KR910014015A - 편면프린트기판에 2종류의 부품을 납땜하는 방법 - Google Patents
편면프린트기판에 2종류의 부품을 납땜하는 방법 Download PDFInfo
- Publication number
- KR910014015A KR910014015A KR1019900021700A KR900021700A KR910014015A KR 910014015 A KR910014015 A KR 910014015A KR 1019900021700 A KR1019900021700 A KR 1019900021700A KR 900021700 A KR900021700 A KR 900021700A KR 910014015 A KR910014015 A KR 910014015A
- Authority
- KR
- South Korea
- Prior art keywords
- wiring pattern
- sided printed
- pattern surface
- lead
- parts
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title claims 6
- 238000000034 method Methods 0.000 claims description 7
- 239000006071 cream Substances 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims 4
- 230000001070 adhesive effect Effects 0.000 claims 4
- 238000003780 insertion Methods 0.000 claims 2
- 230000037431 insertion Effects 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000005096 rolling process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D35/00—Filtering devices having features not specifically covered by groups B01D24/00 - B01D33/00, or for applications not specifically covered by groups B01D24/00 - B01D33/00; Auxiliary devices for filtration; Filter housing constructions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1484—Simultaneous treatments, e.g. soldering lead-in-hole components simultaneously with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
내용 없음.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1A도 내지 제1I 도는 납땜방법을 설명하는 단면도,
제2A도 내지 제2D도,
제4A도 내지 제4D도는 크림연압의 도포방법을 설명하는 평면도.
Claims (3)
- 편면프린트기판에 리드부착부품과 칩부품의 2종류의 부품을 납땜하는 방법에 있어서, 상기 편면프린트기판의 배선패턴면의 복수위치에 크림연압을 도포하는공정과, 상기 편면프린트기판의 비배선패턴면에 리드부착부품접착용 접착체를 도포하는 공정과, 상기 편면프린트기판의 비배선패턴면에 리드부착품을 상기 접착체에 의해 접착하는 동시에, 그 리드부착부품의 리드를 상기 편면프린트기판의 리드삽통공을 통해서 비배선패턴면측으로부터 배선패턴면상의 일부의 크림연납에 삽통시키는공정과, 상기 편면프린트기판의 배선패턴면상의 다른 크림연납상에 칩부품을 장착하는 공정과, 상기 편면프린트기판의 배선패턴상의 전체 크림연납을 한번에 가열해서, 상기 리드부착부품과 상기 칩부품을 동시에 리플로 납땜하는 공정을 구비한 것을 특징으로 하는 편면프린트기판에 2종류의 부품을 납땜하는 방법.
- 제1항에 있어서, 상기 접착제는 자외선 경화형 접착체인 것을 특징으로 하는 편먼프린트기판에 2종류의 부품을 납땜하는 방법.
- 제1항에 있어서, 상기 크림연납을 도포하는 공정에서는 상기 편면프린트기판의 배선패턴면을 상향으로 하고, 상기 접작체를 도포하는 공정, 상기 리드부착부품을 접착하는 공정 및 상기 리드를 상기 리드삽통공에 삽입하는 공정에서는 상기 편면프린트기판의 비배선패턴면을 상향으로 하고, 상기 칩부품을 장착하는 공정 및 상기 리플로 납땜하는 공정에서는 상기 편면프린트기판의 배선패턴면을 상향으로 하는 것을 특징으로 하는 편면프린드기판에 2종류의 부품을 납땜하는 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1342710A JP2844778B2 (ja) | 1989-12-28 | 1989-12-28 | 片面プリント基板に2種類の部品を半田付けする方法 |
JP89-342710 | 1989-12-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR910014015A true KR910014015A (ko) | 1991-08-08 |
Family
ID=18355889
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900021700A KR910014015A (ko) | 1989-12-28 | 1990-12-26 | 편면프린트기판에 2종류의 부품을 납땜하는 방법 |
Country Status (3)
Country | Link |
---|---|
US (1) | US5070604A (ko) |
JP (1) | JP2844778B2 (ko) |
KR (1) | KR910014015A (ko) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5155904A (en) * | 1991-04-03 | 1992-10-20 | Compaq Computer Corporation | Reflow and wave soldering techniques for bottom side components |
