KR950014046B1 - 최적화된 히트 파이프 및 전자회로 일체형 조립체 - Google Patents
최적화된 히트 파이프 및 전자회로 일체형 조립체 Download PDFInfo
- Publication number
- KR950014046B1 KR950014046B1 KR1019930000426A KR930000426A KR950014046B1 KR 950014046 B1 KR950014046 B1 KR 950014046B1 KR 1019930000426 A KR1019930000426 A KR 1019930000426A KR 930000426 A KR930000426 A KR 930000426A KR 950014046 B1 KR950014046 B1 KR 950014046B1
- Authority
- KR
- South Korea
- Prior art keywords
- circuit module
- evaporator
- heat
- working fluid
- multichip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0031—Radiators for recooling a coolant of cooling systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F2013/005—Thermal joints
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/820,569 US5216580A (en) | 1992-01-14 | 1992-01-14 | Optimized integral heat pipe and electronic circuit module arrangement |
| US820,569 | 1992-01-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR930016751A KR930016751A (ko) | 1993-08-26 |
| KR950014046B1 true KR950014046B1 (ko) | 1995-11-20 |
Family
ID=25231172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019930000426A Expired - Fee Related KR950014046B1 (ko) | 1992-01-14 | 1993-01-14 | 최적화된 히트 파이프 및 전자회로 일체형 조립체 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5216580A (https=) |
| JP (1) | JPH0783077B2 (https=) |
| KR (1) | KR950014046B1 (https=) |
| TW (1) | TW218421B (https=) |
Families Citing this family (128)
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| CA2186488C (en) * | 1995-01-25 | 2000-01-18 | Henry F. Villaume | Thermal management system |
| US5565716A (en) * | 1995-03-01 | 1996-10-15 | The United States Of America As Represented By The Secretary Of The Navy | Variable resistance, liquid-cooled load bank |
| JPH08264694A (ja) * | 1995-03-20 | 1996-10-11 | Calsonic Corp | 電子部品用冷却装置 |
| JP3255818B2 (ja) * | 1995-03-20 | 2002-02-12 | カルソニックカンセイ株式会社 | 電子部品用冷却装置 |
| JP3216770B2 (ja) * | 1995-03-20 | 2001-10-09 | カルソニックカンセイ株式会社 | 電子部品用冷却装置 |
| TW307837B (https=) * | 1995-05-30 | 1997-06-11 | Fujikura Kk | |
| JPH098190A (ja) * | 1995-06-22 | 1997-01-10 | Calsonic Corp | 電子部品用冷却装置 |
| US5737923A (en) * | 1995-10-17 | 1998-04-14 | Marlow Industries, Inc. | Thermoelectric device with evaporating/condensing heat exchanger |
| US6056044A (en) * | 1996-01-29 | 2000-05-02 | Sandia Corporation | Heat pipe with improved wick structures |
| DE19626227C2 (de) * | 1996-06-29 | 1998-07-02 | Bosch Gmbh Robert | Anordnung zur Wärmeableitung bei Chipmodulen auf Mehrschicht-Keramikträgern, insbesondere für Multichipmodule, und Verfahren zu ihrer Herstellung |
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| US20030156400A1 (en) * | 1999-07-15 | 2003-08-21 | Dibene Joseph Ted | Method and apparatus for providing power to a microprocessor with intergrated thermal and EMI management |
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| US6474074B2 (en) * | 2000-11-30 | 2002-11-05 | International Business Machines Corporation | Apparatus for dense chip packaging using heat pipes and thermoelectric coolers |
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| US7134486B2 (en) * | 2001-09-28 | 2006-11-14 | The Board Of Trustees Of The Leeland Stanford Junior University | Control of electrolysis gases in electroosmotic pump systems |
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| US4407198A (en) * | 1982-04-15 | 1983-10-04 | M.A.N.-Roland Druckmaschinen Aktiengesellschaft | Arrangement for securing pure skew adjustment of a plate cylinder in a sheet-fed rotary printing press |
| US4833567A (en) * | 1986-05-30 | 1989-05-23 | Digital Equipment Corporation | Integral heat pipe module |
| US4995451A (en) * | 1989-12-29 | 1991-02-26 | Digital Equipment Corporation | Evaporator having etched fiber nucleation sites and method of fabricating same |
| US5095404A (en) * | 1990-02-26 | 1992-03-10 | Data General Corporation | Arrangement for mounting and cooling high density tab IC chips |
-
1992
- 1992-01-14 US US07/820,569 patent/US5216580A/en not_active Expired - Lifetime
- 1992-12-30 TW TW081110488A patent/TW218421B/zh active
-
1993
- 1993-01-14 KR KR1019930000426A patent/KR950014046B1/ko not_active Expired - Fee Related
- 1993-01-14 JP JP5020852A patent/JPH0783077B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07142652A (ja) | 1995-06-02 |
| JPH0783077B2 (ja) | 1995-09-06 |
| KR930016751A (ko) | 1993-08-26 |
| US5216580A (en) | 1993-06-01 |
| TW218421B (https=) | 1994-01-01 |
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