GB9508857D0 - Printed circuit board - Google Patents

Printed circuit board

Info

Publication number
GB9508857D0
GB9508857D0 GBGB9508857.1A GB9508857A GB9508857D0 GB 9508857 D0 GB9508857 D0 GB 9508857D0 GB 9508857 A GB9508857 A GB 9508857A GB 9508857 D0 GB9508857 D0 GB 9508857D0
Authority
GB
United Kingdom
Prior art keywords
circuit board
printed circuit
printed
board
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB9508857.1A
Other versions
GB2289170B (en
GB2289170A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of GB9508857D0 publication Critical patent/GB9508857D0/en
Publication of GB2289170A publication Critical patent/GB2289170A/en
Application granted granted Critical
Publication of GB2289170B publication Critical patent/GB2289170B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772—Conductors directly under a component but not electrically connected to the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/046—Means for drawing solder, e.g. for removing excess solder from pads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
GB9508857A 1994-05-06 1995-05-01 Circuit board Expired - Fee Related GB2289170B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11761294A JP3365048B2 (en) 1994-05-06 1994-05-06 Chip component mounting board and chip component mounting method

Publications (3)

Publication Number Publication Date
GB9508857D0 true GB9508857D0 (en) 1995-06-21
GB2289170A GB2289170A (en) 1995-11-08
GB2289170B GB2289170B (en) 1998-06-24

Family

ID=14716075

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9508857A Expired - Fee Related GB2289170B (en) 1994-05-06 1995-05-01 Circuit board

Country Status (5)

Country Link
JP (1) JP3365048B2 (en)
KR (1) KR950035538A (en)
CN (1) CN1080082C (en)
GB (1) GB2289170B (en)
TW (1) TW423265B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3400634B2 (en) 1996-02-28 2003-04-28 富士通株式会社 Method of modifying wiring pattern of printed circuit board and method of cutting wiring pattern of printed circuit board
CN100531514C (en) * 2004-07-12 2009-08-19 鸿富锦精密工业（深圳）有限公司 Short-proof printed circuit board structure
JP2006041409A (en) * 2004-07-30 2006-02-09 Toshiba Corp Wiring board and magnetic disc device
US7312403B2 (en) * 2004-09-24 2007-12-25 Matsushita Electric Industrial Co., Ltd. Circuit component mounting device
CA2938004A1 (en) * 2014-01-31 2015-08-06 Trub Emulsions Chemie AG Aqueous primer coating for use in a digital printing process
JP2016207952A (en) 2015-04-28 2016-12-08 富士通株式会社 Component built-in substrate

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1062928A (en) * 1964-09-15 1967-03-22 Standard Telephones Cables Ltd Multi-wafer integrated circuits
US4777564A (en) * 1986-10-16 1988-10-11 Motorola, Inc. Leadform for use with surface mounted components
JPH01251788A (en) * 1988-03-31 1989-10-06 Canon Inc Printed board
US5227589A (en) * 1991-12-23 1993-07-13 Motorola, Inc. Plated-through interconnect solder thief
EP0578880A1 (en) * 1992-07-14 1994-01-19 General Electric Company Plated D-shell connector

Also Published As

Publication number Publication date
JPH07302970A (en) 1995-11-14
CN1113069A (en) 1995-12-06
JP3365048B2 (en) 2003-01-08
GB2289170B (en) 1998-06-24
CN1080082C (en) 2002-02-27
TW423265B (en) 2001-02-21
KR950035538A (en) 1995-12-30
GB2289170A (en) 1995-11-08

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20020501