2000-05-04 | 2006-09-18 | 주식회사 코오롱 | 내열성 접착테이프 |
KR100707732B1 (ko) * | 2001-10-29 | 2007-04-16 | 주식회사 코오롱 | 전자부품용 접착액 및 접착테이프 |
KR100642678B1 (ko) * | 2004-07-13 | 2006-11-10 | 가부시키가이샤 도모에가와 세이시쇼 | 전자부품용 접착테이프 및 전자부품 |
Also Published As
Publication number | Publication date |
---|---|
MY118143A (en) | 2004-09-30 |
TW364005B (en) | 1999-07-11 |
SG82567A1 (en) | 2001-08-21 |
US5863988A (en) | 1999-01-26 |
KR100403949B1 (ko) | 2005-04-06 |
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