KR960012546A - 전압 혼용 인터페이스 및 멀티 레일의 분리된 파워 격자 응용을 위한 정전기 방전 보호 회로 - Google Patents

전압 혼용 인터페이스 및 멀티 레일의 분리된 파워 격자 응용을 위한 정전기 방전 보호 회로 Download PDF

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Publication number
KR960012546A
KR960012546A KR1019950031591A KR19950031591A KR960012546A KR 960012546 A KR960012546 A KR 960012546A KR 1019950031591 A KR1019950031591 A KR 1019950031591A KR 19950031591 A KR19950031591 A KR 19950031591A KR 960012546 A KR960012546 A KR 960012546A
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KR
South Korea
Prior art keywords
voltage
power grid
electrostatic discharge
discharge protection
separate power
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Application number
KR1019950031591A
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English (en)
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KR100192188B1 (ko
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Publication of KR960012546A publication Critical patent/KR960012546A/ko
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Publication of KR100192188B1 publication Critical patent/KR100192188B1/ko

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/06Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/0203Particular design considerations for integrated circuits
    • H01L27/0248Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H01L27/0292Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using a specific configuration of the conducting means connecting the protective devices, e.g. ESD buses
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/0203Particular design considerations for integrated circuits
    • H01L27/0248Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K19/00Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/003Modifications for increasing the reliability for protection
    • H03K19/00315Modifications for increasing the reliability for protection in field-effect transistor circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
KR1019950031591A 1994-09-26 1995-09-25 멀티 레일의 파워 격자 응용을 위한 정전기 방전 보호회로 KR100192188B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US31225594A 1994-09-26 1994-09-26
US8/312,255 1994-09-26

Publications (2)

Publication Number Publication Date
KR960012546A true KR960012546A (ko) 1996-04-20
KR100192188B1 KR100192188B1 (ko) 1999-06-15

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950031591A KR100192188B1 (ko) 1994-09-26 1995-09-25 멀티 레일의 파워 격자 응용을 위한 정전기 방전 보호회로

Country Status (5)

Country Link
US (1) US5945713A (ko)
EP (1) EP0703622A2 (ko)
JP (1) JPH08111508A (ko)
KR (1) KR100192188B1 (ko)
TW (1) TW289153B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100470994B1 (ko) * 1997-10-06 2005-07-07 삼성전자주식회사 반도체장치의정전기보호장치

