KR950035538A - 프린트 배선판 - Google Patents

프린트 배선판 Download PDF

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Publication number
KR950035538A
KR950035538A KR1019950010944A KR19950010944A KR950035538A KR 950035538 A KR950035538 A KR 950035538A KR 1019950010944 A KR1019950010944 A KR 1019950010944A KR 19950010944 A KR19950010944 A KR 19950010944A KR 950035538 A KR950035538 A KR 950035538A
Authority
KR
South Korea
Prior art keywords
land
wiring board
printed wiring
lead
chip component
Prior art date
Application number
KR1019950010944A
Other languages
English (en)
Inventor
유지 니시따니
Original Assignee
오오가 노리오
소니 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오오가 노리오, 소니 가부시끼가이샤 filed Critical 오오가 노리오
Publication of KR950035538A publication Critical patent/KR950035538A/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772—Conductors directly under a component but not electrically connected to the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/046—Means for drawing solder, e.g. for removing excess solder from pads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

본 발명의 목적은 칩 부품의 탑재로 미어져 나온 납을 확실하게 흡착 보존할 수 있는 프린트 배선판을 제공하는 것이다.
본 발명의 프린트 배선판(1)은 칩 부품(10)을 배치하기 위한 기판(2)과 납을 거쳐서 칩 부품(10)의 전극부(11)와 결합되는 전극 랜드(3)와 배치되는 칩 부품(10)의 아래부분에서 약간 미어져 나오는 상태로 또한 전극랜드(3)와의 사이에서 소정의 간격 d를 둔 납 흡착용 랜드(5)를 구비한 프린트 배선판(1)이다. 또 배선 패턴(6)의 일부를 납 흡착용 랜드(5)로서 납 흡착용 랜드(5) 및 전극 랜드(3)와 대응하는 영역 이외로 납땜 레지스트(4)를 흡착하거나 납 흡착용 랜드(5)에 스루호울을 설치한 프린트 배선판(1)이기도 하다.

Description

프린트 배선판
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1a도는 본 발명의 프린트 배선판을 설명하는 개략적인 사시도, 제1b도는 본 발명의 프린트 배선판을 설명하는 개략적인 평면도, 제2a~ 2c도는 칩 부품의 접합 상태를 순서대로 설명하는 단면도, 제3a~ 3c도는 다른 예를 설명하는 개략적인 평면도, 제4a 및 4b도는 스루 호울을 설치한 예를 설명하는 개략적인 평면도.

Claims (3)

  1. 칩 부품을 배치하기 위한 기판과 이 기판 위에 설치되고 납을 통하여 이 칩 부품의 전극부와 접합되는 전극 랜드를 구비한 프린트 배선판에 있어서, 상기 기판위에, 배치되는 상기 칩 부품의 아래부분에서 약간 미어져 나오는 상태로 또한 상기 전극랜드와의 사이에서 소정의 간격을 둔 상태에서 납흡착용 랜드가 설치되어 있는 것을 특징으로 하는 프린트 배선판.
  2. 제1항에 있어서, 배치되는 상기 칩 부품의 아래부분을 이루는 상기 기판위에 소정의 배선 패턴이 설치되고 이 배선 패턴의 일부를 상기 납 흡착용 랜드로서 겸용하고 있으며, 상기 기판상에 상기 납흡착용 랜드 및 상기 전극 랜드와 대응하는 영역 이외의 영역에 상기 납이 부착되지 않은 납땜 레지스터(solder resist)가 피착되어 있는 것을 특징으로 하는 프린트 배선판.
  3. 제1항 또는 제2항에 있어서, 상기 납 흡착용 랜드에는 소정 깊이의 스루호울이 설치되어 있는 것을 특징으로 하는 프린트 배선판.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950010944A 1994-05-06 1995-05-04 프린트 배선판 KR950035538A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP94-117612 1994-05-06
JP11761294A JP3365048B2 (ja) 1994-05-06 1994-05-06 チップ部品の実装基板およびチップ部品の実装方法

Publications (1)

Publication Number Publication Date
KR950035538A true KR950035538A (ko) 1995-12-30

Family

ID=14716075

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950010944A KR950035538A (ko) 1994-05-06 1995-05-04 프린트 배선판

Country Status (5)

Country Link
JP (1) JP3365048B2 (ko)
KR (1) KR950035538A (ko)
CN (1) CN1080082C (ko)
GB (1) GB2289170B (ko)
TW (1) TW423265B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3400634B2 (ja) 1996-02-28 2003-04-28 富士通株式会社 プリント基板の配線パターン改造方法およびプリント基板の配線パターンの切断方法
CN100531514C (zh) * 2004-07-12 2009-08-19 鸿富锦精密工业（深圳）有限公司 防止短路的印刷电路板结构
JP2006041409A (ja) * 2004-07-30 2006-02-09 Toshiba Corp 配線基板及び磁気ディスク装置
US7312403B2 (en) * 2004-09-24 2007-12-25 Matsushita Electric Industrial Co., Ltd. Circuit component mounting device
CA2938004A1 (en) * 2014-01-31 2015-08-06 Trub Emulsions Chemie AG Aqueous primer coating for use in a digital printing process
JP2016207952A (ja) 2015-04-28 2016-12-08 富士通株式会社 部品内蔵基板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1062928A (en) * 1964-09-15 1967-03-22 Standard Telephones Cables Ltd Multi-wafer integrated circuits
US4777564A (en) * 1986-10-16 1988-10-11 Motorola, Inc. Leadform for use with surface mounted components
JPH01251788A (ja) * 1988-03-31 1989-10-06 Canon Inc プリント基板
US5227589A (en) * 1991-12-23 1993-07-13 Motorola, Inc. Plated-through interconnect solder thief
EP0578880A1 (en) * 1992-07-14 1994-01-19 General Electric Company Plated D-shell connector

Also Published As

Publication number Publication date
CN1113069A (zh) 1995-12-06
CN1080082C (zh) 2002-02-27
GB2289170B (en) 1998-06-24
JPH07302970A (ja) 1995-11-14
JP3365048B2 (ja) 2003-01-08
GB2289170A (en) 1995-11-08
GB9508857D0 (en) 1995-06-21
TW423265B (en) 2001-02-21

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