KR960005600A - 모듈카드 - Google Patents

모듈카드 Download PDF

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Publication number
KR960005600A
KR960005600A KR1019950019569A KR19950019569A KR960005600A KR 960005600 A KR960005600 A KR 960005600A KR 1019950019569 A KR1019950019569 A KR 1019950019569A KR 19950019569 A KR19950019569 A KR 19950019569A KR 960005600 A KR960005600 A KR 960005600A
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KR
South Korea
Prior art keywords
integrated circuit
module card
module
connection
external terminal
Prior art date
Application number
KR1019950019569A
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English (en)
Other versions
KR100351188B1 (ko
Inventor
에발트 미하엘
Original Assignee
알베르트 발도르프·롤프 옴케
지멘스 악티엔게젤샤프트
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 알베르트 발도르프·롤프 옴케, 지멘스 악티엔게젤샤프트 filed Critical 알베르트 발도르프·롤프 옴케
Publication of KR960005600A publication Critical patent/KR960005600A/ko
Application granted granted Critical
Publication of KR100351188B1 publication Critical patent/KR100351188B1/ko

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Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/029—Programmable, customizable or modifiable circuits having a programmable lay-out, i.e. adapted for choosing between a few possibilities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10212—Programmable component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Dram (AREA)
  • Credit Cards Or The Like (AREA)
  • Combinations Of Printed Boards (AREA)
  • Logic Circuits (AREA)
  • Techniques For Improving Reliability Of Storages (AREA)

Abstract

본 발명은 스트립도체(6), 적어도 하나의 제1집적회로(2), 입력/출력 신호용 외부 단자를 포함하는 플레이트형 모듈카드에 관한 것이다. 스트립도체(6)는 외부단자(3) 및 제1접속점(7) 사이의 연결을 위한 제1연결소자(5)를 포함한다. 제1연결소자(5)의 분리시 적어도 부분적으로 제2집적회로(4)에 의해 외부 단자(3) 및 제1접속점(7) 사이의 접속이 이루어진다. 그렇지 않으면, 외부 단자(3)가 직접 제1접속점(7)에 연결된다.

Description

모듈카드
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제3도는 본 발명에 따른 모듈카드의 평면도.

Claims (9)

  1. 스트립도체(6), 적어도 하나의 제1집적회로(2)용 제1접속점(7), 입력/출력 신호용 외부 단자(3)를 포함하며, 상기 스트립도체(6)는 외부단자(3) 및 제1접속점(7) 사이의 접속을 위한 분리가능한 제1연결소자(5)를포함하도록 구성된, 플레이트형 모듈카드(1)에 있어서, 제2집적회로(4)가 외부단자(3) 및 제1접속점(7) 사이에 배치되고, 상기 제2집적회로(4)는 분리가능한 제1연결소자(5)의 상태에 따라 제1접속점(7) 및 외부단자(3)사이의 입력/출력 신호에 상이하게 영향을 주는 것을 특징으로 하는 모듈카드.
  2. 제1항에 있어서, 제1연결소자(5)가 분리되지 않을때 외부 단자(3)가 제1접속점에 직접 연결되는 것을 특징으로 하는 모듈카드.
  3. 제1항에 있어서, 적어도 하나의 제2집적회로(4)가 에로보정기능을 갖는 버스차단회로를 포함하는 것을 특징으로 하는 모듈카드.
  4. 제1항 또는 2항에 있어서, 적어도 하나의 제1집적회로(2)가 집적 반도체메모리인 것을 특징으로 하는 모듈카드.
  5. 제1항 내지 4항중 어느 한 항에 있어서, 적어도 하나의 제1집적회로(2)가 DRAM-메모리인 것을 특징으로 하는 모듈카드.
  6. 제1항 내지 5항중 어느 한 항에 있어서, 적어도 하나의 제2집적회로(4)가 드라이버회로를 포함하는 것을 특징으로 하는 모듈카드.
  7. 제1항 내지 6항중 어느 한 항에 있어서, 모듈카드가 적어도 하나의 제2집적회로(4)의 기능변경에 사용되는, 분리가능한 제2연결소자(8)를 포함하는 것을 특징으로 하는 모듈카드.
  8. 제7항에 있어서, 제2연결소자(8)중 적어도 하나가 제2집적회로(4)의 적어도 하나를 스트립도체(6)상에 존재하는 신호의 기준전위에 연결시킬 수 있는 것을 특징으로 하는 모듈카드.
  9. 제7항에 있어서, 제2연결소자(8)중 적어도 하나가 적어도 하나의 제2집적회로(4)의 두단자 사이의 접속(10)에 사용되는 것을 특징으로 하는 모듈카드.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950019569A 1994-07-05 1995-07-05 모듈카드 KR100351188B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4423567A DE4423567C2 (de) 1994-07-05 1994-07-05 Modulkarte
DEP4423567.4 1994-07-05

Publications (2)

Publication Number Publication Date
KR960005600A true KR960005600A (ko) 1996-02-23
KR100351188B1 KR100351188B1 (ko) 2002-12-26

Family

ID=6522305

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950019569A KR100351188B1 (ko) 1994-07-05 1995-07-05 모듈카드

Country Status (7)

Country Link
US (1) US5572457A (ko)
EP (1) EP0691655B1 (ko)
JP (1) JPH0845266A (ko)
KR (1) KR100351188B1 (ko)
AT (1) ATE183847T1 (ko)
DE (2) DE4423567C2 (ko)
TW (1) TW270205B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6893739B2 (en) 2000-12-19 2005-05-17 Posco Steel plate and a hot dip galvanizing steel plate having superior electric and magnetic shielding property

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JP3718008B2 (ja) * 1996-02-26 2005-11-16 株式会社日立製作所 メモリモジュールおよびその製造方法
US5661677A (en) * 1996-05-15 1997-08-26 Micron Electronics, Inc. Circuit and method for on-board programming of PRD Serial EEPROMS
JPH1022458A (ja) * 1996-07-04 1998-01-23 Fujitsu Ltd 半導体装置及びピン配列
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DE19724053A1 (de) * 1997-06-07 1998-12-10 Biotronik Mess & Therapieg Elektronische Speichervorrichtung, insbesondere zur Anwendung bei implantierbaren medizinischen Geräten
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US6071139A (en) 1998-03-31 2000-06-06 Micron Technology, Inc. Locking assembly for securing semiconductor device to carrier substrate
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JP2010218641A (ja) * 2009-03-18 2010-09-30 Elpida Memory Inc メモリモジュール

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6893739B2 (en) 2000-12-19 2005-05-17 Posco Steel plate and a hot dip galvanizing steel plate having superior electric and magnetic shielding property

Also Published As

Publication number Publication date
EP0691655A1 (de) 1996-01-10
KR100351188B1 (ko) 2002-12-26
ATE183847T1 (de) 1999-09-15
EP0691655B1 (de) 1999-08-25
US5572457A (en) 1996-11-05
JPH0845266A (ja) 1996-02-16
DE4423567C2 (de) 1998-09-03
DE4423567A1 (de) 1996-01-11
DE59506674D1 (de) 1999-09-30
TW270205B (ko) 1996-02-11

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