KR950010717A - 4방향 리드 플랫 패키지 ic의 땜납 딥용 랜드 및 땜납 딥 납땜 방법 - Google Patents

4방향 리드 플랫 패키지 ic의 땜납 딥용 랜드 및 땜납 딥 납땜 방법 Download PDF

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Publication number
KR950010717A
KR950010717A KR1019940024720A KR19940024720A KR950010717A KR 950010717 A KR950010717 A KR 950010717A KR 1019940024720 A KR1019940024720 A KR 1019940024720A KR 19940024720 A KR19940024720 A KR 19940024720A KR 950010717 A KR950010717 A KR 950010717A
Authority
KR
South Korea
Prior art keywords
solder
land
flat package
way lead
lead flat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1019940024720A
Other languages
English (en)
Korean (ko)
Inventor
모또가즈 다나까
마사루 단
미사꼬 하따
아쯔꼬 스미따
Original Assignee
오오가 노리오
소니 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오오가 노리오, 소니 가부시끼가이샤 filed Critical 오오가 노리오
Publication of KR950010717A publication Critical patent/KR950010717A/ko
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1019940024720A 1993-09-30 1994-09-29 4방향 리드 플랫 패키지 ic의 땜납 딥용 랜드 및 땜납 딥 납땜 방법 Ceased KR950010717A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5245455A JPH07106744A (ja) 1993-09-30 1993-09-30 ４方向リードフラットパッケージｉｃの半田ディップ用ランド及び半田ディップ半田付方法
JP93-245455 1993-09-30

Publications (1)

Publication Number Publication Date
KR950010717A true KR950010717A (ko) 1995-04-28

Family

ID=17133921

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940024720A Ceased KR950010717A (ko) 1993-09-30 1994-09-29 4방향 리드 플랫 패키지 ic의 땜납 딥용 랜드 및 땜납 딥 납땜 방법

Country Status (3)

Country Link
JP (1) JPH07106744A (enExample)
KR (1) KR950010717A (enExample)
TW (1) TW288191B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100330580B1 (ko) * 1999-08-30 2002-03-29 윤종용 ４방향 플랫 패키지ｉｃ 실장용 회로기판 및 그 땜납도포방법
KR100330579B1 (ko) * 1999-08-30 2002-03-29 윤종용 ４방향 플랫 패키지ｉｃ 실장용 회로기판 및 그 땜납도포방법
JP2002158432A (ja) * 2000-11-17 2002-05-31 Matsushita Electric Ind Co Ltd 鉛フリー半田付け装置
JP4041991B2 (ja) 2004-04-16 2008-02-06 船井電機株式会社 プリント配線基板

Also Published As

Publication number Publication date
TW288191B (enExample) 1996-10-11
JPH07106744A (ja) 1995-04-21

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