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100386079B1 (ko) * 1996-06-14 2003-09-19 주식회사 하이닉스반도체 정전방전(esd)구조
JP3861426B2 (ja) * 1996-12-27 2006-12-20 セイコーエプソン株式会社 半導体装置の保護回路
KR100230736B1 (ko) * 1997-06-25 1999-11-15 김영환 반도체 소자의 정전기 방지 구조 및 그의 제조방법(Structure of protecting electrostatic discharge for semiconductor device and method for manufacturing the same)
US6205500B1 (en) * 1997-09-24 2001-03-20 Compaq Computer Corp. System and method for electrically isolating a device from higher voltage devices
JP2002524878A (ja) * 1998-09-03 2002-08-06 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Esd保護のための低いトリガ電圧及び低い保持電圧のscr装置
JP2000232203A (ja) 1999-02-10 2000-08-22 Nec Corp ラテラルバイポーラ型入出力保護装置
US6424013B1 (en) * 1999-07-09 2002-07-23 Texas Instruments Incorporated Body-triggered ESD protection circuit
JP3425574B2 (ja) * 1999-07-19 2003-07-14 Necエレクトロニクス株式会社 半導体集積回路の入出力保護装置
US6388857B1 (en) 1999-07-23 2002-05-14 Mitsubishi Denki Kabushiki Kaisha Semiconductor circuit device with improved surge resistance
JP3926975B2 (ja) 1999-09-22 2007-06-06 株式会社東芝 スタック型mosトランジスタ保護回路
JP3450244B2 (ja) * 1999-12-03 2003-09-22 Necエレクトロニクス株式会社 半導体保護装置
US6466423B1 (en) * 2000-01-06 2002-10-15 Taiwan Semiconductor Manufacturing Co., Ltd. Electrostatic discharge protection device for mixed voltage application
US6462380B1 (en) * 2000-01-21 2002-10-08 Texas Instruments Incorporated ESD protection circuit for advanced technologies
US6624998B2 (en) 2000-01-24 2003-09-23 Medtronic, Inc. Electrostatic discharge protection scheme in low potential drop environments
US6366435B1 (en) * 2000-02-04 2002-04-02 United Microelectronics Corp. Multiple sources ESD protection for an epitaxy wafer substrate
EP1146560B1 (de) * 2000-04-12 2006-12-06 Infineon Technologies AG ESD-Latch-up-Schutzschaltung für eine integrierte Schaltung
TW445575B (en) * 2000-05-20 2001-07-11 Nanya Technology Corp Dynamic random access memory with guard ring and its manufacture method
JP2002083931A (ja) * 2000-09-08 2002-03-22 Nec Corp 半導体集積回路装置
US6671153B1 (en) 2000-09-11 2003-12-30 Taiwan Semiconductor Manufacturing Company Low-leakage diode string for use in the power-rail ESD clamp circuits
US6784496B1 (en) * 2000-09-25 2004-08-31 Texas Instruments Incorporated Circuit and method for an integrated charged device model clamp
US6437407B1 (en) 2000-11-07 2002-08-20 Industrial Technology Research Institute Charged device model electrostatic discharge protection for integrated circuits
KR20020085101A (ko) * 2001-05-04 2002-11-16 삼성전자 주식회사 다이오드를 이용한 정전기적 방전으로부터의 보호 회로
US6822294B1 (en) * 2001-06-29 2004-11-23 National Semiconductor Corporation High holding voltage LVTSCR
US6605493B1 (en) 2001-08-29 2003-08-12 Taiwan Semiconductor Manufacturing Company Silicon controlled rectifier ESD structures with trench isolation
US6885078B2 (en) * 2001-11-09 2005-04-26 Lsi Logic Corporation Circuit isolation utilizing MeV implantation
CN1244152C (zh) * 2001-11-16 2006-03-01 松下电器产业株式会社 半导体装置
US6492244B1 (en) * 2001-11-21 2002-12-10 International Business Machines Corporation Method and semiconductor structure for implementing buried dual rail power distribution and integrated decoupling capacitance for silicon on insulator (SOI) devices
US6624660B2 (en) 2001-12-06 2003-09-23 Micron Technology, Inc. CMOS output driver for semiconductor device and related method for improving latch-up immunity in a CMOS output driver
WO2003063203A2 (en) * 2002-01-18 2003-07-31 The Regents Of The University Of California On-chip esd protection circuit
US7384854B2 (en) 2002-03-08 2008-06-10 International Business Machines Corporation Method of forming low capacitance ESD robust diodes
US7020857B2 (en) * 2002-05-20 2006-03-28 International Business Machines Corporation Method and apparatus for providing noise suppression in a integrated circuit
US6849479B2 (en) * 2002-12-03 2005-02-01 Taiwan Semiconductor Manufacturing Company Substrate based ESD network protection method for flip chip design
US7076757B2 (en) * 2003-02-27 2006-07-11 Nec Electronics Corporation Semiconductor integrated device and apparatus for designing the same
US7167350B2 (en) * 2003-11-14 2007-01-23 Texas Instruments Incorporated Design implementation to suppress latchup in voltage tolerant circuits
CN100338780C (zh) * 2003-12-10 2007-09-19 上海华虹Nec电子有限公司 嵌位二极管结构(四)
US7112853B2 (en) * 2003-12-17 2006-09-26 Broadcom Corporation System for ESD protection with extra headroom in relatively low supply voltage integrated circuits
KR100605580B1 (ko) 2003-12-29 2006-07-28 주식회사 하이닉스반도체 정전기 보호회로
JP4590888B2 (ja) 2004-03-15 2010-12-01 株式会社デンソー 半導体出力回路
US20050275037A1 (en) * 2004-06-12 2005-12-15 Chung Shine C Semiconductor devices with high voltage tolerance
US7405445B2 (en) * 2004-06-18 2008-07-29 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor structure and method for ESD protection
US7042028B1 (en) * 2005-03-14 2006-05-09 System General Corp. Electrostatic discharge device
US7566914B2 (en) 2005-07-07 2009-07-28 Intersil Americas Inc. Devices with adjustable dual-polarity trigger- and holding-voltage/current for high level of electrostatic discharge protection in sub-micron mixed signal CMOS/BiCMOS integrated circuits
US7825473B2 (en) * 2005-07-21 2010-11-02 Industrial Technology Research Institute Initial-on SCR device for on-chip ESD protection
US7535105B2 (en) * 2005-08-02 2009-05-19 International Business Machines Corporation Inter-chip ESD protection structure for high speed and high frequency devices
US7859803B2 (en) * 2005-09-19 2010-12-28 The Regents Of The University Of California Voltage overload protection circuits
US7813092B2 (en) * 2005-09-19 2010-10-12 The Regents Of The University Of California ESD unit protection cell for distributed amplifiers
DE102005047000A1 (de) * 2005-09-30 2007-04-12 Infineon Technologies Ag Halbleiterstruktur zur Ableitung eines Überspannungsimpulses und Verfahren zur Herstellung desselben
JP4798610B2 (ja) * 2006-01-13 2011-10-19 ルネサスエレクトロニクス株式会社 半導体装置
US8350318B2 (en) * 2006-03-06 2013-01-08 Semiconductor Components Industries, Llc Method of forming an MOS transistor and structure therefor
DE102006028721B3 (de) * 2006-06-20 2007-11-29 Atmel Germany Gmbh Halbleiterschutzstruktur für eine elektrostatische Entladung
JP5041749B2 (ja) 2006-07-13 2012-10-03 ルネサスエレクトロニクス株式会社 半導体装置
US8077439B2 (en) * 2008-04-17 2011-12-13 Broadcom Corporation Method and system for mitigating risk of electrostatic discharge for a system on chip (SOC)
JP4822292B2 (ja) * 2008-12-17 2011-11-24 三菱電機株式会社 半導体装置
US7989282B2 (en) * 2009-03-26 2011-08-02 International Business Machines Corporation Structure and method for latchup improvement using through wafer via latchup guard ring
TWI422007B (zh) * 2010-01-18 2014-01-01 Macronix Int Co Ltd 一種包含環繞井之具有靜電放電容忍的輸入/輸出墊電路
CN102142412B (zh) * 2010-02-02 2013-06-19 旺宏电子股份有限公司 一种包含环绕井的具有静电放电容忍的输入/输出垫电路
US9153570B2 (en) * 2010-02-25 2015-10-06 Macronix International Co., Ltd. ESD tolerant I/O pad circuit including a surrounding well
US9761521B1 (en) 2014-10-21 2017-09-12 Macom Connectivity Solutions, Llc Flexible and robust power grid connectivity
EP3200235A1 (en) * 2016-01-28 2017-08-02 Nxp B.V. Semiconductor switch device and a method of making a semiconductor switch device
US10186514B1 (en) * 2017-09-06 2019-01-22 Qualcomm Incorporated Bi-stable static random access memory (SRAM) bit cells formed from III-V compounds and configured to achieve higher operating speeds
US10312244B2 (en) 2017-09-19 2019-06-04 Qualcomm Incorporated Bi-stable static random access memory (SRAM) bit cells that facilitate direct writing for storage
US10128229B1 (en) 2017-11-13 2018-11-13 Micron Technology, Inc. Semiconductor devices with package-level configurability
US10483241B1 (en) 2018-06-27 2019-11-19 Micron Technology, Inc. Semiconductor devices with through silicon vias and package-level configurability
US10867991B2 (en) * 2018-12-27 2020-12-15 Micron Technology, Inc. Semiconductor devices with package-level configurability
TWI768451B (zh) * 2020-08-31 2022-06-21 創意電子股份有限公司 半導體結構以及靜電放電保護電路

