TW270205B - - Google Patents
Info
- Publication number
- TW270205B TW270205B TW084106859A TW84106859A TW270205B TW 270205 B TW270205 B TW 270205B TW 084106859 A TW084106859 A TW 084106859A TW 84106859 A TW84106859 A TW 84106859A TW 270205 B TW270205 B TW 270205B
- Authority
- TW
- Taiwan
- Prior art keywords
- circuits
- external connections
- separable
- additional
- connection points
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/029—Programmable, customizable or modifiable circuits having a programmable lay-out, i.e. adapted for choosing between a few possibilities
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10212—Programmable component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Dram (AREA)
- Credit Cards Or The Like (AREA)
- Techniques For Improving Reliability Of Storages (AREA)
- Combinations Of Printed Boards (AREA)
- Logic Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4423567A DE4423567C2 (de) | 1994-07-05 | 1994-07-05 | Modulkarte |
Publications (1)
Publication Number | Publication Date |
---|---|
TW270205B true TW270205B (zh) | 1996-02-11 |
Family
ID=6522305
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW084106859A TW270205B (zh) | 1994-07-05 | 1995-07-04 |
Country Status (7)
Country | Link |
---|---|
US (1) | US5572457A (zh) |
EP (1) | EP0691655B1 (zh) |
JP (1) | JPH0845266A (zh) |
KR (1) | KR100351188B1 (zh) |
AT (1) | ATE183847T1 (zh) |
DE (2) | DE4423567C2 (zh) |
TW (1) | TW270205B (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5768173A (en) * | 1995-11-11 | 1998-06-16 | Samsung Electronics Co., Ltd. | Memory modules, circuit substrates and methods of fabrication therefor using partially defective memory devices |
JP3718008B2 (ja) | 1996-02-26 | 2005-11-16 | 株式会社日立製作所 | メモリモジュールおよびその製造方法 |
US5661677A (en) | 1996-05-15 | 1997-08-26 | Micron Electronics, Inc. | Circuit and method for on-board programming of PRD Serial EEPROMS |
JPH1022458A (ja) * | 1996-07-04 | 1998-01-23 | Fujitsu Ltd | 半導体装置及びピン配列 |
KR100647189B1 (ko) * | 1996-12-19 | 2007-08-16 | 텍사스 인스트루먼츠 인코포레이티드 | 선택가능메모리모듈및그동작방법 |
DE19724053A1 (de) * | 1997-06-07 | 1998-12-10 | Biotronik Mess & Therapieg | Elektronische Speichervorrichtung, insbesondere zur Anwendung bei implantierbaren medizinischen Geräten |
TW379466B (en) * | 1997-12-27 | 2000-01-11 | Via Tech Inc | Memory module slot device providing constant loads |
US6398573B1 (en) | 1998-03-31 | 2002-06-04 | Micron Technology, Inc. | Locking assembly for securing semiconductor device to carrier substrate |
US6071139A (en) * | 1998-03-31 | 2000-06-06 | Micron Technology, Inc. | Locking assembly for securing semiconductor device to carrier substrate |
US5870325A (en) * | 1998-04-14 | 1999-02-09 | Silicon Graphics, Inc. | Memory system with multiple addressing and control busses |
US6134111A (en) | 1998-04-15 | 2000-10-17 | Micron Technology, Inc. | Vertical surface mount apparatus with thermal carrier |
KR100318257B1 (ko) * | 1998-11-07 | 2002-04-22 | 박종섭 | 인쇄회로기판및그의신호배선방법 |
JP3910914B2 (ja) | 2000-12-19 | 2007-04-25 | ポスコ | 抗菌及び遠赤外線放射特性を有する粉末ならびにその樹脂被膜で被膜されたバイオウェーブ鋼板 |
DE10131939B4 (de) * | 2001-07-02 | 2014-12-11 | Qimonda Ag | Elektronische Leiterplatte mit mehreren bauartgleichen gehäusegefaßten Halbleiterspeichern |
JP2010218641A (ja) * | 2009-03-18 | 2010-09-30 | Elpida Memory Inc | メモリモジュール |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58159280A (ja) * | 1982-03-17 | 1983-09-21 | Fujitsu Ltd | 回路モジユ−ルの構成方法 |
GB2130025A (en) * | 1982-11-08 | 1984-05-23 | Control Data Corp | Memory board stacking module |
US4656605A (en) * | 1983-09-02 | 1987-04-07 | Wang Laboratories, Inc. | Single in-line memory module |
DE3428346A1 (de) * | 1983-10-13 | 1985-04-25 | Peter Dipl.-Ing. 7550 Rastatt Lawo | Schaltungsanordnung von prozessorgesteuerten baugruppen |
US5241643A (en) * | 1990-06-19 | 1993-08-31 | Dell Usa, L.P. | Memory system and associated method for disabling address buffers connected to unused simm slots |
DE4032370A1 (de) * | 1990-10-12 | 1992-04-16 | Philips Patentverwaltung | Schaltungsanordnung mit wenigstens zwei identischen, integrierten schaltungen oder schaltungsmodulen |
DE4207226B4 (de) * | 1992-03-07 | 2005-12-15 | Robert Bosch Gmbh | Integrierte Schaltung |
US5267218A (en) * | 1992-03-31 | 1993-11-30 | Intel Corporation | Nonvolatile memory card with a single power supply input |
US5270964A (en) * | 1992-05-19 | 1993-12-14 | Sun Microsystems, Inc. | Single in-line memory module |
JPH05343579A (ja) * | 1992-06-05 | 1993-12-24 | Toshiba Corp | 半導体実装基板 |
US5272664A (en) * | 1993-04-21 | 1993-12-21 | Silicon Graphics, Inc. | High memory capacity DRAM SIMM |
US5440519A (en) * | 1994-02-01 | 1995-08-08 | Micron Semiconductor, Inc. | Switched memory expansion buffer |
-
1994
- 1994-07-05 DE DE4423567A patent/DE4423567C2/de not_active Expired - Fee Related
-
1995
- 1995-06-29 EP EP95110178A patent/EP0691655B1/de not_active Expired - Lifetime
- 1995-06-29 AT AT95110178T patent/ATE183847T1/de not_active IP Right Cessation
- 1995-06-29 DE DE59506674T patent/DE59506674D1/de not_active Expired - Lifetime
- 1995-07-04 TW TW084106859A patent/TW270205B/zh not_active IP Right Cessation
- 1995-07-05 US US08/498,165 patent/US5572457A/en not_active Expired - Lifetime
- 1995-07-05 JP JP7192525A patent/JPH0845266A/ja active Pending
- 1995-07-05 KR KR1019950019569A patent/KR100351188B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE4423567C2 (de) | 1998-09-03 |
EP0691655A1 (de) | 1996-01-10 |
DE4423567A1 (de) | 1996-01-11 |
US5572457A (en) | 1996-11-05 |
KR960005600A (ko) | 1996-02-23 |
KR100351188B1 (ko) | 2002-12-26 |
ATE183847T1 (de) | 1999-09-15 |
EP0691655B1 (de) | 1999-08-25 |
DE59506674D1 (de) | 1999-09-30 |
JPH0845266A (ja) | 1996-02-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4A | Expiration of patent term of an invention patent |