FR2690304B1 (fr) * | 1992-04-16 | 1999-09-24 | Marelli Autronica | Procede d'assemblage de composants sur une plaquette de circuit imprime double face et plaquette ainsi obtenue. |
JP3295967B2 (ja) * | 1992-06-29 | 2002-06-24 | 松下電器産業株式会社 | 電子部品接合方法 |
US5604831A (en) * | 1992-11-16 | 1997-02-18 | International Business Machines Corporation | Optical module with fluxless laser reflow soldered joints |
US5295214A (en) * | 1992-11-16 | 1994-03-15 | International Business Machines Corporation | Optical module with tolerant wave soldered joints |
US5874780A (en) | 1995-07-27 | 1999-02-23 | Nec Corporation | Method of mounting a semiconductor device to a substrate and a mounted structure |
DE29519294U1 (de) * | 1995-12-06 | 1997-04-03 | Robert Bosch Gmbh, 70469 Stuttgart | Elektrisches Gerät |
DE10211647B4 (de) * | 2002-03-15 | 2014-02-13 | Endress + Hauser Gmbh + Co. Kg | Verfahren zum Bestücken und Löten einer Leiterplatte |
US6933449B2 (en) * | 2002-07-10 | 2005-08-23 | Intel Corporation | Selective area solder placement |
FR2876540B1 (fr) * | 2004-10-08 | 2007-04-20 | Johnson Controls Tech Co | Procede de soudage d'un composant traversant sur une carte a circuit imprime et relais a souder selon le procede |
DE102009002288A1 (de) * | 2009-04-08 | 2010-10-14 | Endress + Hauser Gmbh + Co. Kg | Verfahren zur Fixierung von THT-Bauteilen und zur Herstellung von Leiterplatten mit darauf fixierten THT-Bauteilen |
DE102009028499A1 (de) * | 2009-08-13 | 2011-02-17 | Endress + Hauser Gmbh + Co. Kg | Verfahren zur Bestückung und zum Löten von gemischt bestückbaren Leiterplatten |
CN102131352A (zh) * | 2010-01-13 | 2011-07-20 | 鸿富锦精密工业(深圳)有限公司 | 一种制造印刷电路板的方法 |
JP6990830B2 (ja) * | 2018-03-30 | 2022-01-12 | パナソニックIpマネジメント株式会社 | プリント基板及びプリント基板の製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4506443A (en) * | 1982-05-28 | 1985-03-26 | Clarion Co., Ltd. | Method of mounting electric part onto a substrate |
US4515304A (en) * | 1982-09-27 | 1985-05-07 | Northern Telecom Limited | Mounting of electronic components on printed circuit boards |
US4761881A (en) * | 1986-09-15 | 1988-08-09 | International Business Machines Corporation | Single step solder process |
JPS63253693A (ja) * | 1987-04-09 | 1988-10-20 | シャープ株式会社 | 部品の取付け方法 |
JPS63283189A (ja) * | 1987-05-15 | 1988-11-21 | Sony Corp | 部品の半田付け方法 |
US4982376A (en) * | 1989-04-20 | 1991-01-01 | U.S. Philips Corporation | Method of mounting electrical and/or electronic components on a single-sided printed board |
-
1989
- 1989-12-28 JP JP1342710A patent/JP2844778B2/ja not_active Expired - Fee Related
-
1990
- 1990-12-18 US US07/629,140 patent/US5070604A/en not_active Expired - Fee Related
- 1990-12-26 KR KR1019900021700A patent/KR910014015A/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
US5070604A (en) | 1991-12-10 |
JP2844778B2 (ja) | 1999-01-06 |
JPH03201589A (ja) | 1991-09-03 |
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Legal Events
Date | Code | Title | Description |
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A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
NORF | Unpaid initial registration fee |