JPH07106744A - ４方向リードフラットパッケージｉｃの半田ディップ用ランド及び半田ディップ半田付方法 - Google Patents

４方向リードフラットパッケージｉｃの半田ディップ用ランド及び半田ディップ半田付方法

Info

Publication number
JPH07106744A
JPH07106744A JP5245455A JP24545593A JPH07106744A JP H07106744 A JPH07106744 A JP H07106744A JP 5245455 A JP5245455 A JP 5245455A JP 24545593 A JP24545593 A JP 24545593A JP H07106744 A JPH07106744 A JP H07106744A
Authority
JP
Japan
Prior art keywords
soldering
land
solder
lands
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5245455A
Other languages
English (en)
Japanese (ja)
Inventor
Genichi Tanaka
元一 田中
Suguru Tan
英 丹
Misako Hatake
美佐子 畠
Takako Tomomoto
貴子 友本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP5245455A priority Critical patent/JPH07106744A/ja
Priority to TW083107914A priority patent/TW288191B/zh
Priority to KR1019940024720A priority patent/KR950010717A/ko
Publication of JPH07106744A publication Critical patent/JPH07106744A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP5245455A 1993-09-30 1993-09-30 ４方向リードフラットパッケージｉｃの半田ディップ用ランド及び半田ディップ半田付方法 Pending JPH07106744A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP5245455A JPH07106744A (ja) 1993-09-30 1993-09-30 ４方向リードフラットパッケージｉｃの半田ディップ用ランド及び半田ディップ半田付方法
TW083107914A TW288191B (enExample) 1993-09-30 1994-08-29
KR1019940024720A KR950010717A (ko) 1993-09-30 1994-09-29 4방향 리드 플랫 패키지 ic의 땜납 딥용 랜드 및 땜납 딥 납땜 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5245455A JPH07106744A (ja) 1993-09-30 1993-09-30 ４方向リードフラットパッケージｉｃの半田ディップ用ランド及び半田ディップ半田付方法

Publications (1)

Publication Number Publication Date
JPH07106744A true JPH07106744A (ja) 1995-04-21

Family

ID=17133921

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5245455A Pending JPH07106744A (ja) 1993-09-30 1993-09-30 ４方向リードフラットパッケージｉｃの半田ディップ用ランド及び半田ディップ半田付方法

Country Status (3)

Country Link
JP (1) JPH07106744A (enExample)
KR (1) KR950010717A (enExample)
TW (1) TW288191B (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100330580B1 (ko) * 1999-08-30 2002-03-29 윤종용 ４방향 플랫 패키지ｉｃ 실장용 회로기판 및 그 땜납도포방법
KR100330579B1 (ko) * 1999-08-30 2002-03-29 윤종용 ４방향 플랫 패키지ｉｃ 실장용 회로기판 및 그 땜납도포방법
JP2002158432A (ja) * 2000-11-17 2002-05-31 Matsushita Electric Ind Co Ltd 鉛フリー半田付け装置
US7414301B2 (en) 2004-04-16 2008-08-19 Funai Electric Co., Ltd. Printed circuit board with soldering lands

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100330580B1 (ko) * 1999-08-30 2002-03-29 윤종용 ４방향 플랫 패키지ｉｃ 실장용 회로기판 및 그 땜납도포방법
KR100330579B1 (ko) * 1999-08-30 2002-03-29 윤종용 ４방향 플랫 패키지ｉｃ 실장용 회로기판 및 그 땜납도포방법
JP2002158432A (ja) * 2000-11-17 2002-05-31 Matsushita Electric Ind Co Ltd 鉛フリー半田付け装置
US7414301B2 (en) 2004-04-16 2008-08-19 Funai Electric Co., Ltd. Printed circuit board with soldering lands

Also Published As

Publication number Publication date
KR950010717A (ko) 1995-04-28
TW288191B (enExample) 1996-10-11

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