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0669142B2 (ja) * 1983-04-15 1994-08-31 株式会社日立製作所 半導体集積回路装置
US5157573A (en) * 1989-05-12 1992-10-20 Western Digital Corporation ESD protection circuit with segmented buffer transistor
US5151619A (en) 1990-10-11 1992-09-29 International Business Machines Corporation Cmos off chip driver circuit
US5246872A (en) * 1991-01-30 1993-09-21 National Semiconductor Corporation Electrostatic discharge protection device and a method for simultaneously forming MOS devices with both lightly doped and non lightly doped source and drain regions
US5237395A (en) * 1991-05-28 1993-08-17 Western Digital Corporation Power rail ESD protection circuit
US5477414A (en) * 1993-05-03 1995-12-19 Xilinx, Inc. ESD protection circuit
CA2115230A1 (en) * 1994-02-08 1995-08-09 Jonathan H. Orchard-Webb Esd protection circuit
US5521789A (en) * 1994-03-15 1996-05-28 National Semiconductor Corporation BICMOS electrostatic discharge protection circuit
US5389811A (en) * 1994-04-14 1995-02-14 Analog Devices, Incorporated Fault-protected overvoltage switch employing isolated transistor tubs
US5535086A (en) * 1994-09-22 1996-07-09 National Semiconductor Corp. ESD protection circuit and method for BICMOS devices
US5610791A (en) * 1994-09-26 1997-03-11 International Business Machines Corporation Power sequence independent electrostatic discharge protection circuits

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100470994B1 (ko) * 1997-10-06 2005-07-07 삼성전자주식회사 반도체장치의정전기보호장치

Also Published As

Publication number Publication date
US5945713A (en) 1999-08-31
EP0703622A2 (en) 1996-03-27
KR100192188B1 (ko) 1999-06-15
TW289153B (ko) 1996-10-21
JPH08111508A (ja) 1996-04-30

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